公开(公告)号：US4632900A

公开(公告)日：1986-12-30

申请号：US708998

申请日：1985-03-07

Applicant: Christopher G. Demmer ,  Edward Irving ,  Ewald Losert

Inventor： Christopher G. Demmer ,  Edward Irving ,  Ewald Losert

IPC: C09D5/44 ,  G03C1/72 ,  G03C5/00 ,  G03F7/00 ,  G03F7/004 ,  G03F7/022 ,  G03F7/023 ,  G03F7/039 ,  G03F7/16 ,  G03F7/26 ,  H01L21/027 ,  H01L21/30 ,  H05K3/06 ,  H05K3/44

CPC classification number: G03F7/004 ,  G03F7/023 ,  G03F7/164 ,  H05K3/064 ,  H05K2203/0505 ,  H05K2203/135 ,  Y10S430/138

Abstract: A positive photoresist is electrodeposited onto a substrate, exposed to actinic radiation in a predetermined pattern, and then exposed areas are removed by contact with a developer.When the substrate is a metal-faced laminate, the exposed metal surface may be etched and the residual electrodeposited layer removed by contact with a suitable solvent, optionally after a second, general, exposure to actinic radiation.Suitable electrodepositable positive photoresists include o-nitrocarbinol esters and o-nitrophenyl acetals, their polyesters and end-capped derivatives and quinone diazide sulphonyl esters of phenolic novolaks, having salt-forming groups in the molecule, especially carboxylic acid and amine groups.The process is suitable for the production of printing plates and printed circuits, especially circuits on both sides of a liminate sheet linked conductively through metal-lined holes in the sheet.

Abstract translation: 将正性光致抗蚀剂电沉积到基底上，以预定图案暴露于光化辐射，然后通过与显影剂接触除去暴露的区域。 当基底是金属层压板时，暴露的金属表面可以被蚀刻，并且残留的电沉积层通过与合适的溶剂接触去除，任选地在第二次通用的光化辐射之后。 合适的可电沉积的正性光致抗蚀剂包括邻硝基甲醇酯和邻硝基苯基缩醛，它们的聚酯和封端的衍生物和酚醛清漆的醌二叠氮磺酸酯，在分子中具有成盐基团，特别是羧酸和胺基团。 该方法适用于生产印版和印刷电路，特别是在片材两侧通过金属衬里的孔导电地连接的电路。

公开(公告)号：US4413052A

公开(公告)日：1983-11-01

申请号：US361701

申请日：1982-03-25

Applicant: George E. Green ,  Ewald Losert ,  John G. Paul

Inventor： George E. Green ,  Ewald Losert ,  John G. Paul

IPC: G03F7/26 ,  C08F20/00 ,  C08F20/10 ,  C08F20/22 ,  C08F20/34 ,  C08F20/52 ,  C08F34/00 ,  C08F34/02 ,  G03F7/027 ,  G03F7/038 ,  G03F7/20 ,  G03F7/38 ,  G03C5/00

CPC classification number: G03F7/027 ,  G03F7/2022

Abstract: In a three stage process, a layer of a liquid composition containing a compound (A) having in the same molecule both at least one (meth)acryloyl group and at least one anthryl group is exposed to actinic radiation so that the layer solidifies due to photopolymerization of (A) through the (meth)acryloyl group(s), remaining, however, further photocrosslinkable. When desired, the solidified layer is exposed, as through a negative, to a substantially greater amount of actinic radiation, the parts so further exposed becoming more highly photocrosslinked through the anthryl group(s) and hence insoluble. An image is produced which can be developed by means of suitable solvents. Examples of (A) include 3-(acryloyloxy)-2-hydroxypropyl anthracene-9-carboxylate and its methacryloyl homologue.

