公开(公告)号：US20240362765A1

公开(公告)日：2024-10-31

申请号：US18438382

申请日：2024-02-09

申请人： KLA Corporation

发明人： Alan Davila ,  Marcus Liesching ,  Sandeep Bhagwat ,  Surya Vanamali ,  Suresh Selvaraj ,  Sravani Desu ,  Ganesh Meenakshisundaram ,  Karthik Purushothaman ,  Ardis Liang

IPC分类号： G06T7/00 ,  G06T7/11

CPC分类号： G06T7/0004 ,  G06T7/11 ,  G06T2207/20081 ,  G06T2207/30148

摘要： Methods and systems for generating information for use in setting up a process performed on a specimen are provided. One method includes clustering dies on a specimen based on colors assigned to the dies responsive to predicted defect densities in the dies determined from measurements performed on the specimen thereby generating initial die clusters. The method also includes analyzing the initial die clusters in location space to determine if any of the initial die clusters contain two or more die clusters. In addition, the method includes designating the initial die clusters that do not contain two or more die clusters and the two or more die clusters contained in any of the initial die clusters as the final die clusters. The method further includes storing information for the final die clusters for use in setting up a process performed on the specimen.

公开(公告)号：US11055840B2

公开(公告)日：2021-07-06

申请号：US16582846

申请日：2019-09-25

申请人： KLA Corporation

发明人： Ardis Liang ,  Martin Plihal ,  Saravanan Paramasivam ,  Niveditha Lakshmi Narasimhan ,  Sandeep Bhagwat

IPC分类号： G06T7/00 ,  G01N21/95

摘要： To evaluate a semiconductor-fabrication process, a semiconductor wafer is obtained that includes die grouped into modulation sets. Each modulation set is fabricated using distinct process parameters. The wafer is optically inspected to identify defects. A nuisance filter is trained to classify the defects as DOI or nuisance defects. Based on results of the training, a first, preliminary process window for the wafer is determined and die structures having DOI are identified in a first group of modulation sets bordering the first process window. The trained nuisance filter is applied to the identified defects to determine a second, revised process window for the wafer. A third, further revised process window for the wafer is determined based on SEM images of specified care areas in one or more modulation sets within the second, revised process window. A report is generated that specifies the third process window.

公开(公告)号：US20210042908A1

公开(公告)日：2021-02-11

申请号：US16582846

申请日：2019-09-25

申请人： KLA Corporation

发明人： Ardis Liang ,  Martin Plihal ,  Saravanan Paramasivam ,  Niveditha Lakshmi Narasimhan ,  Sandeep Bhagwat

IPC分类号： G06T7/00 ,  G01N21/95

摘要： To evaluate a semiconductor-fabrication process, a semiconductor wafer is obtained that includes die grouped into modulation sets. Each modulation set is fabricated using distinct process parameters. The wafer is optically inspected to identify defects. A nuisance filter is trained to classify the defects as DOI or nuisance defects. Based on results of the training, a first, preliminary process window for the wafer is determined and die structures having DOI are identified in a first group of modulation sets bordering the first process window. The trained nuisance filter is applied to the identified defects to determine a second, revised process window for the wafer. A third, further revised process window for the wafer is determined based on SEM images of specified care areas in one or more modulation sets within the second, revised process window. A report is generated that specifies the third process window.