Systems and methods for improved metrology for semiconductor device wafers

    公开(公告)号:US12131959B2

    公开(公告)日:2024-10-29

    申请号:US17469280

    申请日:2021-09-08

    申请人: KLA Corporation

    IPC分类号: H01L21/66 G05B19/418

    摘要: A system and method for generating a quality parameter value of a semiconductor device wafer (SDW), during fabrication thereof, the method including designating a plurality of measurement site sets (MSSs) on the SDW, each of the MSSs including a first measurement-orientation site (FMS) and a second measurement-orientation site (SMS), the FMS and the SMS being different measurement sites on the SDW, generating a first measurement-orientation quality parameter dataset (FMQPD) by measuring features formed within each the FMS of at least one of the MSSs in a first measurement orientation, generating a second measurement-orientation quality parameter dataset (SMQPD) by measuring features formed within each the SMS of the at least one of the MSSs in a second measurement orientation and generating at least one tool-induced-shift (TIS)-ameliorated quality parameter value (TAQPV), at least partially based on the FMQPD and the SMQPD.

    Bandwidth adjustment for remote control of a manufacturing tool

    公开(公告)号:US12130612B2

    公开(公告)日:2024-10-29

    申请号:US17867476

    申请日:2022-07-18

    申请人: KLA Corporation

    发明人: Michael Brain

    摘要: A method is performed at a computer system of a manufacturing tool in a manufacturing facility. The method includes sending a series of frames showing data for the manufacturing tool to a client device for display. The client device is remote from the manufacturing facility. The method further includes receiving, from the client device, an indication of a user interaction with the client device and, in response to the indication, adjusting a bandwidth for one or more frames of the series of frames. Sending the series of frames includes, after receiving the indication, transmitting the one or more frames to the client device for display. The one or more frames are transmitted with the adjusted bandwidth.

    Methods And Systems For Nanoscale Imaging Based On Second Harmonic Signal Generation And Through-Focus Scanning Optical Microscopy

    公开(公告)号:US20240353352A1

    公开(公告)日:2024-10-24

    申请号:US18626240

    申请日:2024-04-03

    申请人: KLA Corporation

    发明人: Qiang Zhao Ming Di

    IPC分类号: G01N21/95 G01N21/88

    CPC分类号: G01N21/9505 G01N21/8806

    摘要: Methods and systems for improved detection of defects of interest and measurement of structures buried within complex three dimensional semiconductor structures are described herein. Through-focus scanning optical microscopy (TSOM) using non-linear, second harmonic generation (SHG) light signals emitted from a sample provides interface-selective sensitivity for metrology and inspection of advanced semiconductor structures. A TSOM/SHG system includes a spectral filter to pass collected light at wavelengths corresponding to SHG emission. In some embodiments, a TSOM/SHG system includes an ultrafast, pulsed laser source emitting ultraviolet to near infrared wavelengths to efficiently induce SHG at surface interfaces. The halving of wavelength inherent to SHG enables a doubling of illumination wavelength without penalizing resolution. In a further aspect, a TSOM/SHG measurement system includes an exogenous illumination source, an external electric field source, or both, to induce a DC electric field at one or more interfaces of structures under illumination, thereby enhancing SHG emission.

    PARALLEL SCANNING OVERLAY METROLOGY WITH OPTICAL META-SURFACES

    公开(公告)号:US20240337606A1

    公开(公告)日:2024-10-10

    申请号:US18624444

    申请日:2024-04-02

    申请人: KLA Corporation

    IPC分类号: G01N21/95

    CPC分类号: G01N21/9501

    摘要: A device may one or more optical elements configured to direct illumination to a sample and collect sample light from the sample in response to the illumination, where at least one of the one or more optical elements include one or more metasurfaces configured to manipulate at least one of the illumination or sample light using sub-wavelength features, where the sub-wavelength features are smaller than at least some wavelengths in at least one of the illumination or the sample light being manipulated, and where the one or more optical elements provide optical power for at least one of focusing the illumination on the sample or collecting the sample light from the sample.

    SYSTEM AND METHOD TO REDUCE MEASUREMENT ERROR IN INTERFEROMETRY-BASED METROLOGY

    公开(公告)号:US20240337478A1

    公开(公告)日:2024-10-10

    申请号:US18594707

    申请日:2024-03-04

    申请人: KLA Corporation

    摘要: A system includes a laser source and a dual interferometer sub-system. A channel of the dual interferometer sub-system includes a first splitter element coupled to a first output beam from a laser source configured to split the first output beam into a first transmitted beam and a first reflected beam, a first power sensor configured to measure a power of the first transmitted beam, a first detector configured to receive a first interference signal from the dual interferometer sub-system and record a first interferogram frame. The system includes a controller coupled to the first power sensor and the first detector of the first channel of the dual interferometer sub-system configured to receive the first interferogram frame, receive a first laser power measurement from the first power sensor; and normalize an intensity of the first interferogram frame based on the first laser power measurement to produce a first normalized interferogram frame.

    Correcting aberration and apodization of an optical system using correction plates

    公开(公告)号:US12092814B2

    公开(公告)日:2024-09-17

    申请号:US17574157

    申请日:2022-01-12

    申请人: KLA Corporation

    IPC分类号: G02B27/00 G02B27/58

    CPC分类号: G02B27/0068 G02B27/58

    摘要: An optical system with aberration correction is disclosed. The optical system may include an illumination source. The optical system may include a detector. The optical system may include one or more collection optics configured to image a sample onto the detector based on illumination from the illumination source. The optical system may include two or more aberration correction plates located in one or more pupil planes of the one or more collection optics. The two or more aberration correction plates may provide at least partial correction of two or more linearly-independent aberration terms. Any particular one of the two or more aberration correction plates may have a spatially-varying thickness profile providing a selected amount of correction for a single particular aberration term of the two or more linearly-independent aberration terms.

    X-Ray Scatterometry Based Measurements Of Memory Array Structures Stacked With Complex Logic Structures

    公开(公告)号:US20240302301A1

    公开(公告)日:2024-09-12

    申请号:US18416113

    申请日:2024-01-18

    申请人: KLA Corporation

    摘要: Methods and systems for performing measurements of stacked semiconductor structures, e.g., stacked memory and logic structures, based on X-Ray transmission scatterometry measurement data are described herein. In some examples, the scattering response of logic structures is modelled directly in signal space by a mathematical expression including a relatively small number of weighted basis functions. The scattering response of the logic structures and the scattering response of the memory structures determined by an electromagnetic response model are combined, e.g., by summation or convolution. The combined modelled signals are compared to the measured signals at the detector to generate an error signal. The error signal is employed to drive a regression analysis employed to optimize parameter values characterizing the memory structures, values of the weighting coefficients of the signal space model, or both. In other examples, the scattering response of the logic structures is known, and a model is not needed.

    Design-assisted large field of view metrology

    公开(公告)号:US12085385B2

    公开(公告)日:2024-09-10

    申请号:US17524152

    申请日:2021-11-11

    申请人: KLA Corporation

    IPC分类号: G01B15/04 G01B11/00 G01B11/24

    摘要: A metrology system may receive design data including a layout of fabricated instances of a structure on a sample. The system may further receive detection signals from the metrology tool associated within a field of view including multiple of the fabricated instances of the structure. The system may further generate design-assisted composite data for the structure by combining detection signals from one or more common features of the structure associated with the fabricated instances of the structure within the field of view using the design data. The system may further generate one or more metrology measurements of the structure based on the design-assisted composite data.