Abstract translation: 在三阶段工艺中，含有在相同分子中至少一个（甲基）丙烯酰基和至少一个蒽基的化合物（A）的液体组合物层暴露于光化辐射，使得该层由于 （A）通过（甲基）丙烯酰基进行光聚合，然后进一步进行光致交联。 当需要时，固化层通过负极暴露于大量的光化辐射，所以如此进一步暴露的部分变得更加高度光链接穿过蒽基，因此是不溶的。 产生可以通过合适的溶剂开发的图像。 （A）的实例包括3-（丙烯酰氧基）-2-羟丙基蒽-9-羧酸酯及其甲基丙烯酰基同系物。

公开(公告)号：US06321443B1

公开(公告)日：2001-11-27

申请号：US08973924

申请日：1998-05-13

Applicant: Hans-Jürg Barte ,  Ewald Losert ,  Heinrich Meyer ,  Günter Röhrs ,  Frank Rudolf ,  Wolfgang Scheel ,  Walter Schmidt ,  Theis Zur Nieden

Inventor： Hans-Jürg Barte ,  Ewald Losert ,  Heinrich Meyer ,  Günter Röhrs ,  Frank Rudolf ,  Wolfgang Scheel ,  Walter Schmidt ,  Theis Zur Nieden

IPC: H05K320

CPC classification number: H05K3/284 ,  H01L23/50 ,  H01L23/5385 ,  H01L25/065 ,  H01L25/162 ,  H01L2224/16225 ,  H05K1/0203 ,  H05K1/189 ,  H05K3/0058 ,  H05K2201/0209 ,  H05K2201/042 ,  H05K2201/046 ,  H05K2201/2009 ,  H05K2203/1316 ,  Y10S428/901 ,  Y10T29/49128 ,  Y10T29/49155

Abstract: The method for the manufacture of multilayer connecting substrates with multiple functions comprises the design of the connecting substrate taking place in functionally separated manner, in that signal conducting substrate parts (19), power supplying substrate parts (2), mechanical substrate parts (7), as well as the arrangement of components (4) or component-carrying substrate parts is separately planned and optimized as independent functions or modules and finally associated with spatially separated functional areas (inner/outer) of the overall circuit, the design taking place by the connection of the modules to an overall circuit embodying the connecting substrate. The resulting multilayer circuit with conductor network (19, 2), components (4) and mechanical stiffening elements (7) has the following structure. The substrate parts with the fine, dense and flexible elements are associated with the inner areas of the overall circuit, the substrate parts with the rigid elements and/or components are associated with the outer areas of the overall circuit and a stiffening support material is so placed in the outer area that the circuit is given a mechanical support structure, which is designed in locally rigid manner passing into flexible areas. The overall circuit is folded and/or wound corresponding to the rigid and flexible portions. The mechanical support structure can be formed by separately produced apparatus housing parts or by the apparatus housing.

Abstract translation: 用于制造具有多种功能的多层连接基板的方法包括以功能分离的方式进行的连接基板的设计，信号传导基板部件（19），供电基板部件（2），机械基板部件（7） 以及部件（4）或部件承载基板部件的布置被单独计划和优化为独立的功能或模块，并最终与整个电路的空间分离的功能区域（内部/外部）相关联，设计发生在 模块连接到体现连接基板的整个电路。 所得到的具有导体网络（19,2），部件（4）和机械加强元件（7）的多层电路具有以下结构。 具有精细，致密和柔性的元件的基板部件与整个电路的内部区域相关联，具有刚性元件和/或部件的基板部件与整个电路的外部区域相关联，并且加强支撑材料是如此 放置在外部区域，电路被给予机械支撑结构，其以局部刚性的方式被设计成通过柔性区域。 整个电路根据刚性和柔性部分折叠和/或缠绕。 机械支撑结构可以通过单独制造的装置壳体部件或装置壳体形成。

公开(公告)号：US4544623A

公开(公告)日：1985-10-01

申请号：US573098

申请日：1984-01-23

Applicant: Thaddeus Audykowski ,  Anton Mentha ,  Ewald Losert

Inventor： Thaddeus Audykowski ,  Anton Mentha ,  Ewald Losert

IPC: G03F7/16 ,  B23K35/22 ,  C09D163/00 ,  G03C1/74 ,  G03F7/00 ,  G03F7/038 ,  G03F7/11 ,  G03F7/115 ,  H05K3/28 ,  G03C1/68 ,  G03C5/16

