Double-directional machining laser machine tool

    公开(公告)号:US09776285B2

    公开(公告)日:2017-10-03

    申请号:US15232264

    申请日:2016-08-09

    申请人: Chun-Hao Li

    发明人: Chun-Hao Li

    摘要: A double-directional machining laser machine tool includes a focused laser source, a lifting platform, a motion platform, a rotating platform, a height sensor, a vision module, and a control device. The control device drives, according to a distance detected by the height sensor, the lifting platform to lift the focused laser source up or down, and drives, according to an image, the motion platform to displace the bearing table, so as to enable a first laser beam outputted by the focused laser source forms a first recessed hole at a predetermined position on a first surface of a workpiece. The control device drives the rotating platform to rotate the workpiece, so as to enable the first laser beam forms a second recessed hole on a second surface of the workpiece, and the first recessed hole is in communication with the second recessed hole, so as to form a deep hole.

    Laser welder alignment system
    83.
    发明授权

    公开(公告)号:US09776278B2

    公开(公告)日:2017-10-03

    申请号:US14813085

    申请日:2015-07-29

    摘要: A laser welder alignment system includes a laser welder, a camera associated with the laser welder configured to capture images of a loaded product within the laser welder, and a controller in communicative association with the laser welder and the camera. The controller receives visualization data from the camera and, based on the visualization data, forms and sends positioning instructions to the laser welder instructing the laser welder so as to position the loaded product at a proper weld start. The laser welder alignment system also verifies proper positioning of the loaded product within the laser welder, and verifies proper rotation of the loaded component by determining whether the rotating product has a wobble that exceeds a pre-defined wobble tolerance.

    METHOD AND DEVICE FOR GROOVING WAFERS
    86.
    发明申请

    公开(公告)号:US20170236738A1

    公开(公告)日:2017-08-17

    申请号:US15043031

    申请日:2016-02-12

    摘要: A wafer grooving apparatus (100) for forming an elongate recess (103) in a semiconductor wafer surface, the apparatus comprising:a wafer table (110) for receiving and holding a semiconductor wafer; a radiation device (120) for generating a radiation beam (121); a beam directing device (130) for directing the radiation beam to a top surface (102) of the wafer so as to create a beam spot (142) where the radiation beam ablates wafer material on the wafer surface to form a recess; a wafer table displacement drive (170) for effecting a mutual displacement between the radiation beam and the wafer surface in a radiation beam displacement direction; a recess profile measuring device (180) arranged at a predetermined distance behind the beam directing device in the radiation beam displacement direction effected by the wafer table displacement drive for measuring a depth profile of the recess that has been formed by the radiation beam.

    LASER NOZZLE HAVING AN INTERNAL MOBILE ELEMENT AND AN EXTERNAL COVER

    公开(公告)号:US20170182589A1

    公开(公告)日:2017-06-29

    申请号:US14441755

    申请日:2013-10-23

    IPC分类号: B23K26/04 B23K26/38 B23K26/14

    摘要: A laser nozzle comprising a nozzle body (1) comprising a first axial housing (5) comprising a first outlet orifice (11) located in a front face (1 a) of the nozzle body (1); a movable element (2) arranged in the first axial housing (5) of the nozzle body (1), comprising a front portion (2a) forming a skirt and an axial passage (4) having a second outlet orifice (12) emerging from said front portion (2a) forming a skirt; and an elastic element (8) arranged in the first axial housing (5), between the nozzle body (1) and the movable element (2). According to the invention, the movable element (2) is able to move translationally in the first axial housing (5) in the direction of the first outlet orifice (11) under the effect of a gaseous pressure exerted on the movable element (2), and the elastic element (8) exerts an elastic return force on the movable element (2) tending to oppose the translational movement in the first axial housing (5) in the direction of the first outlet orifice (11). Furthermore, the nozzle furthermore comprises an external cover (13) forming a sleeve around all or some of the nozzle body (1). Focusing head and associated laser cutting apparatus. Laser beam cutting process employing a nozzle according to the invention, a laser focusing head according to the invention or an apparatus according to the invention.