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    Polyamide of diamino-t-butyltoluene
    1.
    发明授权
    Polyamide of diamino-t-butyltoluene 失效
    二氨基叔丁基甲苯的聚酰胺

    公开(公告)号：US4973660A

    公开(公告)日：1990-11-27

    申请号：US277788

    申请日：1988-11-30

    申请人： David J. Fenoglio ,  Douglas E. Fjare ,  John L. Melquist

    发明人： David J. Fenoglio ,  Douglas E. Fjare ,  John L. Melquist

    IPC分类号： C08G69/26 ,  C08G69/32 ,  C08G73/10 ,  C08G73/14

    CPC分类号： C08G73/10 ,  C08G69/26 ,  C08G69/32 ,  C08G73/1067 ,  C08G73/14

    摘要： Resinous condensation polymers of polycarboxylic acid compounds and aromatic diprimary amines comprising diamino-t-butyltoluene are described. In particular, film-forming polyamides, polyimides and polyamide-imides and their copolymers made using diamino-t-butyltoluene which have amino groups meta or para to each other on a benzene ring are described. These polymers have some solubility in organic solvents such as N-methylpyrrolidone, a high glass transition temperature, excellent thermal stability, and are useful in films, fibers and composites, and in the electronics industry as electrical component substrates, protective coatings, interlevel dielectrics and the like.

    摘要翻译： 描述了包含二氨基叔丁基甲苯的多羧酸化合物和芳族二胺的树脂缩聚物。 特别地，描述了使用在苯环上彼此间隔或间隔氨基的二氨基叔丁基甲苯制备的成膜聚酰胺，聚酰亚胺和聚酰胺 - 酰亚胺及其共聚物。 这些聚合物在有机溶剂如N-甲基吡咯烷酮中具有一定的溶解度，玻璃化转变温度高，热稳定性优异，并且可用于膜，纤维和复合材料，并且在电子工业中可用作电组件衬底，保护涂层，层间电介质和 类似。

    Polyanhydride crosslinked fibrous cellulosic products and process for their preparation
    2.
    发明授权
    Polyanhydride crosslinked fibrous cellulosic products and process for their preparation 失效
    聚酐交联纤维素纤维制品及其制备方法

    公开(公告)号：US5981739A

    公开(公告)日：1999-11-09

    申请号：US926911

    申请日：1997-09-10

    申请人： Ronald L. Anderson ,  Wendell W. Cattron ,  Vincent F. Smith, Jr. ,  David J. Fenoglio

    发明人： Ronald L. Anderson ,  Wendell W. Cattron ,  Vincent F. Smith, Jr. ,  David J. Fenoglio

    IPC分类号： C08B15/10 ,  C08H8/00 ,  D06M13/17 ,  D06M13/184 ,  D06M13/224 ,  D06M15/53 ,  D21C9/00 ,  C07C63/307 ,  C08B3/00

    CPC分类号： C08H8/00 ,  C08B15/10 ,  D06M13/17 ,  D06M13/1845 ,  D06M13/224 ,  D06M15/53 ,  D21C9/005 ,  D06M2101/06

    摘要： A process for preparation of crosslinked cellulosic products containing at least 30 wt. % cellulosic fibers and the polyanhydride crosslinked cellulosic products resulting therefrom wherein a cellulosic material is treated with an aqueous solution of a polycarboxylic acid formed by hydrolysis of a polyanhydride of the structure ##STR1## which comprises the reaction product of trimellitic anhydride and a diol in the mole ratio of from about 2.0:0.9 to about 2.0:1.1, wherein R is selected from the group consisting of alkyl, alkylene and cycloalkylene moieties of up to 12 carbon atoms and ethylene oxide and propylene oxide moieties of molecular weight up to about 6000, wherein said cellulosic material is impregnated with an aqueous solution of said polyanhydride, dried, and heated to a temperature of from about 120.degree. C. to about 200.degree. C. at ambient pressure to obtain crosslinking of the cellulose fibers with the said polyanhydride by an ester bond between the hydroxyl groups of the cellulosic fibers and the anhydride groups of the anhydride. Fibrous cellulosic products are readily repulped paper with improved wet strength, pulp fluff with improved wet resilience, wood oriented strand board with improved moisture resistance, and textile products with improved durable press and reduced shrink characteristics.