CPC classification number: H05K3/287 ,  B23K35/224 ,  C09D163/00 ,  G03F7/0012 ,  G03F7/0385 ,  H05K2203/1105 ,  Y10S430/136

Abstract: Uniform protective coatings, particularly solder resist masks, on printed circuit boards can be produced with coating compositions having a viscosity of 200 to 700 m Pas at 25.degree. C. and comprising a solution of a photosensitive, thermally curable, lacquer-forming substance, wherein there is additionally uniformly dispersed 5 to 50% by weight of a finely divided filler.

Abstract translation: 可以在印刷电路板上制备均匀的保护涂层，特别是阻焊掩模，其中涂料组合物在25℃下具有200-700mPa·s的粘度，并且包括感光的，可热固化的，成漆物质的溶液，其中 另外还可以均匀分散5〜50重量％的细分散填料。

公开(公告)号：US4416975A

公开(公告)日：1983-11-22

申请号：US361702

申请日：1982-03-25

Applicant: George E. Green ,  Ewald Losert ,  John G. Paul ,  Hans Zweifel

Inventor： George E. Green ,  Ewald Losert ,  John G. Paul ,  Hans Zweifel

IPC: G03F7/26 ,  C08F20/00 ,  C08F20/52 ,  G03F7/027 ,  G03F7/038 ,  G03F7/38 ,  G03C5/00

CPC classification number: G03F7/027

Abstract: In a three stage process, a layer of a liquid composition containing a compound (A) having in the same molecule at least one (meth)acryloyl group and at least one 2,3-disubstituted maleimido group is exposed to actinic radiation so that the layer solidifies due to photopolymerization of (A) through the (meth)acryloyl group(s), remaining, however, further photocrosslinkable. When desired, the solidified layer is exposed, as through a negative, to a substantially greater amount of actinic radiation, the parts so further exposed becoming more highly photocrosslinked through the disubstituted maleimido group(s) and hence insoluble. An image is produced which can be developed by means of suitable solvents. Examples of (A) include N-(2-(acryloyloxy)ethyl)-2,3-dimethylmaleimide and N-(3-(methacryloyloxy)-2-hydroxypropyl)-2,3-dimethylmaleimide.

Abstract translation: 在三步法中，含有在同一分子中具有至少一个（甲基）丙烯酰基和至少一个2,3-二取代马来酰亚胺基的化合物（A）的液体组合物层暴露于光化辐射，使得 由于（A）通过（甲基）丙烯酰基的光聚合，层固化，然而，进一步可光致交联。 如果需要，固化层通过负极暴露于大量的光化辐射，所以如此进一步暴露的部分变得更高度地通过二取代的马来酰亚胺基进行光交联并因此是不溶的。 产生可以通过合适的溶剂开发的图像。 （A）的实例包括N-（2-（丙烯酰氧基）乙基）-2,3-二甲基马来酰亚胺和N-（3-（甲基丙烯酰氧基）-2-羟丙基）-2,3-二甲基马来酰亚胺。

公开(公告)号：US3956043A

公开(公告)日：1976-05-11

申请号：US389910

申请日：1973-08-20

Applicant: Abdul-Cader Zahir ,  Heinz Remabold ,  Ewald Losert

Inventor： Abdul-Cader Zahir ,  Heinz Remabold ,  Ewald Losert

IPC: H05K3/06 ,  B32B15/08 ,  G03F7/038 ,  G03F7/40 ,  H05K3/00 ,  H05K3/46 ,  G03C1/68

CPC classification number: G03F7/0385 ,  G03F7/40 ,  H05K3/4626 ,  H05K2201/0195 ,  H05K2203/0571 ,  H05K3/0023 ,  H05K3/064 ,  Y10S522/904

Abstract: A process for the manufacture of printed multilayer circuits by coating carrier films, which possess metal layers, with a light-sensitive material containing a compound with epoxide groups and with groups which can be cured by electromagnetic rays, by exposing the light-sensitive material through a transparent film which shows the negative image of the conductor traces to be produced, by developing with an organic solvent, by etching the metal layer and pressing the laminates together to form a multi-layer circuit. The parts of the light-sensitive layer which have been pre-cured by exposure to light are subjected to a thermal after-treatment using a curing agent for epoxide groups, whereby these parts are post-cured. These parts are not removed from the carriers films.

