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    Tackifier composition
    82.
    发明授权
    Tackifier composition 失效
    增粘剂组成

    公开(公告)号：US4707526A

    公开(公告)日：1987-11-17

    申请号：US29612

    申请日：1987-03-24

    申请人： Makoto Sasaki ,  Masaki Yamakawa ,  Toshifumi Hirose ,  Katsuhiko Isayama

    发明人： Makoto Sasaki ,  Masaki Yamakawa ,  Toshifumi Hirose ,  Katsuhiko Isayama

    IPC分类号： C08L71/00 ,  C08G65/336 ,  C08K5/00 ,  C08L65/00 ,  C08L71/02 ,  C08L71/12 ,  C09J159/00 ,  C09J165/00 ,  C09J171/00 ,  C09J171/02 ,  C08G65/48

    CPC分类号： C08L65/00 ,  C08G65/336 ,  C08L71/02

    摘要： A tackifier composition comprising, as essential compontents, (a) 100 parts by weight of a polyether having at least one reactive silicon group;(b) from 10 to 140 parts by weight of a phenolic hydroxyl group-containing cyclopentadiene resin which is obtained by copolymerization of 100 parts by weight of at least one component A selected from the group consisting of five-membered ring compounds of the following general formula having conjugated double bonds, and Diels-Alder reaction adducts thereof, ##STR1## in which H is a hydrogen atom, R is an alkyl group having from 1 to 3 carbon atoms, and m and n are each an integer of 0 or at least 1 provided that m+n=6, with 5 to 200 parts by weight of at least one component B selected from the group consisting of monohydric and polyhydric phenols and alkyl-substituted products thereof; and(c) from 0.1 to 10 parts by weight of a curing catalyst.

    摘要翻译： 一种增粘剂组合物，其包含作为必要组分的（a）100重量份的具有至少一个反应性硅基团的聚醚; （b）10〜140重量份含酚羟基的环戊二烯树脂，其通过共聚合100重量份的至少一种选自以下通式的五元环化合物的组分A 式中，H为氢原子，R为碳原子数1〜3的烷基，m和n分别为0以上或者0以下的整数。 至少1，条件是m + n = 6，具有5至200重量份的至少一种选自一元和多元酚及其烷基取代产物的组分B; 和（c）0.1-10重量份的固化催化剂。

    Adhesive composition containing phenoxy and epoxy resins and a cross-linking agent therefor
    85.
    发明授权
    Adhesive composition containing phenoxy and epoxy resins and a cross-linking agent therefor 失效
    含有苯氧基和环氧树脂的粘合剂组合物及其交联剂

    公开(公告)号：US3873637A

    公开(公告)日：1975-03-25

    申请号：US48342874

    申请日：1974-06-26

    申请人： SONY CORP

    发明人： FUJIWARA YOSHIO ,  NAITO KEIICHI ,  ODAJIMA TORU

    IPC分类号： C08G59/40 ,  C08G59/50 ,  C09J163/00 ,  C09J171/00 ,  H05K3/38 ,  C09J3/16

    CPC分类号： H05K3/386 ,  C08G59/4021 ,  C08G59/4071 ,  C08G59/5066 ,  C08K5/0025 ,  C08L63/00 ,  C08L71/00 ,  C08L2666/22 ,  C09J163/00 ,  C09J171/00 ,  H05K2201/0355 ,  Y10S525/93 ,  Y10T428/31518 ,  Y10T428/31522

    摘要： A structural adhesive composition which is particularly suited for bonding or laminating a metal foil to an epoxy resin impregnated glass fiber plate, for example, as in the production of copper clad painted circuit boards, comprises a phenoxy resin having the formula


    WHEREIN M is a metal atom having a valence of at least one, n is an integer including zero, m is an integer, R1 is a member selected from the group consisting of hydrogen atom, alkyl, unsaturated aliphatic, cyclic alkyl and aryl, and R2 is a member selected from the group consisting of alkyl and aryl which has at least one electron donor atom to form a chelate with said metal atom. The epoxy resin is preferably present in the composition in an amount between 20 and 400 wt.% based on the amount of the phenoxy resin, and the cross-linking agent is preferably present in the composition in an amount between 2 and 30 wt.% based on the amount of the phenoxy resin.
    WHEREIN N IS 50 TO 100, A LOW MOLECULAR EPOXY RESIN HAVING MORE THAN TWO EPOXY GROUPS AND AN EPOXY VALUE LESS THAN 4,000, AND A CROSS-LINKING AGENT WHICH EITHER HAS AT LEAST TWO AZIRIDINE RINGS AT THE ENDS OF THE MOLECULAES THEREOF TO REACT WITH THE HYDROXYL GROUP (OH) of said phenoxy resin and with said low molecular epoxy resin for providing a high cross-linking density, or which is a chelate of an organic metal compound having the formula

