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    Light-Proof Electrodes
    3.
    发明申请
    Light-Proof Electrodes 审中-公开
    防光电极

    公开(公告)号：US20110087126A1

    公开(公告)日：2011-04-14

    申请号：US12824805

    申请日：2010-06-28

    Applicant: Anthony Zorzos ,  Clifton Fonstad ,  Edward Boyden ,  Giovanni Talei Franzesi ,  August Dietrich

    Inventor： Anthony Zorzos ,  Clifton Fonstad ,  Edward Boyden ,  Giovanni Talei Franzesi ,  August Dietrich

    IPC: A61B5/04

    CPC classification number: A61B5/0478 ,  A61B2562/0217

    Abstract: According to principles of this invention, the photoelectrochemical effect (“PE effect”) may be greatly reduced or eliminated, even when an electrode is immersed in an electrolyte and exposed to light, by using a transparent conductor to record electrical activity. Thus, an electrode with a clear conductor may be used to accurately record electrical activity of neurons and other cells that are exposed to light in vivo or in vitro. Such an electrode eliminates or greatly reduces the artifacts that would otherwise be caused by light due to the PE effect.

    Abstract translation: 根据本发明的原理，即使通过使用透明导体来记录电活动，即使将电极浸入电解质中并暴露于光下，也可以大大降低或消除光电化学效应（“PE效应”）。 因此，具有透明导体的电极可用于精确地记录在体内或体外暴露于光的神经元和其它细胞的电活动。 这样的电极消除或大大减少由于PE效应而由光引起的伪影。

    Methods and apparatus for stretched light field microscope
    9.
    发明授权
    Methods and apparatus for stretched light field microscope 有权

    公开(公告)号：US10120180B2

    公开(公告)日：2018-11-06

    申请号：US14868340

    申请日：2015-09-28

    Applicant: Moshe Ben Ezra ,  Edward Boyden ,  Christopher Rowlands ,  Young Gyu Yoon

    Inventor： Moshe Ben Ezra ,  Edward Boyden ,  Christopher Rowlands ,  Young Gyu Yoon

    IPC: G02B21/00 ,  G02B21/36

    Abstract: The information budget of a light field microscope is increased by increasing the field of view and image circle diameter of the microscope, while keeping the ratio of overall magnification of the microscope to the numerical aperture of the microscope unchanged. Alternatively, the information budget is increased by increasing the field of view and image circle diameter of the microscope by a first factor, while increasing the ratio of overall magnification of the microscope to the numerical aperture of the microscope by a smaller, second factor. In some cases, an infinity-corrected light field microscope has an overall magnification that is greater than the nominal magnification of the objective lens.

    Methods and apparatus for three-dimensional microfabricated arrays
    10.
    发明申请
    Methods and apparatus for three-dimensional microfabricated arrays 有权
    三维微细排列的方法和装置

    公开(公告)号：US20130157498A1

    公开(公告)日：2013-06-20

    申请号：US13674894

    申请日：2012-11-12

    Applicant: Jorg Scholvin ,  Anthony Zorzos ,  Clifton Fonstad ,  Edward Boyden

    Inventor： Jorg Scholvin ,  Anthony Zorzos ,  Clifton Fonstad ,  Edward Boyden

    IPC: G01R1/073 ,  B23K20/00 ,  C25D3/00 ,  H01R4/02

    CPC classification number: G01R1/07314 ,  B23K20/00 ,  C23C18/1608 ,  C25D3/00 ,  C25D5/022 ,  H01R4/027 ,  H01R13/03 ,  H05K1/00 ,  H05K1/18 ,  H05K3/242 ,  H05K2201/10083

    Abstract: In exemplary implementations of this invention, electrical connections are fabricated between two orthogonal surfaces by electroplating. The two surfaces are separated (except for the electrical connections) by a gap of not more than 100 micrometers. Multiple electrical connections may be fabricated across the gap. In preparatory steps, conductive pads on the two surfaces may be separately electroplated to build up “bumps” that make it easier to bridge the remainder of the gap in a final plating step. Alternately, electroless deposition may be used instead of electroplating. In exemplary implementations, a 3D probe array may be assembled by inserting array structures into an orthogonal base plate. The array structures may be aligned and held in place, relative to the base plate, by mechanical means, including side hooks, stabilizers, bottom hooks, alignment parts and a back plate.

    Abstract translation: 在本发明的示例性实施方案中，通过电镀在两个正交表面之间制造电连接。 两个表面分开（电连接除外）间隔不超过100微米。 跨越间隙可以制造多个电连接。 在准备步骤中，两个表面上的导电焊盘可以被单独地电镀以形成“凸块”，这使得在最后的电镀步骤中更容易桥接剩余的间隙。 或者，可以使用无电沉积代替电镀。 在示例性实施方案中，可以通过将阵列结构插入到正交基板中来组装3D探针阵列。 阵列结构可以通过包括侧钩，稳定器，底钩，对准部分和后板的机械装置相对于基板对准和保持就位。

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