    摘要翻译： 一种制备交联纤维素产品的方法，其包含至少30wt。 ％的纤维素纤维和由此产生的聚酐交联的纤维素产品，其中纤维素材料用多元羧酸的水溶液处理，所述多元羧酸的水溶液是通过水解结构的聚酐形成的，该聚酐包含偏苯三酸酐和二醇的反应产物的摩尔比 约2.0:0.9至约2.0:1.1，其中R选自具有至多12个碳原子的烷基，亚烷基和亚环烷基部分以及分子量高达约6000的环氧乙烷和环氧丙烷部分，其中所述纤维素 材料用所述聚酐的水溶液浸渍，干燥并在环境压力下加热至约120℃至约200℃的温度，以使纤维素纤维与所述聚酐通过酯键之间的酯键进行交联 纤维素纤维的羟基和酸酐的酸酐基团。 纤维素纤维素产品易于重新制备具有改进的湿强度的纸浆，具有改善的湿回弹性的纸浆绒毛，具有改善的耐湿性的木材定向刨花板以及具有改进的耐久压制和降低的收缩特性的纺织产品。

    Polyamide, polyimide, and polyamide-imide polymers of diamino-t-butylbenzene
    3.
    发明授权
    Polyamide, polyimide, and polyamide-imide polymers of diamino-t-butylbenzene 失效
    二氨基 - 叔丁基苯的聚酰胺，聚酰亚胺和聚酰胺 - 酰亚胺聚合物

    公开(公告)号：US4968780A

    公开(公告)日：1990-11-06

    申请号：US514427

    申请日：1990-04-25

    申请人： David J. Fenoglio ,  Douglas E. Fjare ,  John L. Melquist ,  Edwin F. Morello ,  Neal R. Nowicki

    发明人： David J. Fenoglio ,  Douglas E. Fjare ,  John L. Melquist ,  Edwin F. Morello ,  Neal R. Nowicki

    IPC分类号： C08G69/32 ,  H05K1/03 ,  H05K3/00

    CPC分类号： C08G69/32 ,  H05K1/0346 ,  H05K3/0017

    摘要： Resinous condensation polymers of polycarboxylic acid compounds and aromatic diprimary amines comprising diamino-t-butylbenzens are described. In particular, film-forming polyamides, polyimides and polyamide-imides and their copolymers made using diamino-t-butylbenzenes which have amino groups meta or para to each other on a benzene ring are described. These polymers have some solubility in organic solvents such as N-methylpyrrolidone, a high glass transition temperature, excellent thermal stability, and are useful in films, fibers and composites, and in the electronics industry as electrical component substrates, protective coatings, interlevel dielectrics and the like.

    摘要翻译： 描述了包含二氨基叔丁基苯的聚羧酸化合物和芳族二胺的树脂缩合聚合物。 特别地，描述了使用在苯环上彼此具有氨基或氨基的二氨基 - 叔丁基苯制备的成膜聚酰胺，聚酰亚胺和聚酰胺 - 酰亚胺及其共聚物。 这些聚合物在有机溶剂如N-甲基吡咯烷酮中具有一定的溶解度，玻璃化转变温度高，热稳定性优异，并且可用于膜，纤维和复合材料，并且在电子工业中可用作电组件衬底，保护涂层，层间电介质和 类似。

    Polyamide, polyimide, and polyamide-imide polymers and copolymers using 3, 5-diamino-t-butylbenzene
    7.
    发明授权
    Polyamide, polyimide, and polyamide-imide polymers and copolymers using 3, 5-diamino-t-butylbenzene 失效
    使用3,5-二氨基 - 叔丁基苯的聚酰胺，聚酰亚胺和聚酰胺 - 酰亚胺聚合物和共聚物

    公开(公告)号：US5003037A

    公开(公告)日：1991-03-26

    申请号：US562621

    申请日：1990-08-03

    申请人： David J. Fenoglio ,  Douglas E. Fjare ,  Edwin F. Morello ,  Neal B. Nowicki

    发明人： David J. Fenoglio ,  Douglas E. Fjare ,  Edwin F. Morello ,  Neal B. Nowicki

    IPC分类号： C08G69/32 ,  H05K1/03 ,  H05K3/00

    CPC分类号： C08G69/32 ,  H05K1/0346 ,  H05K3/0017

    摘要： Soluble, film-forming, polyamides, polyimides, and polyamide-imides and their copolymers made using 3,5-diamino-t-butylbenzene are described. These polymers have some solubility in organic solvents such as N-methylpyrrolidone, a high Tg, excellent thermal stability, lower density and lower moisture uptake and are useful in films, fibers and composites, and in the electronics industry as electrical component substrates, protective coatings, interlevel dielectrics and the like.

