公开(公告)号：US08916812B2

公开(公告)日：2014-12-23

申请号：US13424753

申请日：2012-03-20

Applicant: Fei Yu ,  Tongxin Zeng ,  Junying Zhao ,  Yuan Zhang

Inventor： Fei Yu ,  Tongxin Zeng ,  Junying Zhao ,  Yuan Zhang

IPC: G02B6/36 ,  G02B6/42 ,  G02B6/38

CPC classification number: G02B6/4292 ,  G02B6/3885 ,  G02B6/421 ,  G02B6/4246 ,  G02B6/4249

Abstract: Embodiments of the present invention provide an optical module, including an MT-Ferrule and a photoelectric conversion unit. The MT-Ferrule is configured to connect multiple channels of optical channels outside the optical module with multiple channels of optical channels of the photoelectric conversion unit, and implement coupling and transmission of multiple channels of single-mode optical signals between the two. The photoelectric conversion unit is configured to convert multiple channels of single-mode optical signals input from the MT-Ferrule into multiple channels of electrical signals and output the multiple channels of electrical signals, and generate, driven by multiple channels of input electrical signals, multiple channels of single-mode optical signals and output the multiple channels of single-mode optical signals to the MT-Ferrule.

Abstract translation: 本发明的实施例提供一种包括MT-套圈和光电转换单元的光学模块。 MT-Ferrule被配置为将光模块外的多个光通道与光电转换单元的多通道光通道连接起来，并在两者之间实现多通道单模光信号的耦合和传输。 光电转换单元被配置为将从MT-Ferrule输入的多通道单模光信号转换成多个电信号通道并输出多个通道的电信号，并且由多个通道的输入电信号驱动多个 通道的单模光信号，并将多通道的单模光信号输出到MT-Ferrule。

公开(公告)号：US08580698B2

公开(公告)日：2013-11-12

申请号：US12760297

申请日：2010-04-14

Applicant: Wei-Yang Lee ,  Xiong-Fei Yu ,  Jian-Hao Chen ,  Cheng-Hao Hou ,  Da-Yuan Lee ,  Kuang-Yuan Hsu

Inventor： Wei-Yang Lee ,  Xiong-Fei Yu ,  Jian-Hao Chen ,  Cheng-Hao Hou ,  Da-Yuan Lee ,  Kuang-Yuan Hsu

IPC: H01L21/31

CPC classification number: H01L29/517 ,  H01L21/02181 ,  H01L21/0228 ,  H01L21/02323 ,  H01L21/02337 ,  H01L21/0234 ,  H01L21/28194 ,  H01L29/495 ,  H01L29/4966 ,  H01L29/513 ,  H01L29/66545 ,  H01L29/6659

Abstract: A method for fabricating the gate dielectric layer comprises forming a high-k dielectric layer over a substrate; forming an oxygen-containing layer on the high-k dielectric layer by an atomic layer deposition process; and performing an inert plasma treatment on the oxygen-containing layer.

Abstract translation: 一种用于制造栅极电介质层的方法包括在衬底上形成高k电介质层; 通过原子层沉积工艺在高k电介质层上形成含氧层; 对含氧层进行惰性等离子体处理。

公开(公告)号：US08546885B2

公开(公告)日：2013-10-01

申请号：US13189732

申请日：2011-07-25

Applicant: Cheng-Hao Hou ,  Peng-Soon Lim ,  Da-Yuan Lee ,  Xiong-Fei Yu ,  Chun-Yuan Chou ,  Fan-Yi Hsu ,  Jian-Hao Chen ,  Kuang-Yuan Hsu

Inventor： Cheng-Hao Hou ,  Peng-Soon Lim ,  Da-Yuan Lee ,  Xiong-Fei Yu ,  Chun-Yuan Chou ,  Fan-Yi Hsu ,  Jian-Hao Chen ,  Kuang-Yuan Hsu

IPC: H01L23/48 ,  H01L21/28

CPC classification number: H01L21/28026 ,  H01L21/28088 ,  H01L29/401 ,  H01L29/4966 ,  H01L29/51 ,  H01L29/66477 ,  H01L29/66545 ,  H01L29/78 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An integrated circuit fabrication is disclosed, and more particularly a field effect transistor with a low resistance metal gate electrode is disclosed. An exemplary structure for a metal gate electrode of a field effect transistor comprises a lower portion formed of a first metal material, wherein the lower portion has a recess, a bottom portion and sidewall portions, wherein each of the sidewall portions has a first width; and an upper portion formed of a second metal material, wherein the upper portion has a protrusion and a bulk portion, wherein the bulk portion has a second width, wherein the protrusion extends into the recess, wherein a ratio of the second width to the first width is from about 5 to 10.