Abstract translation: 一种制造印刷多层电路的方法，该方法是通过将具有金属层的载体膜与含有环氧基团化合物的光敏材料和可通过电磁辐射固化的基团一起涂布，使感光材料通过 通过用有机溶剂显影，通过蚀刻金属层并将层压体压在一起以形成多层电路的透明膜，其显示要产生的导体迹线的负像。 通过曝光预固化的感光层的部分，使用环氧基团的固化剂进行热处理，由此这些部分后固化。 这些部件不从载体薄膜中去除。

公开(公告)号：US4502957A

公开(公告)日：1985-03-05

申请号：US441334

申请日：1982-11-15

Applicant: Nikolaus Jehle ,  Markus Th/u/ er ,  Ewald Losert

Inventor： Nikolaus Jehle ,  Markus Th/u/ er ,  Ewald Losert

IPC: B01D15/00 ,  C08F6/12 ,  C08G85/00 ,  C08J11/02

CPC classification number: C08F6/12 ,  B01D15/00 ,  C08G85/002 ,  C08J11/02

Abstract: Polymers and, where present, conventional additives, are removed from organic solutions with activated carbon.

Abstract translation: 使用活性炭从有机溶液中除去聚合物和存在的常规添加剂。

公开(公告)号：US4440850A

公开(公告)日：1984-04-03

申请号：US397373

申请日：1982-07-12

Applicant: John G. Paul ,  Bernard P. Stark ,  Ewald Losert

Inventor： John G. Paul ,  Bernard P. Stark ,  Ewald Losert

IPC: G03F7/26 ,  C07D207/44 ,  C07D207/452 ,  C07D209/78 ,  C07D493/08 ,  C08F32/00 ,  G03F7/027 ,  G03F7/038 ,  G03F7/38 ,  G03C5/00

CPC classification number: C07D207/452 ,  C07D209/78 ,  C07D493/08 ,  G03F7/027

Abstract: A layer of a liquid composition containing a compound (A) having in the same molecule at least one (meth)acryloyl group and at least one bicyclo[2.2.1]hept-2-ene-6-yl unit is exposed to actinic radiation so that the layer solidifies due to photopolymerisation of (A) through the (meth)acryloyl group(s), remaining, however, photocrosslinkable. When desired, the solidified layer is exposed, as through a negative, to a substantially greater amount of actinic radiation, the parts so further exposed becoming more highly photocrosslinked through the bicyclo[2.2.1]hept-2-ene-6-yl unit(s) and hence insoluble. An image is produced which can be developed by means of suitable solvents. Examples of (A) include 3-(methacryloyloxy)-2-hydroxypropyl bicyclo[2.2.1]hept-2-ene-6-carboxylate and 2-(acryloyloxy)ethyl methyl-5-carboxybicyclo[2.2.1]hept-2-ene-6-carboxylate.

Abstract translation: 含有在同一分子中具有至少一个（甲基）丙烯酰基和至少一个双环[2.2.1]庚-2-烯-6-基单元的化合物（A）的液体组合物层暴露于光化辐射 使得由于（A）通过（甲基）丙烯酰基的光聚合而使层固化，然而，仍然可光致交联。 当需要时，固化层通过负极暴露于大量的光化辐射，使得如此进一步暴露的部分变得更高度光交联通过双环[2.2.1]庚-2-烯-6-基单元 因此不溶解。 产生可以通过合适的溶剂开发的图像。 （A）的实例包括3-（甲基丙烯酰氧基）-2-羟丙基双环[2.2.1]庚-2-烯-6-羧酸酯和2-（丙烯酰氧基）乙基甲基-5-羧基双环[2.2.1]庚-2 烯-6-羧酸酯。

