公开(公告)号：US20150214084A1

公开(公告)日：2015-07-30

申请号：US14168056

申请日：2014-01-30

Applicant: Infineon Technologies AG

Inventor： Germar Schneider ,  Matthias Taubert ,  Michael Mitrach ,  Thomas Gadau ,  Markus Pfeifenberger ,  Walter Leitgeb ,  Frank Boenewitz

IPC: H01L21/673

CPC classification number: H01L21/6773 ,  H01L21/67161 ,  H01L21/67373 ,  H01L21/67376 ,  H01L21/67379 ,  H01L21/67383 ,  H01L21/67389 ,  H01L21/67396 ,  H01L21/67733

Abstract: According to various embodiments, a frame cassette may include: a housing; a mounting structure inserted in the housing, the mounting structure including a plurality of tape-frame slots, wherein each tape-frame slot is configured to receive a tape-frame, wherein the housing includes an opening to introduce a tape-frame into a tape-frame slot of the plurality of tape-frame slots or to remove a tape-frame from a tape-frame slot of the plurality of tape-frame slots, and a door mounted at the housing, wherein the door is configured to close the opening of the housing to seal the interior of the housing from the exterior of the housing.

Abstract translation: 根据各种实施例，框架盒可以包括：壳体; 安装结构，其插入到所述壳体中，所述安装结构包括多个带框架狭槽，其中每个带框架槽被配置为接收带框架，其中所述壳体包括用于将带框架引入带的开口 或者从所述多个带框架槽的带框架槽中移除带框架，以及安装在所述壳体上的门，其中所述门被构造成关闭所述开口 以将壳体的内部从外壳的外部密封。

公开(公告)号：US20120181215A1

公开(公告)日：2012-07-19

申请号：US13351911

申请日：2012-01-17

Applicant: Ray G. Brooks ,  Timothy Wayne Brooks

Inventor： Ray G. Brooks ,  Timothy Wayne Brooks

IPC: B65D85/86

CPC classification number: H01L21/67369 ,  H01L21/67383 ,  H01L21/67396

Abstract: The packaging system includes an enclosure having an interior volume. A wafer stack, comprising plural wafers and separators in contact with the wafers, is located in the interior volume. The separators have raised bumps extending from each side. The bumps create spaces that allow air to flow therethrough. The separator film intercepts and captures airborne molecular contaminants belonging to organic and inorganic chemical families. In addition, the film is dissipative to static discharge. Furthermore, the bumps provided by the separators protect the fragile wafers from damage due to mechanical shock. The separators are also provided with a peripheral ring or embossment, which contacts the wafer edges and further protects the wafers from damage to mechanical shock. Air cushions can be provided in the wafer stack, which cushions are provided with bands to regulate the compression.

Abstract translation: 包装系统包括具有内部容积的外壳。 包括多个晶片和与晶片接触的分离器的晶片堆叠位于内部体积中。 分离器具有从每一侧延伸的凸起。 这些凸块产生允许空气流过其中的空间。 分离膜拦截并捕获属于有机和无机化学家族的空气中的分子污染物。 此外，该薄膜耗散静电放电。 此外，由分离器提供的凸起保护脆弱的晶片免受机械冲击的损坏。 分离器还设置有周边环或压花，其接触晶片边缘并进一步保护晶片免受机械冲击的损害。 可以在晶片堆叠中提供空气垫，该衬垫设置有用于调节压缩的带。

公开(公告)号：US07886910B2

公开(公告)日：2011-02-15

申请号：US10496756

申请日：2002-11-26

Applicant: Gregory Bores ,  Suraj Kalia ,  Anthony Mathius Tieben

Inventor： Gregory Bores ,  Suraj Kalia ,  Anthony Mathius Tieben

IPC: B65D85/00

CPC classification number: H01L21/67373 ,  H01L21/67396 ,  Y10T29/49117

Abstract: A front opening wafer carrier formed principally of plastic and comprising an enclosure portion (20) and a door (24) has a path to ground with respect to the wafers (22), the path to ground effectuated by the door (24). The base “ground” may be provided at the machine interface upon which the carrier sits, or through the robotic arm that grasps, operates and moves the door (24).

Abstract translation: 主要由塑料形成并且包括外壳部分（20）和门（24）的前开口晶片载体具有相对于晶片（22）接地的路径，该路径由门（24）实现。 基座“接地”可以设置在承载件所在的机器接口处，或者通过抓握，操作和移动门（24）的机器人臂来提供。

公开(公告)号：US07842205B2

公开(公告)日：2010-11-30

申请号：US10740417

申请日：2003-12-22

Applicant: Shunpei Yamazaki ,  Noriyuki Matsuda

Inventor： Shunpei Yamazaki ,  Noriyuki Matsuda

IPC: B29C73/00 ,  G06Q30/00 ,  B65D25/14 ,  B65D85/00

CPC classification number: H01L21/67396 ,  G06Q10/083 ,  G06Q10/0837 ,  H01L21/67276

Abstract: The present invention provides a manufacturing method by which a substrate (typically, a TFT substrate) can be installed directly in a treatment apparatus by using a transfer container without shifting the substrate from the transfer container to another container. It is possible to use the container efficiently and transfer different substrates in size with one container. A manufacturing method in which a substrate is directly installed in an electrostatic-protected transfer container by a substrate supplier, and then the container is directly installed in a treatment apparatus by a substrate demander after transferring can be realized, thereby making it possible to transfer substrates such as a TFT substrate. A contamination of a substrate due to particles and electrostatic discharge damage of a TFT substrate can be avoided because a transferring operation is not needed. A manufacturing method in which a substrate holding portion of the container is replaced depending on the size of a substrate and different substrates in size can be transferred with one container may be employed.

