公开(公告)号：US20060138679A1

公开(公告)日：2006-06-29

申请号：US11357024

申请日：2006-02-21

申请人： Naoki Kawanabe ,  Tomoo Matsuzawa ,  Toshiaki Morita ,  Takafumi Nishita

发明人： Naoki Kawanabe ,  Tomoo Matsuzawa ,  Toshiaki Morita ,  Takafumi Nishita

IPC分类号： H01L23/52

CPC分类号： H01L24/85 ,  H01L21/565 ,  H01L23/3128 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/97 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2224/4807 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48453 ,  H01L2224/48455 ,  H01L2224/48465 ,  H01L2224/4847 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48724 ,  H01L2224/49171 ,  H01L2224/49431 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/78704 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/01202 ,  H01L2924/01204 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/351 ,  H01L2924/01046 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48744 ,  H01L2924/00015 ,  H01L2924/0102 ,  H01L2924/013 ,  H01L2924/01004 ,  H01L2924/00013 ,  H01L2924/01006

摘要： A semiconductor device with improved the adhesion between bonding pads and ball portions of gold wires is provided to improve the reliability of a semiconductor device. About 1 wt. % of Pd is contained in gold wires for connection between electrode pads formed on a wiring substrate and electrode pads (exposed areas of a top layer wiring formed mainly of Al) formed on a semiconductor chip. In bonded portions between the electrode and ball portions of the gold wires, an interdiffusion of Au and Al is suppressed to prevent the formation of Au4Al after PCT (Pressure Cooker Test). Thus, a desired bonding strength is obtained even when the pitch of the electrode pads is smaller than 65 μm and the diameter of the ball portion is smaller than 55 μm or the diameter of the wire portion of each gold wire is not larger than 25 μm.

摘要翻译： 提供了提高接合焊盘和金线的球部之间的粘附性的半导体器件，以提高半导体器件的可靠性。 约1重量％ 用于在形成在布线基板上的电极焊盘和形成在半导体芯片上的电极焊盘（主要由Al形成的顶层布线的暴露区域）之间的连接的金线中包含Pd的％。 在金线的电极和球部之间的接合部分中，抑制了Au和Al的相互扩散，以防止在PCT（压力锅试验）之后形成Au 4 Al。 因此，即使当电极焊盘的间距小于65μm并且球部的直径小于55μm或每个金线的线部分的直径不大于25μm时，也获得期望的接合强度 。

公开(公告)号：US20060071860A1

公开(公告)日：2006-04-06

申请号：US11206166

申请日：2005-08-18

申请人： Hiroshi Hozoji ,  Toshiaki Morita ,  Satoru Shigeta ,  Tokihito Suwa

发明人： Hiroshi Hozoji ,  Toshiaki Morita ,  Satoru Shigeta ,  Tokihito Suwa

IPC分类号： H01Q1/38

CPC分类号： H02M7/003 ,  H01L24/37 ,  H01L24/40 ,  H01L24/84 ,  H01L24/91 ,  H01L24/95 ,  H01L25/072 ,  H01L2224/16245 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/37611 ,  H01L2224/37644 ,  H01L2224/37655 ,  H01L2224/4007 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40225 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2224/0401

摘要： The inverter has a plurality of arms for conducting or cutting off a current and each arm has a switching device and a first and a second wiring layer for connecting the switching device. The first and second wiring layers of each arm are respectively formed on insulating substrates, and one face of the switching device is fixed to the first wiring layer, and the second wiring layer and the other face of the switching device are electrically connected by a laminal conductor, and the laminal conductor has a first and a second connection, and the first connection of the laminal conductor is fixed to the other face of the switching device, and the second connection of the laminal conductor is fixed to the second wiring layer. Thereby, a large current of the inverter can be realized and the assembly capacity of the inverter or the vehicle drive unit will be improved.

公开(公告)号：US07015127B2

公开(公告)日：2006-03-21

申请号：US10408119

申请日：2003-04-08

申请人： Yasuyuki Nakajima ,  Toshiaki Morita ,  Tomoo Matsuzawa ,  Seiichi Tomoi ,  Naoki Kawanabe

发明人： Yasuyuki Nakajima ,  Toshiaki Morita ,  Tomoo Matsuzawa ,  Seiichi Tomoi ,  Naoki Kawanabe

IPC分类号： H01L21/44

CPC分类号： H01L24/05 ,  H01L23/53223 ,  H01L24/03 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05187 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4807 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48453 ,  H01L2224/48465 ,  H01L2224/48507 ,  H01L2224/48624 ,  H01L2224/49175 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/0496 ,  H01L2924/05042 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20106 ,  H01L2924/20305 ,  H01L2924/20306 ,  H01L2924/20307 ,  H01L2924/20308 ,  H01L2924/20752 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/04953 ,  H01L2924/00 ,  H01L2924/20751 ,  H01L2924/00012

摘要： Provided is a semiconductor device comprising a first metal film formed above a semiconductor chip, a ball portion formed over said first metal film and made of a second metal, and an alloy layer of said first metal and said second metal which alloy layer is formed between said first metal film and said ball portion, wherein said alloy layer reaches the bottom of said first metal film, and said ball portion is covered with a resin; and a manufacturing method thereof. The present invention makes it possible to improve adhesion between the bonding pad portion and ball portion of a bonding wire over an interconnect, thereby improving the reliability of the semiconductor device.

