MONITORING SYSTEM FOR MANUFACTURING SEMICONDUCTOR DEVICE AND MONITORING METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE USING THE SAME

    公开(公告)号:US20240272559A1

    公开(公告)日:2024-08-15

    申请号:US18455277

    申请日:2023-08-24

    IPC分类号: G03F7/00 H01L21/66

    摘要: A monitoring system for manufacturing a semiconductor device comprises a source module, an optical module including a collector collecting and reflecting extreme ultraviolet generated light from the source module, an illumination optical system including a field facet mirror, and a projection optical system transferring the extreme ultraviolet light reflected from a reticle to a substrate. A calculating module calculates a degradation rate of the optical module, and a method comprises respectively generating a reference image profile and an (N)th image profile through the second sensor module by correcting the far field image of the extreme ultraviolet with respect to the intensity of the extreme ultraviolet at a reference time point and an (N)th time point after the reference time point, and calculating the degradation rate of the optical module by using a ratio of the reference image profile and the (N)th image profile by the calculation module.