Abstract translation: 本发明提供一种可以通过使用转移容器将基板（通常为TFT基板）直接安装在处理装置中而不将基板从转印容器移动到另一容器的制造方法。 有效地使用容器并且可以用一个容器传送不同的尺寸的基底。 通过基板供给器将基板直接安装在静电保护的转移容器中，然后在转印之后将容器通过基板要求者直接安装在处理装置中，从而可以将基板 例如TFT基板。 由于不需要转印操作，可以避免由于颗粒引起的基板污染和TFT基板的静电放电损坏。 根据基板的尺寸和尺寸不同的基板可以使用一个容器来转移容器的基板保持部分的制造方法。

公开(公告)号：US20080093256A1

公开(公告)日：2008-04-24

申请号：US11958169

申请日：2007-12-17

Applicant: Michael Johnson ,  Barry Rauworth

Inventor： Michael Johnson ,  Barry Rauworth

IPC: B65D85/00

CPC classification number: H01L21/67359 ,  G03F1/66 ,  H01L21/67369 ,  H01L21/67396

Abstract: A container suitable for storing and transporting photomasks and including a container body, a cover, first and second cushions and left and right channels disposed in slots formed in the container body. In one embodiment, the container of this invention is formed in a one-piece design by rotomolding. The cover is subsequently separated from the body and machined so as to provide a slidingly sufficient seal and disposed therein.

Abstract translation: 适用于储存和运输光掩模并包括容器主体，盖子，第一和第二垫子以及设置在容器主体中形成的槽中的左右通道的容器。 在一个实施例中，本发明的容器通过滚塑成型为一体式设计。 随后将盖与主体分离并加工，以提供滑动充分的密封并且设置在其中。

公开(公告)号：US20080035514A1

公开(公告)日：2008-02-14

申请号：US11640887

申请日：2006-12-19

Applicant: Ming-Lung Chiu ,  Chien Feng Wang

Inventor： Ming-Lung Chiu ,  Chien Feng Wang

IPC: B65D85/48

CPC classification number: H01L21/67353 ,  H01L21/67288 ,  H01L21/67294 ,  H01L21/67359 ,  H01L21/67369 ,  H01L21/67373 ,  H01L21/67383 ,  H01L21/67393 ,  H01L21/67396

Abstract: The present invention relates to a metal photomask box structure, which is composed of an upper cover member, a lower cover member, and a ring-shaped airtight washer positioned between the upper metal cover member and the lower metal cover member. At least a movable connecting mechanism is disposed on one side of the metal photomask box to connect the upper metal cover member and the lower metal cover member. And at least a latch piece is disposed on an opposite side of the movable connecting mechanism to latch the upper metal cover member and the lower metal cover member.

Abstract translation: 金属光掩模盒结构技术领域本发明涉及一种金属光掩模盒结构，其由上盖构件，下盖构件和位于上金属盖构件和下金属盖构件之间的环形气密垫圈构成。 至少一个可移动连接机构设置在金属光掩模盒的一侧上，以连接上金属盖构件和下金属盖构件。 并且至少一个闩锁件设置在可动连接机构的相对侧上，以将上金属盖构件和下金属盖构件锁住。

公开(公告)号：US07316325B2

公开(公告)日：2008-01-08

申请号：US10982401

申请日：2004-11-05

Applicant: John Burns ,  Matthew A. Fuller ,  Jeffery J. King ,  Martin L. Forbes ,  Mark V. Smith

Inventor： John Burns ,  Matthew A. Fuller ,  Jeffery J. King ,  Martin L. Forbes ,  Mark V. Smith

IPC: A47G19/08

CPC classification number: H01L21/67396

Abstract: A substrate carrier to dissipate electrostatic charge has a conductive grid or network overmolded in a substantially integral container. The grid is electrically connected to an underlying and grounded saddle. The carrier may further include substantially transparent side walls and electrically conductive shelves to retain stored substrates in a generally axial alignment.