公开(公告)号：US20050035449A1

公开(公告)日：2005-02-17

申请号：US10807249

申请日：2004-03-24

申请人： Naoki Kawanabe ,  Tomoo Matsuzawa ,  Toshiaki Morita ,  Takafumi Nishita

发明人： Naoki Kawanabe ,  Tomoo Matsuzawa ,  Toshiaki Morita ,  Takafumi Nishita

IPC分类号： H01L21/60 ,  H01L21/56 ,  H01L21/603 ,  H01L23/31 ,  H01L23/49 ,  H01L23/495

CPC分类号： H01L24/85 ,  H01L21/565 ,  H01L23/3128 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/97 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2224/4807 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48453 ,  H01L2224/48455 ,  H01L2224/48465 ,  H01L2224/4847 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48724 ,  H01L2224/49171 ,  H01L2224/49431 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/78704 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/01202 ,  H01L2924/01204 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/351 ,  H01L2924/01046 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48744 ,  H01L2924/00015 ,  H01L2924/0102 ,  H01L2924/013 ,  H01L2924/01004 ,  H01L2924/00013 ,  H01L2924/01006

摘要： A method is provided to improve adhesion between bonding pads and ball portions of gold wires to improve reliability of a semiconductor device. About 1 wt. % of Pd is contained in gold wires for connection between electrode pads formed on a wiring substrate and electrode pads (exposed areas of a top layer wiring formed mainly of Al) formed on a semiconductor chip. In bonded portions between the electrode and ball portions of the gold wires, an interdiffusion of Au and Al is suppressed to prevent the formation of Au4A1 after POT (Pressure Cooker Test). Thus, a desired bonding strength is obtained even when the pitch of the electrode pads is smaller than 65 pin and the diameter of the ball portion is smaller than 55 pm or the diameter of the wire portion of each gold wire is not larger than 25 pin.

摘要翻译： 提供了一种提高接合焊盘和金线球部之间粘合性的方法，以提高半导体器件的可靠性。 约1重量％ 用于在形成在布线基板上的电极焊盘和形成在半导体芯片上的电极焊盘（主要由Al形成的顶层布线的暴露区域）之间的连接的金线中包含Pd的％。 在金线的电极和球部之间的接合部分中，抑制Au和Al的相互扩散，以防止在POT（压力锅试验）之后形成Au4A1。 因此，即使当电极焊盘的间距小于65针并且球部的直径小于55μm或每个金线的线部分的直径不大于25针时，也获得期望的接合强度 。

公开(公告)号：USD474810S1

公开(公告)日：2003-05-20

申请号：US29160975

申请日：2002-05-20

申请人： Toshiaki Morita

设计人： Toshiaki Morita

公开(公告)号：US06422045B1

公开(公告)日：2002-07-23

申请号：US09958827

申请日：2001-10-15

申请人： Toshiaki Morita ,  Klaus Ruoff

发明人： Toshiaki Morita ,  Klaus Ruoff

IPC分类号： D04B3506

CPC分类号： D04B35/06

摘要： A compound needle has blades of a slider having tongues formed by two superposed blades accommodated in a blade accommodating groove formed in a needle body. The blades are provided with bends to bring side surfaces of the blades accommodated in the blade groove in the needle body into press-contact with side walls of the groove. Front end portions of the blades can thus be held in positions that are equally divided to the right and left with respect to the widthwise direction of the blade groove from a widthwise center of the groove to more reliably center the blades in the blade groove.

摘要翻译： 复合针具有滑块的刀片，其具有由形成在针体中的刀片容纳槽中容纳的两个叠置的刀片形成的舌片。 叶片设置有弯曲部，以使容纳在针体中的叶片槽中的叶片的侧表面与槽的侧壁压接。 因此，叶片的前端部能够从槽的宽度方向的中心保持在相对于叶片槽的宽度方向左右相等的位置，以更可靠地使叶片在叶片槽中居中。

公开(公告)号：US06339942B1

公开(公告)日：2002-01-22

申请号：US09690740

申请日：2000-10-18

申请人： Sigmar Majer ,  Bernhard Schuler ,  Kurt Wiedenhöfer ,  Toshiaki Morita ,  Kenji Kitahara

发明人： Sigmar Majer ,  Bernhard Schuler ,  Kurt Wiedenhöfer ,  Toshiaki Morita ,  Kenji Kitahara

IPC分类号： D04B3506

CPC分类号： D04B35/32 ,  D04B35/06

摘要： A compound needle comprises a closing element with two closing element springs. These are designed to be asymmetrical relative to each other or at least provided with clearances or openings which, during the operation of the compound needle, are made to overlap with a corresponding cutout or other openings in the basic compound needle member, so that deposits can be removed to the needle channel. An asymmetric design of the closing element springs prevents the closing element from being wedged into the closing element channel, even if the deposit removal is incomplete. As a result, the compound needle wear is reduced considerably and the operational safety is increased.