Abstract translation: 公开了集成电路制造，更具体地说，公开了具有低电阻金属栅电极的场效应晶体管。 场效应晶体管的金属栅电极的示例性结构包括由第一金属材料形成的下部，其中下部具有凹部，底部和侧壁部分，其中每个侧壁部分具有第一宽度; 以及由第二金属材料形成的上部，其中所述上部具有突起和主体部分，其中所述主体部分具有第二宽度，其中所述突起延伸到所述凹部中，其中所述第二宽度与所述第一宽度的比率 宽度为约5至10。

公开(公告)号：US20130186676A1

公开(公告)日：2013-07-25

申请号：US13355128

申请日：2012-01-20

Applicant: Fei Yu ,  Anwar A. Mohammed ,  Rui Niu

Inventor： Fei Yu ,  Anwar A. Mohammed ,  Rui Niu

IPC: H05K1/09 ,  H05K1/00 ,  H05K1/16 ,  H05K3/46 ,  H05K3/00

CPC classification number: H05K1/186 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/036 ,  H05K3/3436 ,  H05K3/4007 ,  H05K2201/09118 ,  Y10T29/49124 ,  H01L2924/00

Abstract: A structure for a core layer of a substrate and a method for fabricating a core layer of a substrate are disclosed. The core layer comprises a molding compound encapsulating a die or a plurality of dies, a dielectric layer on the surfaces of the molding compound, and a conductive layer on top of the dielectric layer. A through hole is formed through the dielectric layer and the molding compound, which may be filled with a metal plate. A laser via is formed similarly. Build-up layers may be assembled next to the core layer to form the substrate, which can be used to package dies.

Abstract translation: 公开了一种用于基板的芯层的结构和用于制造基板的芯层的方法。 芯层包括封装模具或多个模具的模制化合物，在模塑料的表面上的电介质层和在电介质层的顶部上的导电层。 通过电介质层和可以填充有金属板的模塑料形成通孔。 类似地形成激光通孔。 堆积层可以在芯层附近组装以形成可用于封装管芯的衬底。

公开(公告)号：US08334197B2

公开(公告)日：2012-12-18

申请号：US12639630

申请日：2009-12-16

Applicant: Da-Yuan Lee ,  Kuang-Yuan Hsu ,  Xiong-Fei Yu ,  Wei-Yang Lee ,  Matt Yeh

Inventor： Da-Yuan Lee ,  Kuang-Yuan Hsu ,  Xiong-Fei Yu ,  Wei-Yang Lee ,  Matt Yeh

IPC: H01L21/4763

CPC classification number: H01L21/28185 ,  H01L21/28088 ,  H01L21/28194 ,  H01L29/4966 ,  H01L29/517 ,  H01L29/66545

Abstract: The present disclosure provides a method that includes providing a semiconductor substrate; forming a gate structure over the semiconductor substrate, first gate structure including a dummy dielectric and a dummy gate disposed over the dummy dielectric; removing the dummy gate and the dummy dielectric from the gate structure thereby forming a trench; forming a high-k dielectric layer partially filling the trench; forming a barrier layer over the high-k dielectric layer partially filling the trench; forming an capping layer over the barrier layer partially filling the trench; performing an annealing process; removing the capping layer; forming a metal layer over the barrier layer filling in a remainder of the trench; and performing a chemical mechanical polishing (CMP) to remove the various layers outside the trench.

