摘要:
A pattering method includes providing a first material (e.g., copper) and transforming at a least a surface region of the first material to a second material (e.g., copper oxide). One or more portions of the second material (e.g., copper oxide) are converted to one or more converted portions of first material (e.g., copper) while one or more portions of the second material (e.g., copper oxide) remain. One or more portions of the remaining second material (e.g., copper oxide) are removed selectively relative to converted portions of first material (e.g., copper). Further, a thickness of the converted portions may be increased. Yet further, a diffusion barrier layer may be used for certain applications.
摘要:
A structure for storing digital data is provided, with a high reflectance layer comprising a gold film formed over a semiconductor layer, and a plurality of low reflectance portions comprising a mixture of a gold material and a semiconductor material. The plurality of low reflectance portions have top surfaces comprising more semiconductor material than the gold material. The invention also provides a method of changing reflectance on a data storage disk, comprising irradiating a laser light beam onto a gold film formed over a semiconductor layer, and raising the temperature of the gold film above a eutectic temperature for a mixture of gold and the semiconductor layer.
摘要:
The present invention includes a method for reducing random bit data loss in a memory circuit. The method comprises a semiconductor layer that has a surface. The semiconductor layer is exposed at an elevated temperature to an atmosphere comprising deuterium thereby forming a film on the semiconductor layer comprising deuterium. A memory circuit is fabricated on or within the semiconductor layer.
摘要:
Improved methods and structures are provided that are lateral to surfaces with a (110) crystal plane orientation such that an electrical current of such structures is conducted in the direction. Advantageously, improvements in hole carrier mobility of approximately 50% can be obtained by orienting the structure's channel in a (110) plane such that the electrical current flow is in the direction. Moreover, these improved methods and structures can be used in conjunction with existing fabrication and processing techniques with minimal or no added complexity.
摘要:
A method for providing a self-aligned etch stop layer comprises the steps of providing a dielectric layer having a polycrystalline silicon (poly) plug formed therein. An aluminum layer is formed to contact the dielectric layer and the plug, then the structure is heated. Heating the aluminum and the poly results in the absorption of the aluminum overlying the plug into the poly, while the aluminum overlying the dielectric is not absorbed. The aluminum over the dielectric is oxidized which forms a self-aligned etch stop layer. Layers are formed over the aluminum oxide and are subsequently etched. The etch stops on the aluminum oxide and the poly plug.
摘要:
A contact for use with a memory element of a semiconductor device structure includes a conductive element and a thermal insulator component. The conductive element establishes an electrical path to the memory element, while the thermal insulator component thermally insulates the memory element. The thermal insulator component may reduce an amount of current required to change a conductivity state of the memory element, particularly when the memory element includes a so-called “phase change” element. Methods for fabricating such contacts are also disclosed.
摘要:
A microelectronic device fabricating method includes providing a substrate having a beveled portion and forming a layer of structural material on the beveled portion. Some of the structural material can be removed from the beveled portion by anisotropic etching to form a device feature from the structural material. The device feature can be formed on the beveled portion as with a pair of spaced, adjacent barrier material lines that are substantially void of residual shorting stringers extending therebetween. Structural material can be removed from the beveled portion to form an edge defined feature on a substantially perpendicular edge of the substrate. The beveled portion and perpendicular edge can be part of a mandril. The mandril can be removed from the substrate after forming the edge defined feature.
摘要:
The present invention is directed to a memory cell which comprises a storage node, a switching device for controlling access to the storage node, and a diode between the switching device and the storage node. A method for controlling charge transfer to and from a storage node through a switching device is also disclosed.
摘要:
The present invention is directed to a memory cell which comprises a storage node, a switching device for controlling access to the storage node, and a diode between the switching device and the storage node. A method for controlling charge transfer to and from a storage node through a switching device is also disclosed.
摘要:
The present invention is directed to a memory cell which comprises a storage node, a switching device for controlling access to the storage node, and a diode between the switching device and the storage node. A method for controlling charge transfer to and from a storage node through a switching device is also disclosed.