摘要翻译： 复合针包括具有两个闭合元件弹簧的闭合元件。 这些被设计为相对于彼此不对称或至少设置有间隙或开口，其在复合针的操作期间与基本复合针构件中的相应切口或其他开口重叠，使得沉积物 被移除到针通道。 关闭元件弹簧的不对称设计防止关闭元件楔入闭合元件通道，即使沉积物移除不完整。 结果，复合针磨损显着降低，操作安全性增加。

公开(公告)号：US5630260A

公开(公告)日：1997-05-20

申请号：US377974

申请日：1995-01-25

申请人： Toshiaki Morita ,  Akihiro Otani

发明人： Toshiaki Morita ,  Akihiro Otani

IPC分类号： B65H45/103 ,  A41H43/00 ,  A41H43/02 ,  B65H31/30 ,  D06H7/00

CPC分类号： A41H43/005 ,  A41H43/0207 ,  Y10S112/02 ,  Y10S83/937

摘要： A running carriage (33) delivers, spreads, and piles a sheet material to be spread to form a piled sheet material (24), while running on a spreading table (22) of a cloth spreading machine (21). The piled sheet material (24) is placed on an underlay sheet (25) which has a larger area than that of the piled sheet material (24). At the bottom of the running carriage (33), a foot presser (27) is provided. The foot presser (27) is designed to be vertically displaced by a cylinder (28). A blower motor (29) drives a fan (30) to blow air through nozzles (31) towards the surface of the spreading table (22), thereby reducing the load of the piled sheet material (24). The underlay sheet (25) is pressed by the foot presser (27) and the running carriage (33) starts running, whereby the piled sheet material (24) is delivered.

摘要翻译： 运行的托架（33）在铺布机（21）的铺展台（22）上运行时，传送，铺展和堆叠待铺展的片材以形成堆叠的片材（24）。 堆叠的片材（24）被放置在面积大于堆叠的片材（24）的底片（25）上。 在行驶托架（33）的底部设有脚踏按压器（27）。 脚踏按压器（27）设计成由气缸（28）垂直移位。 鼓风机马达（29）驱动风扇（30）将空气通过喷嘴（31）吹向扩展台（22）的表面，从而减小堆叠的片材（24）的载荷。 底垫（25）由脚踏按压器（27）按压，运行滑架（33）开始运转，由此输送堆积的片材（24）。

公开(公告)号：US5369966A

公开(公告)日：1994-12-06

申请号：US76624

申请日：1993-06-15

申请人： Toshiaki Morita ,  Hirokazu Nishitani

发明人： Toshiaki Morita ,  Hirokazu Nishitani

IPC分类号： D04B15/56 ,  D04B7/26 ,  D04B15/16 ,  D04B15/58 ,  D04B15/60

CPC分类号： D04B7/26 ,  D04B1/126

摘要： In order to process yarn preliminarily, and to change over yarn precisely at a desired knitting position, the yarn fed to a flat knitting machine is processed by a yarn processing device. To change over the yarn at a changeover position of knitted fabric, it is necessary to actuate the yarn processing device preliminarily at an actuating position C. A controller calculates the actuating position from a set value in a setting circuit and pattern information from a memory. When an encoder detects that a position of feeding the yarn to a knitting needle has reached the actuating position, the yarn processing device is actuated. The length of the yarn from a yarn processing position to the actuating position is nearly equal to the sum of a knitting loop length from the actuating position to the changeover position.

摘要翻译： 为了预先处理纱线，并且在期望的编织位置精确地切换纱线，通过纱线处理装置对供给到横机的纱线进行加工。 为了在针织物的切换位置切换纱线，需要预先在致动位置C致动纱线处理装置。控制器根据设定电路中的设定值和来自存储器的图案信息计算起动位置。 当编码器检测到纱线馈送到织针的位置已经到达致动位置时，纱线处理装置被致动。 从纱线处理位置到致动位置的纱线长度几乎等于从致动位置到切换位置的编织线圈长度的总和。

公开(公告)号：US5272765A

公开(公告)日：1993-12-21

申请号：US785249

申请日：1991-11-04

申请人： Hideaki Tanaka ,  Yoshihiro Kitamura ,  Toshiaki Morita

发明人： Hideaki Tanaka ,  Yoshihiro Kitamura ,  Toshiaki Morita

IPC分类号： G06K9/68 ,  G06K9/62

CPC分类号： G06K9/6807

摘要： A system for processing character provides assumed reference lines extending along the direction of a character image string. The distances between the portions of character images and the reference line are compared and the character images are classified into one of character groups in accordance with the distances.

摘要翻译： 用于处理字符的系统提供沿着字符图像串的方向延伸的假设参考线。 比较字符图像和参考线的部分之间的距离，并且根据距离将字符图像分类为字符组之一。