Abstract:
The disclosed MMW wave sensing camera calibration arrangement that generally includes a millimeter wave camera that uses an energy emission calibration panel as a calibration standard. The MMW camera is positioned opposite the calibration panel in the MMW camera's field-of-view. The calibration panel is held at a constant temperature to provide a standard emission of millimeter waves that is sensed by an MMW sensor to set or otherwise calibrate the MMW camera to a baseline emissivity value corresponding to the panel. The MMW camera is linked to a microprocessor and non-transient computer memory containing a calibration routine that is configured to reset the baseline only when nothing obstructs the calibration panel's field-of-view. A visual display is linked to the MMW camera and configured to display an MMW signature of a metal object that is disposed on a person's body when the person's body is in the field-of-view, the metal object concealed by clothing worn over the person's body.
Abstract:
A composite panel for a vehicle includes a plurality of layers bonded together by resin. A sensing assembly is arranged between at least two of the plurality of layers. The sensing assembly includes at least one of a piezoelectric layer to sense vibration of the composite panel when installed on the vehicle and a thermopile configured to sense changes in temperature of the composite panel when installed on the vehicle. The sensing assembly further includes a transmitter configured to transmit data to the vehicle based on an output of the at least one of the piezoelectric layer and the thermopile.
Abstract:
A wearable device includes a case and a far infrared temperature sensing device. The case has a first opening. The far infrared temperature sensing device is disposed inside the case of the wearable device. The far infrared temperature sensing device includes an assembly structure, a sensor chip, a filter structure, and a metal shielding structure. The assembly structure has an accommodating space and a top opening. The sensor chip is disposed in the accommodating space of the assembly structure. The filter structure is disposed above the sensor chip. The metal shielding structure is disposed above the sensor chip, and has a second opening to expose the filter structure. The first and second openings are communicated to cooperatively define a through hole.
Abstract:
A temperature monitoring system for a substrate heating furnace includes a temperature monitor, and the temperature monitor is located on a prong of a mechanical arm which is configured to fetch and place a substrate. The temperature monitor is configured to monitor the temperature of the substrate which has been heated by the substrate heating furnace and is located on the prong.