SUBSTRATE TREATMENT APPARATUS
    72.
    发明公开

    公开(公告)号:US20240272562A1

    公开(公告)日:2024-08-15

    申请号:US18644211

    申请日:2024-04-24

    摘要: A substrate treatment apparatus, comprising: a coating device configured to coat a substrate, which is conveyed at a first speed in a feeding direction, with a material; a drying device configured to receive the substrate, which is coated by means of the coating device, at the first speed and dry the material; an exposure device configured to receive the substrate, which is dried by means of the drying device, at the first speed and continuously convey a mask at the first speed in the feeding direction, the mask being used for regional shading during exposure of the material by means of the exposure device; and an etching device configured to receive the substrate, which is exposed by means of the exposure device, at the first speed and etch the material and a portion of the substrate in an unexposed region of the substrate.

    MONITORING SYSTEM FOR MANUFACTURING SEMICONDUCTOR DEVICE AND MONITORING METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE USING THE SAME

    公开(公告)号:US20240272559A1

    公开(公告)日:2024-08-15

    申请号:US18455277

    申请日:2023-08-24

    IPC分类号: G03F7/00 H01L21/66

    摘要: A monitoring system for manufacturing a semiconductor device comprises a source module, an optical module including a collector collecting and reflecting extreme ultraviolet generated light from the source module, an illumination optical system including a field facet mirror, and a projection optical system transferring the extreme ultraviolet light reflected from a reticle to a substrate. A calculating module calculates a degradation rate of the optical module, and a method comprises respectively generating a reference image profile and an (N)th image profile through the second sensor module by correcting the far field image of the extreme ultraviolet with respect to the intensity of the extreme ultraviolet at a reference time point and an (N)th time point after the reference time point, and calculating the degradation rate of the optical module by using a ratio of the reference image profile and the (N)th image profile by the calculation module.

    EXPOSURE APPARATUS
    77.
    发明公开
    EXPOSURE APPARATUS 审中-公开

    公开(公告)号:US20240264541A1

    公开(公告)日:2024-08-08

    申请号:US18612799

    申请日:2024-03-21

    IPC分类号: G03F7/00 G03F7/20

    摘要: An exposure apparatus includes a conveying mechanism and an exposure mechanism. The conveying mechanism is configured to convey a substrate, a surface of the substrate being coated with photoresist. The exposure mechanism includes an exposure source and an exposure member. The exposure source is configured to provide light to the substrate. The exposure member includes an exposure section opposite the substrate, where the exposure section is located between the exposure source and the substrate and disposed in close proximity to the substrate, the exposure section has a light-transmitting portion that allows light to be incident on the substrate and a light-shielding portion that prevents light from being incident on the substrate, and the exposure section is configured to keep the light-transmitting portion and the light-shielding portion in synchronized movement with the substrate.

    SCANNING INTERFERENCE LITHOGRAPHIC SYSTEM
    78.
    发明公开

    公开(公告)号:US20240264534A1

    公开(公告)日:2024-08-08

    申请号:US17767416

    申请日:2020-10-23

    IPC分类号: G03F7/00

    摘要: Disclosed is a scanning interference photolithography system, comprising a heterodyne optical path, a first interference optical path, a second interference optical path, a motion platform and a control subsystem, wherein a substrate is carried on the motion platform, a displacement measurement interferometer is used to measure the displacement of the motion platform, a first light beam and a second light beam are focused on the substrate for interference exposure; the control subsystem generates instructions according to various measurement information, adjusts angles of corresponding devices or the phase of a light beam, and locks the phase shift of interference exposure fringes of the first light beam and the second light beam. The system has a high precision of fringe pattern locking and a high laser utilization rate, and can be used for producing a large-area high-precision dense grating line gradient periodic grating.