    摘要翻译： 特别适用于将金属箔与环氧树脂浸渍的玻璃纤维板接合或层压的结构粘合剂组合物，例如在生产铜包覆电路板时，包括具有下式的苯氧基树脂： 100，具有超过两个环氧基团和低于4,000的环氧值的低分子量环氧树脂，以及在其分子末端处至少两个亚胺基环的交联剂，其反应与羟基（OH） ）所述苯氧基树脂和所述低分子环氧树脂提供高交联密度，或者是具有下式的有机金属化合物的螯合物：WHEREIN M是具有至少一个化合价的金属原子，n是 包括0的整数，m是整数，R 1是选自氢原子，烷基，不饱和脂族，环烷基和芳基的成员，R 2是选自以下的成员：o f烷基和芳基，其具有至少一个电子给体原子以与所述金属原子形成螯合物。

    CURABLE COMPOUND PRODUCT
    86.
    发明公开
    CURABLE COMPOUND PRODUCT 审中-公开

    公开(公告)号：US20240026076A1

    公开(公告)日：2024-01-25

    申请号：US18030697

    申请日：2021-10-05

    申请人： DAICEL CORPORATION

    发明人： Yoshimichi OKANO ,  Kouji NAKATANI

    IPC分类号： C08G65/334 ,  C09J171/00 ,  C09D171/00

    CPC分类号： C08G65/3346 ,  C09D171/00 ,  C09J171/00

    摘要： Provided is a curable compound product having excellent storage stability and moldability and by which a cured product having ultra-high heat resistance can be formed. The curable compound product according to the present disclosure has the following characteristics (a) to (g): (a) A number average molecular weight (calibrated with polystyrene standard) is from 1000 to 15000. (b) A proportion of a structure derived from an aromatic ring in a total amount of the curable compound product is 50 wt. % or greater. (c) Solvent solubility at 23° C. is 1 g/100 g or greater. (d) The glass transition temperature is from 80 to 230° C. (e) A viscosity (η0) of a 20 wt. % NMP solution obtained by subjecting the curable compound product to a reduced-pressure drying process and then dissolving the reduced-pressure-dried curable compound product in NMP, and a viscosity (η10) of the 20 wt. % NMP solution after being left to stand for 10 days in a desiccator maintained at 23° C. satisfy the Equation (E): η10/η0

    CURABLE PERFLUOROPOLYETHER ADHESIVE COMPOSITION AND ADHESIVE CONTAINING CURED PRODUCT THEREOF
    89.
    发明申请
    CURABLE PERFLUOROPOLYETHER ADHESIVE COMPOSITION AND ADHESIVE CONTAINING CURED PRODUCT THEREOF 有权

    公开(公告)号：US20230015835A1

    公开(公告)日：2023-01-19

    申请号：US17783113

    申请日：2020-11-25

    申请人： SHIN-ETSU CHEMICAL CO., LTD.

    发明人： Hiroyuki YASUDA ,  Koichi YAMAGUCHI

    IPC分类号： C09J171/00 ,  C09J11/06

    摘要： A curable perfluoropolyether adhesive composition containing: (A) 100 parts by mass of a linear perfluoropolyether compound having at least two alkenyl groups per molecule and having a perfluoropolyether structure containing a repeating unit represented by -CaF2aO- in a main chain; (B) an organosilicon compound having at least two silicon-bonded hydrogen atoms per molecule; (C) a hydrosilylation-reaction catalyst; (D) 0.05 to 5 parts by mass of an organosilicon compound, other than the component (B), having per molecule any two or more selected from a silicon-bonded hydrogen atom, an epoxy group bonded to a silicon atom via a carbon atom or via a carbon atom and an oxygen atom, and a trialkoxysilyl group bonded to a silicon atom via a carbon atom or via a carbon atom and an oxygen atom.