公开(公告)号：US10163681B2

公开(公告)日：2018-12-25

申请号：US14232911

申请日：2011-08-30

申请人： Klaus Martinschitz ,  Markus Wimplinger ,  Bernhard Rebhan ,  Kurt Hingerl

发明人： Klaus Martinschitz ,  Markus Wimplinger ,  Bernhard Rebhan ,  Kurt Hingerl

IPC分类号： H01L21/762 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00 ,  H01L21/18 ,  B23K35/00 ,  B23K35/26 ,  B23K35/30 ,  B23K35/02 ,  B23K20/02 ,  B23K101/40

摘要： A method for bonding of a first solid substrate to a second solid substrate which contains a first material with the following steps, especially the following sequence: formation or application of a function layer which contains a second material to the second solid substrate, making contact of the first solid substrate with the second solid substrate on the function layer, pressing together the solid substrates for forming a permanent bond between the first and second solid substrate, at least partially reinforced by solid diffusion and/or phase transformation of the first material with the second material, an increase of volume on the function layer being caused.

公开(公告)号：US20140196842A1

公开(公告)日：2014-07-17

申请号：US13808415

申请日：2012-01-23

申请人： Klaus Martinschitz ,  Markus Wimplinger ,  Bernhard Rebhan

发明人： Klaus Martinschitz ,  Markus Wimplinger ,  Bernhard Rebhan

IPC分类号： B23K20/24 ,  B29C65/74

CPC分类号： B29C65/74 ,  B23K20/023 ,  B23K20/22 ,  B23K20/24 ,  B23K2101/40 ,  B29C65/7412 ,  Y10T156/1062 ,  Y10T156/12

摘要： A method for bonding a first bond surface of a first solid substrate consisting of a first material to a second bond surface of a second solid substrate consisting of a second material, said method comprising the steps of: working one of the first and/or second bond surfaces with a cutting tool at a speed vs that is below a critical speed vk and at a temperature Ts that exceeds a critical temperature Tk, down to a surface roughness O that is less than 1 μm; bringing the first solid substrate into contact with the second solid substrate at the bond surfaces, and exposing the solid substrates that are in contact to temperature in order to form a permanent bond that is at least primarily produced by recrystallization at the bond surfaces.

摘要翻译： 一种用于将由第一材料组成的第一固体基质的第一粘合表面与由第二材料组成的第二固体基质的第二粘结表面接合的方法，所述方法包括以下步骤：将所述第一和/ 具有切削工具的速度与低于临界速度vk的温度Ts和超过临界温度Tk的温度T下降到小于1μm的表面粗糙度O; 使第一固体基材在接合表面与第二固体基材接触，并将与温度接触的固体基材曝光，以便形成至少主要通过在结合表面上重结晶产生的永久粘合。

公开(公告)号：US09067363B2

公开(公告)日：2015-06-30

申请号：US13808415

申请日：2012-01-23

申请人： Klaus Martinschitz ,  Markus Wimplinger ,  Bernhard Rebhan

发明人： Klaus Martinschitz ,  Markus Wimplinger ,  Bernhard Rebhan

IPC分类号： B23K20/22 ,  B23K20/24 ,  B29C65/74 ,  B23K20/02

CPC分类号： B29C65/74 ,  B23K20/023 ,  B23K20/22 ,  B23K20/24 ,  B23K2101/40 ,  B29C65/7412 ,  Y10T156/1062 ,  Y10T156/12

摘要： A method for bonding a first bond surface of a first solid substrate consisting of a first material to a second bond surface of a second solid substrate consisting of a second material. The method including the steps of: working one of the first and/or second bond surfaces with a cutting tool at a speed vs that is below a critical speed vk and at a temperature Ts that exceeds a critical temperature Tk, down to a surface roughness O that is less than 1 μm; bringing the first solid substrate into contact with the second solid substrate at the bond surfaces, and exposing the solid substrates that are in contact to temperature in order to form a permanent bond that is at least primarily produced by recrystallization at the bond surfaces.