Abstract translation: 耗散静电电荷的衬底载体具有在基本上一体的容器中包覆模制的导电栅格或网络。 电网电连接到底层和接地的鞍座上。 载体还可以包括基本上透明的侧壁和导电架，以将所存储的基板保持在大致轴向对准。

公开(公告)号：US20070126322A1

公开(公告)日：2007-06-07

申请号：US11295026

申请日：2005-12-05

Applicant: Chian-Chen Chiou ,  Chi-Chien Chang ,  Shun Hsieh ,  Yi Lin ,  Hsiao-Lung Sun ,  Nien-Hua Chang

Inventor： Chian-Chen Chiou ,  Chi-Chien Chang ,  Shun Hsieh ,  Yi Lin ,  Hsiao-Lung Sun ,  Nien-Hua Chang

IPC: A47B97/00

CPC classification number: B62B3/006 ,  H01L21/67359 ,  H01L21/67396 ,  H01L21/67724 ,  H05F3/04

Abstract: A novel vehicle which is suitable for transporting and/or temporarily storing objects such as masks or reticles and is effective in eliminating or preventing electrostatic discharges on the masks, reticles or other objects. The vehicle includes a frame for receiving the objects and at least one ESD eliminator provided on the frame for neutralizing electrostatic charges on the objects. Neutralization of the electrostatic charges prevents electrostatic discharges from damaging microelectronic circuits, for example, on the masks, reticles or other objects.

Abstract translation: 适用于传输和/或临时存储诸如掩模或掩模版的物体的新型载体，并且有效地消除或防止对掩模，掩模版或其它物体的静电放电。 车辆包括用于接收物体的框架和设置在框架上的用于中和物体上的静电电荷的至少一个ESD消除器。 静电电荷的中和可以防止静电放电损坏微电子电路，例如在掩模，掩模版或其他物体上。

公开(公告)号：US07223690B2

公开(公告)日：2007-05-29

申请号：US10976040

申请日：2004-10-29

Applicant: Fumio Kondo ,  Koji Mishima ,  Akira Tanaka ,  Yoko Suzuki ,  Tetsuji Togawa ,  Hiroaki Inoue

Inventor： Fumio Kondo ,  Koji Mishima ,  Akira Tanaka ,  Yoko Suzuki ,  Tetsuji Togawa ,  Hiroaki Inoue

IPC: H01L21/4763 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L21/67161 ,  B24B37/005 ,  B24B37/042 ,  B24B37/245 ,  B24B37/345 ,  B24B41/061 ,  B24B49/16 ,  C23C18/1632 ,  C23C18/1653 ,  C25D7/123 ,  H01L21/02074 ,  H01L21/02087 ,  H01L21/0209 ,  H01L21/288 ,  H01L21/2885 ,  H01L21/3212 ,  H01L21/67167 ,  H01L21/67173 ,  H01L21/67184 ,  H01L21/67219 ,  H01L21/6723 ,  H01L21/67393 ,  H01L21/67396 ,  H01L21/67772 ,  H01L21/7684 ,  H01L21/76843 ,  H01L21/76849 ,  H01L21/76864 ,  H01L21/76873 ,  H01L21/76874 ,  H01L21/76877

Abstract: A substrate processing method comprising steps for forming a copper film on a surface of a substrate. These steps includes the step of filling a first metal in the trenches so as to form a plated film of the first metal on an entire surface of the substrate by electroplating, wherein the electromagnetic field is adjusted by the virtual anode so that differences of thickness of the plated film between the central portion and the peripheral portion of the substrate being minimized, and polishing and removing the plated film by pressing the substrate to the polishing surface, wherein the pressures pressing the substrate to the polishing surface at a central portion and a peripheral portion are adjusted.

Abstract translation: 一种基板处理方法，包括在基板的表面上形成铜膜的步骤。 这些步骤包括在沟槽中填充第一金属以便通过电镀在基板的整个表面上形成第一金属的镀膜的步骤，其中电磁场由虚拟阳极调节，使得厚度差异 基板的中心部分和周边部分之间的镀膜最小化，并且通过将基板压在研磨表面上来研磨和去除镀膜，其中将基板压在抛光表面的压力在中心部分和周边 部分进行调整。

公开(公告)号：US20070006442A1

公开(公告)日：2007-01-11

申请号：US11172832

申请日：2005-07-05

Applicant: Kuo-Wei Liang

Inventor： Kuo-Wei Liang

IPC: B23P11/00 ,  B21D39/00

CPC classification number: H01L21/67353 ,  H01L21/67363 ,  H01L21/67373 ,  H01L21/67396 ,  Y10T29/49908 ,  Y10T29/49915 ,  Y10T29/49922 ,  Y10T29/49924

Abstract: The present invention is improving stamping process and structure of anti-magnetic cover. The said anti-magnetic cover is laid over electronic component for preventing the interference of electromagnetic wave. During stamping the said anti-magnetic cover, two plate materials are fed into one cavity from different directions. After stamping process, a frame and an upper cover are formed, where around the frame female latching parts are formed and around the corresponding positions on the upper cover male latching parts are formed. The design of male and female parts makes it easier to disassemble as well as to maintain the upper cover and thus avoid the necessity of exchanging the anti-magnetic cover.

Abstract translation: 本发明改进了抗磁盖的冲压工艺和结构。 所述防磁罩放置在电子部件上，以防止电磁波的干扰。 在冲压所述防磁罩的过程中，两块板材从不同的方向进入一个空腔。 在冲压加工之后，形成框架和上盖，其中形成框架阴闩锁部分周围，并且围绕上盖的相应位置形成阳闩锁部分。 男性和女性部件的设计使拆卸更容易，并保持上盖，从而避免了更换防磁罩的必要性。