摘要:
A material layer, a semiconductor device including the material layer, and methods of forming the material layer and the semiconductor device are provided herein. A method of forming a SiOCN material layer may include supplying a silicon source onto a substrate, supplying a carbon source onto the substrate, supplying an oxygen source onto the substrate, supplying a nitrogen source onto the substrate, and supplying hydrogen onto the substrate. When a material layer is formed according to a method of the present inventive concepts, a material layer having a high tolerance to wet etching and/or good electric characteristics may be formed, and may even be formed when the method is performed at a low temperature.
摘要:
A semiconductor device includes a gate pattern on a substrate, a multi-channel active pattern under the gate pattern to cross the gate pattern and having a first region not overlapping the gate pattern and a second region overlapping the gate pattern, a diffusion layer in the multi-channel active pattern along the outer periphery of the first region and including an impurity having a concentration, and a liner on the multi-channel active pattern, the liner extending on lateral surfaces of the first region and not extending on a top surface of the first region. Related fabrication methods are also described.
摘要:
In a method of forming an insulation structure, at least one oxide layer is formed on an object by at least one oxidation process, and then at least one nitride layer is formed from the oxide layer by at least one nitration process. An edge portion of the insulation structure may have a thickness substantially the same as that of a central portion of the insulation structure so that the insulation structure may have a uniform thickness and improved insulation characteristics. When the insulation structure is employed as a tunnel insulation layer of a semiconductor device, the semiconductor device may have enhanced endurance and improved electrical characteristics because a threshold voltage distribution of cells in the semiconductor device may become uniform.
摘要:
A frequency synchronization apparatus includes: a correlating unit that obtains a first correlation value by correlating a known reference guard interval of an OFDM symbol and a reference copy interval corresponding to the reference guard interval, and obtains a second correlation value by correlating the estimate guard interval and an estimate copy interval corresponding to the estimate guard interval; a determining unit that compares the first and second correlation values to determine a first case where the first correlation value is larger by a pre-set magnification than the second correlation value, a second case where the second correlation value is larger by a pre-set magnification than the first correlation value, and a third case which is not the first case nor the second case; and a frequency offset estimating unit that estimates a frequency offset by using a correlation value corresponding to any one of the first to third.
摘要:
A refrigerator includes a main body having a storage space and a door selectively opening or closing the storage space. The ice-making device includes an ice maker installed on a backside of the door for making ice; a cold air duct provided in one side of the storage space and supplying the ice maker with a portion of cold air supplied to the storage space; an ice maker cover detachably installed on the backside of the door to selectively open or close the ice maker; and an ice bank detachably installed on the backside of the door below the ice maker, the ice bank storing ice made in the ice maker and transferring it to a dispenser provided on the door.
摘要:
In a method of forming an insulation structure, at least one oxide layer is formed on an object by at least one oxidation process, and then at least one nitride layer is formed from the oxide layer by at least one nitration process. An edge portion of the insulation structure may have a thickness substantially the same as that of a central portion of the insulation structure so that the insulation structure may have a uniform thickness and improved insulation characteristics. When the insulation structure is employed as a tunnel insulation layer of a semiconductor device, the semiconductor device may have enhanced endurance and improved electrical characteristics because a threshold voltage distribution of cells in the semiconductor device may become uniform.
摘要:
A semiconductor device includes a semiconductor substrate having a surface, buried isolation regions protruding from the surface of the semiconductor substrate, and a first insulating layer on the surface of the semiconductor substrate between the isolation regions and including a fluorine, nitrogen, and/or heavy hydrogen impurity. A floating electrode is on the first insulating layer, a second insulating layer is on the floating electrode and the isolation regions, and a control gate electrode is on the second insulating layer. Related methods of forming semiconductor devices are also disclosed.
摘要:
The present invention relates to a door assembly and refrigerator having the same. The door assembly according to the present invention includes a door main body, a panel disposed on a front surface of the door main body, and a side cover coupled at least one of a left side portion and a right side portion of the door main body and supporting the panel, wherein the side cover is provided with screw coupling portions concaved from an external surface and protruded from an inner surface along an insertion direction of screws and screw holes formed by penetrating the screw coupling portions, and the door main body is provided with inference-avoiding space portions for receiving the screw coupling portions therein. Accordingly, it is capable of preventing inferiority of the side cover and of reducing the amount of used materials.
摘要:
The present invention relates to a door assembly and refrigerator having the same. The door assembly according to the present invention includes a door main body, a panel disposed on a front surface of the door main body, a handle having at least one end coupled to an upper end or a lower end of the door main body, and a cover provided with a handle receiving portion allowing an upper end or a lower end of the handle to be received therein and coupled to the upper end or the lower end of the door main body so as to support the panel. Accordingly, it is capable of replacing the cover without disassembling the handle.
摘要:
Disclosed related to a refrigerator according to the present invention capable of preventing the drooping of bin when the bin is pulled out of the storage space. Further, the refrigerator does not need to fit guide device when users push the bin into the storage space, since the bin is completely separated from the guide device.