摘要翻译： 一种用于将由第一材料组成的第一固体基底的第一粘合表面与由第二材料组成的第二固体基底的第二粘结表面接合的方法。 该方法包括以下步骤：用切削工具以与低于临界速度vk的速度相对应的第一和/或第二接合表面中的一个，并且在超过临界温度Tk的温度Ts下，直到表面粗糙度 O小于1μm; 使第一固体基材在接合表面与第二固体基材接触，并将与温度接触的固体基材曝光，以便形成至少主要通过在结合表面上重结晶产生的永久粘合。

公开(公告)号：US20140154867A1

公开(公告)日：2014-06-05

申请号：US14232911

申请日：2011-08-30

申请人： Klaus Martinschitz ,  Markus Wimplinger ,  Bernhard Rebhan ,  Kurt Hingerl

发明人： Klaus Martinschitz ,  Markus Wimplinger ,  Bernhard Rebhan ,  Kurt Hingerl

IPC分类号： H01L21/762

CPC分类号： H01L21/76251 ,  B23K20/021 ,  B23K20/023 ,  B23K35/001 ,  B23K35/0255 ,  B23K35/262 ,  B23K35/302 ,  B23K2101/40 ,  H01L21/185 ,  H01L24/05 ,  H01L24/08 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/038 ,  H01L2224/0384 ,  H01L2224/04026 ,  H01L2224/05557 ,  H01L2224/05647 ,  H01L2224/0801 ,  H01L2224/08501 ,  H01L2224/2745 ,  H01L2224/27452 ,  H01L2224/275 ,  H01L2224/27505 ,  H01L2224/278 ,  H01L2224/2784 ,  H01L2224/29019 ,  H01L2224/2908 ,  H01L2224/29111 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29166 ,  H01L2224/29181 ,  H01L2224/29184 ,  H01L2224/29211 ,  H01L2224/29311 ,  H01L2224/29347 ,  H01L2224/3201 ,  H01L2224/325 ,  H01L2224/32501 ,  H01L2224/7565 ,  H01L2224/83013 ,  H01L2224/83022 ,  H01L2224/83191 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83345 ,  H01L2224/83365 ,  H01L2224/83385 ,  H01L2224/838 ,  H01L2224/8383 ,  H01L2224/8384 ,  H01L2224/94 ,  H01L2924/01029 ,  H01L2924/01327 ,  H01L2924/1434 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/0105 ,  H01L2224/83

摘要： A method for bonding of a first solid substrate to a second solid substrate which contains a first material with the following steps, especially the following sequence: formation or application of a function layer which contains a second material to the second solid substrate, making contact of the first solid substrate with the second solid substrate on the function layer, pressing together the solid substrates for forming a permanent bond between the first and second solid substrate, at least partially reinforced by solid diffusion and/or phase transformation of the first material with the second material, an increase of volume on the function layer being caused.

摘要翻译： 一种用于将第一固体基质与含有第一材料的第二固体基质结合的方法，其特征在于以下步骤：形成或施加包含第二材料的功能层至第二固体基质，使第 所述第一固体基底具有所述功能层上的第二固体基底，将固体基底压在一起以在所述第一和第二固体基底之间形成永久性结合，至少部分地通过所述第一材料的固体扩散和/或相变而与 第二种材料，会引起功能层上的体积增加。

公开(公告)号：US20140102221A1

公开(公告)日：2014-04-17

申请号：US14119023

申请日：2011-06-06

申请人： Bernhard Rebhan ,  Markus Wimplinger ,  Jürgen Burggraf

发明人： Bernhard Rebhan ,  Markus Wimplinger ,  Jürgen Burggraf

IPC分类号： G01L1/24

CPC分类号： G01L1/24 ,  B30B15/062 ,  G01L5/008 ,  G01L5/0085 ,  H01L22/12

摘要： A method and a device for determining the pressure distribution for bonding of a first substrate to a second substrate, with the following steps, especially with the following sequence: placing a measurement layer between a first tool for holding the first substrate and an opposite second tool which is aligned to the first tool for bonding of the substrate, deformation of the measurement layer by bringing the tools closer to one another, measurement of the deformation of the measurement layer and computation of the pressure distribution.

