Abstract:
A memory device includes a memory cell array block including memory cells, a word line driver block adjacent the memory cell array block disposed in a direction in which word lines of the memory cells are arranged, a sense amplifier block adjacent the memory cell array block disposed in a direction in which bit lines of the memory cells are arranged, a conjunction block disposed at an intersection of the word line driver block and the sense amplifier block, an equalizer for equalizing a pair of local data lines, the equalizer disposed in the conjunction block, and a local data line sense amplifier configured to sense and amplify signals on a pair of local data lines, and having transistors of a first type disposed in the conjunction block and transistors of a second type disposed in the sense amplifier block.
Abstract:
Method and apparatus for use, e.g., with Synchronous Dynamic Random Access Memory (SDRAM) circuits are disclosed. In one described embodiment, three metal layers are deposited and patterned in turn overlying a memory array portion of an SDRAM. Relatively wide power conductors are routed on a third metal layer, allowing power conductors to be reduced in size, or in some cases eliminated, on first and second metal layers. The relatively wide power conductors thus can provide a more stable power supply to the memory array, and also free some space on first and/or second metal for routing of additional and/or more widely spaced signal conductors. Other embodiments are described and claimed.
Abstract:
Decoupling capacitance of at least one shared capacitor is distributed among a plurality of voltage sources for enhanced performance with minimized area of a semiconductor device. The high nodes and the low nodes of such voltage sources each comprise at least two distinct nodes for lower noise at the voltage sources. The present invention is applied to particular advantage for coupling a variable number of shared capacitors to a data charge voltage source depending on a bit organization of the semiconductor device.
Abstract:
Integrated circuit memory devices include a memory cell array that is configured to output data bits in parallel at a first data rate. An output circuit is configured to serially output the data bits to an external terminal at the first data rate in a normal mode of operation, and to serially output the data bits to the external terminal at a second data rate that is lower than the first data rate in a test mode of operation. Accordingly, the memory cell array can operate at a first data rate while allowing the output circuit to output data to an external terminal at a second data rate that is lower than the first data rate, in a test mode of operation.
Abstract:
A memory module system for connecting only selected memory modules to a data line to control data input and output is disclosed. The memory module system has a multiplicity of memory modules for outputting data to a data bus line, and more particularly, only the memory modules outputting data is electrically connected to the data bus line in response to activation of a predetermined connection control signal. The connection control signal has an activation width corresponding to a burst length of the output data. Only selected memory modules are connected to the data line during the data burst length, so that load per data pin is minimized, to thereby improve speed of writing and reading data.
Abstract:
A substrate voltage generating circuit for use in a semiconductor memory device is provided. The semiconductor memory device includes a charge pump for generating a substrate bias voltage in response to a clock signal; a first inverter type detector for detecting whether the substrate bias voltage reaches a target voltage; a second differential amplifier type detector for detecting whether the substrate bias voltage reaches the target voltage; and a driver for generating the clock signal in response to an output of one of the first and second detectors.
Abstract:
Decoupling capacitance of at least one shared capacitor is distributed among a plurality of voltage sources for enhanced performance with minimized area of a semiconductor device. The high nodes and the low nodes of such voltage sources each comprise at least two distinct nodes for lower noise at the voltage sources. The present invention is applied to particular advantage for coupling a variable number of shared capacitors to a data charge voltage source depending on a bit organization of the semiconductor device.
Abstract:
An output buffer includes an output terminal, a pull up module, a pull down module and an output latching module. The pull up module pulls up the output terminal to a first source voltage when the pull up module is active The pull down module pulls down the output terminal to a second source voltage when the pull down module is active. The output latching module latches a data signal in response to a state of an output clock signal in a first operation mode. The output latching module latches the data signal in response to a leading edge of the output clock signal in a second operation mode. The output latching module drives the pull up module and the pull down module in response to the data signal latched by the output latching module, so that the output latching module outputs the data signal to the output terminal in a second operation mode.
Abstract:
A data input circuit of a semiconductor memory device is disclosed. The data input circuit includes a control signal generation circuit, an internal strobe generation circuit and a data setup circuit. The control signal generation circuit generates a strobe control signal activated during input of data of the predetermined burst length. The internal strobe generation circuit generates an internal data strobe signal. The internal data strobe signal synchronizes with an external data strobe signal, and is disabled when data of the predetermined burst length is input. The data setup circuit converts sequentially input data to parallel data in response to the internal data strobe signal. According to the data input circuit and the data input method of the present invention, data of “high”-impedance cannot be input to the semiconductor memory device.
Abstract:
A semiconductor device can be configured for compatibility with different system level interfaces, e.g., LVTTL or SSTL, after assembly, thereby eliminating the need for bonding options and reducing the cost of manufacturing the device. The device includes an interface dependent circuit that operates with a selected interface in response to one or more interface enable signals. Several alternative embodiments include interface control circuits and mode register circuits for generating the interface enable signals responsive to a row address and control signals such as RAS, CAS, WE, and CS. Some embodiments also include a switching network that allows an input buffer to use an internally generated reference voltage for one interface and an externally applied reference voltage for a second interface.