    摘要翻译： 描述了可溶性，成膜，聚酰胺，聚酰亚胺和聚酰胺 - 酰亚胺及其使用3,5-二氨基 - 叔丁基苯制备的共聚物。 这些聚合物在诸如N-甲基吡咯烷酮的有机溶剂中具有一定的溶解度，Tg高，热稳定性优异，密度低，吸湿性更低，并且可用于膜，纤维和复合材料，并且在电子工业中用作电子元件基材，保护涂层 ，层间电介质等。

    Polyamide, polyimide, and polyamide-imide polymers of diamino-t-butyltoluene
    8.
    发明授权
    Polyamide, polyimide, and polyamide-imide polymers of diamino-t-butyltoluene 失效
    二氨基叔丁基甲苯的聚酰胺，聚酰亚胺和聚酰胺 - 酰亚胺聚合物

    公开(公告)号：US4963648A

    公开(公告)日：1990-10-16

    申请号：US506217

    申请日：1990-04-09

    申请人： David J. Fenoglio ,  Douglas E. Fjare ,  John L. Melquist

    发明人： David J. Fenoglio ,  Douglas E. Fjare ,  John L. Melquist

    IPC分类号： C08G69/26 ,  C08G69/32 ,  C08G73/10 ,  C08G73/14

    CPC分类号： C08G73/10 ,  C08G69/26 ,  C08G69/32 ,  C08G73/1067 ,  C08G73/14

    摘要： Resinous condensation polymers of polycarboxylic acid compounds and aromatic diprimary amines comprising diamino-t-butyltoluene are described. In particular, film-forming polyamides, polyimides and polyamide-imides and their copolymers made using diamino-t-butyltoluene which have amino groups meta or para to each other on a benzene ring are described. These polymers have some solubility in organic solvents such as N-methylpyrrolidone, a high glass transition temperature, excellent thermal stability, and are useful in films, fibers and composites, and in the electronics industry as electrical component substrates, protective coatings, interlevel dielectrics and the like.

    摘要翻译： 描述了包含二氨基叔丁基甲苯的多羧酸化合物和芳族二胺的树脂缩聚物。 特别地，描述了使用在苯环上彼此间隔或间隔氨基的二氨基叔丁基甲苯制备的成膜聚酰胺，聚酰亚胺和聚酰胺 - 酰亚胺及其共聚物。 这些聚合物在有机溶剂如N-甲基吡咯烷酮中具有一定的溶解度，玻璃化转变温度高，热稳定性优异，并且可用于膜，纤维和复合材料，并且在电子工业中可用作电组件衬底，保护涂层，层间电介质和 类似。

    Polyamide, polyimide, and polyamide-imide polymers of diamino-t-butylbenzene
    10.
    发明授权
    Polyamide, polyimide, and polyamide-imide polymers of diamino-t-butylbenzene 失效
    二氨基 - 叔丁基苯的聚酰胺，聚酰亚胺和聚酰胺 - 酰亚胺聚合物

    公开(公告)号：US4992527A

    公开(公告)日：1991-02-12

    申请号：US557185

    申请日：1990-07-23

    申请人： David J. Fenoglio ,  Douglas E. Fjare ,  John L. Melquist ,  Edwin F. Morello ,  Neal R. Nowicki

    发明人： David J. Fenoglio ,  Douglas E. Fjare ,  John L. Melquist ,  Edwin F. Morello ,  Neal R. Nowicki

    IPC分类号： C08G69/32 ,  H05K1/03 ,  H05K3/00

    CPC分类号： C08G69/32 ,  H05K1/0346 ,  H05K3/0017

    摘要： Resinous condensation polymers of polycarboxylic acid compounds and aromatic diprimary amines comprising diamino-t-butylbenzenes are described. In particular, film-forming polyamides, polyimides and polyamide-imides and their copolymers made using diamino-t-butylbenzenes which have amino groups meta or para to each other on a benzene ring are described. These polymers have some solubility in organic solvents such as N-methylpyrrolidone, a high glass transition temperature, excellent thermal stability, and are useful in films, fibers and composites, and in the electronics industry as electrical component substrates, protective coatings, interlevel dielectrics and the like.

    摘要翻译： 描述了包含二氨基叔丁基苯的聚羧酸化合物和芳族二胺的树脂缩聚物。 特别地，描述了使用在苯环上彼此具有氨基或氨基的二氨基 - 叔丁基苯制备的成膜聚酰胺，聚酰亚胺和聚酰胺 - 酰亚胺及其共聚物。 这些聚合物在有机溶剂如N-甲基吡咯烷酮中具有一定的溶解度，玻璃化转变温度高，热稳定性优异，并且可用于膜，纤维和复合材料，并且在电子工业中可用作电组件衬底，保护涂层，层间电介质和 类似。