Abstract:
An electrical adapter can include a rectifying circuit configured to receive an AC power input, a power factor corrector (PFC) circuit coupled with an output of the rectifying circuit, and a capacitive component coupled with an output of the PFC circuit. The electrical adapter can further include a DC-DC converter circuit coupled with an output of the capacitive component and configured to provide a power output of the electrical adapter, and an impedance-measuring circuit coupled with the power output and configured to measure impedance of a cable connected to the power output. The DC-DC converter circuit can be configured to adjust power of the power output based on the measured impedance.
Abstract:
A variable output power supply includes a power unit comprising a housing including an output port, one or more accessories disposed in the housing, and a controller disposed in the housing and in communication with the output port. The variable output power supply also includes a power cable. The controller is operable to modify operation of the output port in response, at least in part, to insertion of the power cable in the output port.
Abstract:
An AC-DC converter configured to convert an input AC signal to an output DC signal is disclosed. The AC-DC converter includes an inductor and first and second transistors, where the inductor and first and second transistors are connected in series with one another. The input AC signal is applied across the series connected inductor and first and second transistors, and the series connected inductor and first and second transistors is configured to generate a secondary AC signal based on the AC input signal. The AC-DC converter also includes a rectifier, configured to rectify a signal based on the secondary AC signal to generate a substantially DC output signal based on the AC input signal.
Abstract:
A method of operating a power adapter having multiple outputs includes setting an output priority for each of the multiple outputs and providing an output voltage at each of the multiple outputs. The method also includes measuring one or more operating parameters of the power adapter and determining that at least one of the one or more operating parameters are greater than a setpoint. The method further includes reducing the output voltage associated with at least one of the multiple output ports.
Abstract:
A method for fabricating an edge termination structure includes providing a substrate having a first surface and a second surface and a first conductivity type, forming a first GaN epitaxial layer of the first conductivity type coupled to the first surface of the substrate, and forming a second GaN epitaxial layer of a second conductivity type opposite to the first conductivity type. The second GaN epitaxial layer is coupled to the first GaN epitaxial layer. The method also includes implanting ions into a first region of the second GaN epitaxial layer to electrically isolate a second region of the second GaN epitaxial layer from a third region of the second GaN epitaxial layer. The method further includes forming an active device coupled to the second region of the second GaN epitaxial layer and forming the edge termination structure coupled to the third region of the second GaN epitaxial layer.
Abstract:
An embodiment of a resonant converter includes having resonant circuitry having inductive and capacitive elements configured to create electrical resonance when an input voltage is applied and a synchronous rectifier coupled between at least a portion of the resonant circuitry and an output of the resonant converter. The synchronous rectifier includes a diode, and an electrical switch. Control circuitry is configured to operate the electrical switch such that the electrical switch is turned on when there is substantially no voltage across the diode and current flow in the diode is positive in a direction from anode to cathode.
Abstract:
A vertical III-nitride field effect transistor includes a drain comprising a first III-nitride material, a drain contact electrically coupled to the drain, and a drift region comprising a second III-nitride material coupled to the drain and disposed adjacent to the drain along a vertical direction. The field effect transistor also includes a channel region comprising a third III-nitride material coupled to the drift region, a gate region at least partially surrounding the channel region, and a gate contact electrically coupled to the gate region. The field effect transistor further includes a source coupled to the channel region. The source includes a GaN-layer coupled to an InGaN layer. The channel region is disposed between the drain and the source along the vertical direction such that current flow during operation of the vertical III-nitride field effect transistor is along the vertical direction.
Abstract:
A semiconductor structure includes a III-nitride substrate and a drift region coupled to the III-nitride substrate along a growth direction. The semiconductor substrate also includes a channel region coupled to the drift region. The channel region is defined by a channel sidewall disposed substantially along the growth direction. The semiconductor substrate further includes a gate region disposed laterally with respect to the channel region.
Abstract:
An integrated device including a vertical III-nitride FET and a Schottky diode includes a drain comprising a first III-nitride material, a drift region comprising a second III-nitride material coupled to the drain and disposed adjacent to the drain along a vertical direction, and a channel region comprising a third III-nitride material coupled to the drift region. The integrated device also includes a gate region at least partially surrounding the channel region, a source coupled to the channel region, and a Schottky contact coupled to the drift region. The channel region is disposed between the drain and the source along the vertical direction such that current flow during operation of the vertical III-nitride FET and the Schottky diode is along the vertical direction.
Abstract:
A method of forming a doped region in a III-nitride substrate includes providing the III-nitride substrate and forming a masking layer having a predetermined pattern and coupled to a portion of the III-nitride substrate. The III-nitride substrate is characterized by a first conductivity type and the predetermined pattern defines exposed regions of the III-nitride substrate. The method also includes heating the III-nitride substrate to a predetermined temperature and placing a dual-precursor gas adjacent the exposed regions of the III-nitride substrate. The dual-precursor gas includes a nitrogen source and a dopant source. The method further includes maintaining the predetermined temperature for a predetermined time period, forming p-type III-nitride regions adjacent the exposed regions of the III-nitride substrate, and removing the masking layer.