公开(公告)号：US4230793A

公开(公告)日：1980-10-28

申请号：US960971

申请日：1978-11-15

Applicant: Ewald Losert ,  Heinz Rembold

Inventor： Ewald Losert ,  Heinz Rembold

IPC: H05K3/28 ,  B05C5/00 ,  B23K35/22 ,  G03C1/74 ,  G03F7/16 ,  H05K3/00 ,  G03C5/00

CPC classification number: B23K35/224 ,  B05C5/004 ,  B05C5/005 ,  G03F7/16 ,  H05K3/0091 ,  H05K2203/1509 ,  H05K2203/159 ,  H05K3/0023 ,  H05K3/28 ,  Y10S430/136

Abstract: A process for producing solder masks on double sided printed circuit boards, comprising conveying the boards beneath a free falling curtain of a pohotopolymer to form a thin layer on a surface of the board, irradiating with ultra violet light areas of the surface other than those that need to be soldered and then, by subsequent development, dissolving the unirradiated areas of the layer. The viscosity of the photopolymer is between 500 to 1200 mPa's at impingement on the surface of the circuit and the height of the curtain is selected so that the rate of flow of the polymer onto the circuit is between 60 to 160 m/min. Also the rate at which the circuits are conveyed beneath the curtain is greater than a rate slightly less than the rate at which the polymer flows onto the circuit.

Abstract translation: 一种用于在双面印刷电路板上制造焊接掩模的方法，包括在光聚合物的自由落下的窗帘之下输送板，以在板的表面上形成薄层，照射表面的紫外光区域， 需要焊接，然后通过随后的发展，溶解层的未照射区域。 光聚合物的粘度在电路表面上的冲击时在500至1200mPa之间，并且选择帘幕的高度，使得聚合物在电路上的流动速率为60至160m / min。 电路在幕下传送的速率也大于比聚合物流到电路上的速率略小的速率。

公开(公告)号：US3996121A

公开(公告)日：1976-12-07

申请号：US548702

申请日：1975-02-10

Applicant: George Edward Green ,  Ewald Losert

Inventor： George Edward Green ,  Ewald Losert

IPC: C07C69/52 ,  C07C67/00 ,  C07C69/618 ,  C07C253/00 ,  C07C255/23 ,  C07D303/02 ,  C08F2/46 ,  C08F290/00 ,  C08F299/00 ,  G03F7/027 ,  G03F7/038 ,  H05K3/00 ,  C08F4/00

CPC classification number: G03F7/027 ,  C07D303/02 ,  G03F7/038 ,  Y10T428/31522 ,  Y10T428/31529

Abstract: The products, which are based on polyepoxide, polymerize on exposure to actinic radiation and are useful in the preparation of printing plates for offset printing and of printed circuits, particularly multilayer circuits. They are formed by coupling two molecules of a polyepoxide by means of a dihydric phenol which contains a chalcone or chalcone-like grouping, such as 1,3-bis(p-hydroxyphenyl)prop-1-en-3-one or 1,5-bis(p-hydroxyphenyl) penta-1,4-dien-3-one, so sensitizing the material to the radiation, and then, to achieve polymerizability, ring-opening at least some of the residual epoxide groups so as to incorporate olefinic acyloxy groups (R.sup.6 CH=C(R.sup.5)COO-), such as sorboyl groups.

Abstract translation: 基于聚环氧化物的产品在曝光于光化辐射下聚合，并且可用于制备用于胶版印刷和印刷电路，特别是多层电路的印刷版。 它们通过使含有查耳酮或查耳酮样基团的二元酚如1,3-双（对羟基苯基）丙-1-烯-3-酮或1， （对羟基苯基）五-1,4-二烯-3-酮，使材料对辐射敏化，然后为达到聚合性，至少部分残留的环氧基团开环，从而合并 烯属酰氧基（R6CH = C（R5）COO-），如芳酰基。