摘要翻译： 一种用于确定用于将第一基底粘结到第二基底上的压力分布的方法和装置，具体步骤如下：将测量层放置在用于保持第一基底的第一工具和相对的第二工具之间 其与基板的第一工具对准，通过使工具彼此靠近来测量测量层的变形，测量层的变形的测量和压力分布的计算。

公开(公告)号：US09500541B2

公开(公告)日：2016-11-22

申请号：US14119023

申请日：2011-06-06

申请人： Bernhard Rebhan ,  Markus Wimplinger ,  Jürgen Burggraf

发明人： Bernhard Rebhan ,  Markus Wimplinger ,  Jürgen Burggraf

IPC分类号： G01L1/00 ,  G01L5/00 ,  G01L1/24 ,  B30B15/06 ,  H01L21/66

CPC分类号： G01L1/24 ,  B30B15/062 ,  G01L5/008 ,  G01L5/0085 ,  H01L22/12

摘要： A method and a device for determining the pressure distribution for bonding of a first substrate to a second substrate, with the following steps, especially with the following sequence: placing a measurement layer between a first tool for holding the first substrate and an opposite second tool which is aligned to the first tool for bonding of the substrate, deformation of the measurement layer by bringing the tools closer to one another, measurement of the deformation of the measurement layer and computation of the pressure distribution.

摘要翻译： 一种用于确定用于将第一基底粘结到第二基底上的压力分布的方法和装置，具体步骤如下：将测量层放置在用于保持第一基底的第一工具和相对的第二工具之间 其与基板的第一工具对准，通过使工具彼此靠近来测量测量层的变形，测量层的变形的测量和压力分布的计算。

公开(公告)号：US09443820B2

公开(公告)日：2016-09-13

申请号：US14387380

申请日：2012-05-30

申请人： Bernhard Rebhan

发明人： Bernhard Rebhan

IPC分类号： B23K37/00 ,  B23K37/04 ,  H01L23/00 ,  H01L21/67 ,  B23K20/14 ,  B23K20/24 ,  B23K20/26 ,  B23K31/02

CPC分类号： H01L24/75 ,  B23K20/14 ,  B23K20/24 ,  B23K20/26 ,  B23K31/02 ,  B23K37/00 ,  H01L21/67092 ,  H01L2224/751 ,  H01L2224/7525 ,  H01L2224/757 ,  H01L2224/758 ,  H01L2224/81065 ,  H01L2224/83065 ,  H01L2224/94 ,  H01L2924/1461 ,  H01L2224/81 ,  H01L2924/00

摘要： A device for bonding of one bond side of a first substrate to one bond side of a second substrate, the device having one module group with a common working space which can be closed especially gastight to the environment, at least one bond module is connected in a sealed manner to the working space, and a movement apparatus for moving the first and second substrate in the working space.The module group has a reduction module which is connected, in a sealed manner to the working space for reducing the bond sides.

摘要翻译： 模块组具有减小模块，其以密封的方式连接到用于减少粘合侧的工作空间。

公开(公告)号：US20150069115A1

公开(公告)日：2015-03-12

申请号：US14387380

申请日：2012-05-30

申请人： Bernhard Rebhan

发明人： Bernhard Rebhan

IPC分类号： H01L23/00 ,  B23K20/14 ,  B23K20/26 ,  B23K20/24 ,  B23K37/00 ,  B23K31/02

CPC分类号： H01L24/75 ,  B23K20/14 ,  B23K20/24 ,  B23K20/26 ,  B23K31/02 ,  B23K37/00 ,  H01L21/67092 ,  H01L2224/751 ,  H01L2224/7525 ,  H01L2224/757 ,  H01L2224/758 ,  H01L2224/81065 ,  H01L2224/83065 ,  H01L2224/94 ,  H01L2924/1461 ,  H01L2224/81 ,  H01L2924/00

摘要： A device for bonding of one bond side of a first substrate to one bond side of a second substrate, the device having one module group with a common working space which can be closed especially gastight to the environment, at least one bond module is connected in a sealed manner to the working space, and a movement apparatus for moving the first and second substrate in the working space,The module group has a reduction module which is connected, in a sealed manner to the working space for reducing the bond sides.

摘要翻译： 一种用于将第一衬底的一个接合侧粘合到第二衬底的一个接合侧的装置，所述设备具有一个具有可以被封闭的公共工作空间的模块组，所述工作空间可以特别气密地环绕到环境中，至少一个接合模块连接在 与工作空间密封的方式，以及用于在工作空间中移动第一和第二基板的移动装置。模块组具有以与密封的方式连接到用于减少接合侧的工作空间的还原模块。