Abstract translation: 本公开提供了一种方法，其包括提供半导体衬底; 在所述半导体衬底上形成栅极结构，所述第一栅极结构包括设置在所述虚拟电介质上的虚设电介质和虚设栅极; 从栅极结构去除伪栅极和虚设电介质，从而形成沟槽; 形成部分填充沟槽的高k电介质层; 在部分填充沟槽的高k电介质层上形成阻挡层; 在所述阻挡层上形成部分填充所述沟槽的覆盖层; 进行退火处理; 去除覆盖层; 在所述阻挡层上形成填充在所述沟槽的其余部分中的金属层; 并进行化学机械抛光（CMP）以去除沟槽外的各种层。

公开(公告)号：US20120252276A1

公开(公告)日：2012-10-04

申请号：US13437008

申请日：2012-04-02

Applicant: FANG-YUE ZHU ,  JIAN-FEI YU ,  QI-JUN ZHAO

Inventor： FANG-YUE ZHU ,  JIAN-FEI YU ,  QI-JUN ZHAO

IPC: H01R24/60

CPC classification number: H01R12/721 ,  H01R12/716 ,  H01R13/2457

Abstract: An electrical card connector comprises an insulative housing having an inserting slot for receiving a first card and a second card, and a plurality of contacts retained in the housing respectively and including a plurality of first contacts for engaging with the first card, and a plurality of second contacts cooperating with the first contacts for engaging with the second card. The first contacts and the second contacts have retaining portions fixed with the housing, contact portions protruding into the inserting slot from the retaining portions, and soldering portions extending beyond the housing from the retaining portions. The contact portions of the first contacts and the contact portions of the second contacts are positioned at different position along a front-to-back direction. At least one of the first contacts and one of the second contacts share a same soldering tail.

Abstract translation: 电卡连接器包括绝缘壳体，其具有用于接收第一卡和第二卡的插入槽和分别保持在壳体中的多个触点，并且包括用于与第一卡接合的多个第一触点，以及多个 第二触点与第一触点配合以与第二卡接合。 第一触点和第二触点具有固定在壳体上的保持部分，从保持部分突出到插入槽中的接触部分以及从保持部分延伸超过壳体的焊接部分。 第一触点的接触部分和第二触点的接触部分沿着前后方向位于不同的位置。 第一触点中的至少一个和第二触点之一共享相同的焊尾。

公开(公告)号：US20120184147A1

公开(公告)日：2012-07-19

申请号：US13349585

申请日：2012-01-13

Applicant: JIAN-FEI YU ,  QI-JUN ZHAO

Inventor： JIAN-FEI YU ,  QI-JUN ZHAO

IPC: H01R24/00

CPC classification number: H01R12/716 ,  H01R12/721

Abstract: A card connector (100) includes an insulative housing (1) and a number of conductive contacts (2) retained in the insulative housing (1). Each conductive contact (2) has a retaining portion (21) and a contacting portion (25) located in front of the retaining portion (21). The insulative housing (1) has a protrusion (131) extending upwardly. The retaining portion (21) has a confronting portion (26) engaging with the protrusion (131). Each contact (2) also has a soldering portion (24) extending from a rear end of the retaining portion (21), the soldering portion (24) is located under the retaining portion (21). The insulative housing (1) is sandwiched between the retaining portion (21) and the soldering portion (24) along a top to bottom direction. Therefore, the size of the card connector (100) is reduced.

Abstract translation: 卡连接器（100）包括绝缘壳体（1）和保持在绝缘壳体（1）中的多个导电触头（2）。 每个导电触头（2）具有保持部分（21）和位于保持部分（21）前面的接触部分（25）。 绝缘壳体（1）具有向上延伸的突起（131）。 保持部分（21）具有与凸起（131）接合的面对部分（26）。 每个触点（2）还具有从保持部分（21）的后端延伸的焊接部分（24），焊接部分（24）位于保持部分（21）的下方。 绝缘壳体（1）沿上下方向夹在保持部分（21）和焊接部分（24）之间。 因此，卡连接器（100）的尺寸减小。

公开(公告)号：US08131876B2

公开(公告)日：2012-03-06

申请号：US12310828

申请日：2007-09-12

Applicant: Jin Fei Yu ,  Junbiao Zhang ,  Zhi Gang Zhang ,  Heinrich Schemmann

Inventor： Jin Fei Yu ,  Junbiao Zhang ,  Zhi Gang Zhang ,  Heinrich Schemmann

IPC: G06F15/16

CPC classification number: H04L12/6418 ,  H04L5/143 ,  H04L27/0002

Abstract: The present invention relates a bidirectional signal transmission apparatus and method, wherein said apparatus comprises a processor unit connected in signal communication with an Ethernet, an RF modulation/demodulation unit, and an RF frequency conversion unit connected in signal communication with a coaxial cable network. The data signal input from the Ethernet is modulated into standard IEEE802.11 signal by means of said signal processing unit and RF modulation/demodulation unit, and then down-converted from 2.4 GHz or 5.8 GHz standard IEEE802.11 signal to a range of 500 MHz to 2000 MHz, and preferably to a range of 900 MHz to 1200 MHz. The bidirectional transmission apparatus further includes a frequency band selector for selecting different frequency bands so as to broaden the bandwidth of the signal and a real broad band data transmission is accomplished.

Abstract translation: 本发明涉及一种双向信号传输装置和方法，其中所述装置包括与以太网进行信号通信连接的处理器单元，RF调制/解调单元和与同轴电缆网络进行信号通信连接的RF频率转换单元。 从以太网输入的数据信号通过所述信号处理单元和RF调制/解调单元被调制成标准IEEE802.11信号，然后从2.4GHz或5.8GHz标准IEEE802.11信号下变频到500 MHz至2000MHz，优选为900MHz至1200MHz的范围。 双向发送装置还包括用于选择不同频带的频带选择器，以便扩大信号的带宽，并实现实际的宽带数据传输。

公开(公告)号：US08122945B2

公开(公告)日：2012-02-28

申请号：US12248006

申请日：2008-10-08

Applicant: Jer-Haur Kuo ,  Xin-Xiang Zha ,  Ye-Fei Yu ,  Lin Yang ,  Fang-Xiang Yu

Inventor： Jer-Haur Kuo ,  Xin-Xiang Zha ,  Ye-Fei Yu ,  Lin Yang ,  Fang-Xiang Yu

IPC: F28F7/00 ,  H05K7/20 ,  F16B15/00

CPC classification number: H01L23/4006 ,  H01L23/427 ,  H01L23/467 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2924/0002 ,  Y10S411/999 ,  H01L2924/00

Abstract: A securing device includes a securing member defining a securing hole therein, and a fastener extending through the securing hole. The fastener includes a spring, and a bolt having a main portion, a bottom fixing portion, and a top head portion. The securing hole includes a large portion, a small portion, and a concave around the small portion. A diameter of the small portion is greater than the main portion and smaller than the fixing portion. A diameter of the large portion is greater than the fixing portion and smaller than the spring. The main portion extends through the small portion with the fixing portion tightly abutting the securing member. The spring is mounted around the main portion and received in the concave. The spring is compressed between the head portion and a step of the securing member in the concave.

Abstract translation: 固定装置包括在其中限定固定孔的固定构件和延伸穿过固定孔的紧固件。 紧固件包括弹簧和具有主要部分，底部固定部分和顶部头部的螺栓。 固定孔包括大部分，小部分和围绕小部分的凹部。 小部分的直径大于主要部分并小于固定部分。 大部分的直径大于固定部分并且小于弹簧。 主要部分延伸穿过小部分，固定部分紧紧地紧靠着固定构件。 弹簧安装在主体部分周围并被接收在凹部中。 弹簧被压缩在头部和固定构件在凹部中的台阶之间。

公开(公告)号：US08050035B2

公开(公告)日：2011-11-01

申请号：US12409499

申请日：2009-03-24

Applicant: Ye-Fei Yu ,  Shu-Yuan Xu ,  Xin-Xiang Zha ,  Lin Yang ,  Jun Ding ,  Jer-Haur Kuo

Inventor： Ye-Fei Yu ,  Shu-Yuan Xu ,  Xin-Xiang Zha ,  Lin Yang ,  Jun Ding ,  Jer-Haur Kuo

IPC: H05K7/20

CPC classification number: H01L23/467 ,  F28F3/02 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat dissipation device includes a heat sink and a cooling fan arranged thereon. The cooling fan includes a motor-stator and an impeller mounted around the motor-stator. The motor-stator is arranged on a middle of the heat sink. The heat sink includes a base and a plurality of fins extending upwardly from the base. The heat sink defines a plurality of notches incising the fins. The notches are angled towards the middle of the heat sink immediately under the motor-stator of the cooling fan.

Abstract translation: 散热装置包括散热器和布置在其上的冷却风扇。 冷却风扇包括电机定子和安装在电机定子周围的叶轮。 电动机定子布置在散热器的中间。 散热器包括基部和从基部向上延伸的多个翅片。 散热器限定切割翅片的多个凹口。 凹槽在冷却风扇的电动机定子正下方朝向散热器的中间倾斜。