公开(公告)号：US11906291B2

公开(公告)日：2024-02-20

申请号：US17145966

申请日：2021-01-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eunkyu Lee ,  Yeonchoo Cho ,  Sangwon Kim ,  Kyung-Eun Byun ,  Hyunjae Song ,  Hyeonjin Shin

IPC: G01B15/02 ,  G01N23/2208 ,  H01L21/285 ,  H01L21/66 ,  H01L29/45 ,  G01N23/2273

CPC classification number: G01B15/02 ,  G01N23/2208 ,  G01N23/2273 ,  H01L21/28512 ,  H01L22/12 ,  H01L29/45 ,  G01N2223/085 ,  G01N2223/61

Abstract: A method of calculating a thickness of a graphene layer and a method of measuring a content of silicon carbide, by using X-ray photoelectron spectroscopy (XPS), are provided. The method of calculating the thickness of the graphene layer, which is directly grown on a silicon substrate, includes measuring the thickness of the graphene layer directly grown on the silicon substrate, by using a ratio between a signal intensity of a photoelectron beam emitted from the graphene layer and a signal intensity of a photoelectron beam emitted from the silicon substrate.

公开(公告)号：US11676530B2

公开(公告)日：2023-06-13

申请号：US17508373

申请日：2021-10-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jeongryeol Seo ,  Sangwon Kim ,  Youngkook Kim

IPC: G09G3/30 ,  G09G3/36 ,  G09G3/32

CPC classification number: G09G3/32 ,  G09G2300/026 ,  G09G2360/04 ,  G09G2370/06 ,  G09G2370/16

Abstract: A display apparatus of a plurality of display apparatuses constituting a wall display includes a first board, a second board, and a plurality of display modules. The first board includes a first communication interface including a circuitry for wireless transmission, and a timing controller configured to, in response to information on an image being received, generate a plurality of driving signals for driving the plurality of display modules based on the received information and transmit the plurality of driving signals to the second board through the first communication interface. The second board includes a second communication interface including circuitry for wireless reception, a plurality of interfaces electrically connected to the plurality of display modules, and an IC chip configured to, based on the plurality of driving signals being received through the second interface, provide each of the received driving signals to each of the display modules.

公开(公告)号：US10317704B2

公开(公告)日：2019-06-11

申请号：US14644488

申请日：2015-03-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taeho Kim ,  Sungwoo Hwang ,  Sangwon Kim ,  Hoyoung Ahn ,  Daeyoung Chung

IPC: G02C7/02 ,  G02C11/00 ,  G02C7/04

Abstract: Example embodiments disclose a smart contact lens for augmented reality and methods of manufacturing and operating the smart contact lens. The smart contact lens includes a first contact lens, a display unit in a center region of the first contact lens, a peripheral device on the first contact lens and around the display unit, the peripheral device being connected to the display unit, and a passivation layer covering the display unit and the peripheral device. The method of manufacturing the smart contact lens includes forming a display unit; mounting the display unit in a center region of a first contact lens, forming a peripheral device on the first contact lens, around the display unit and in connection with the display unit, and forming a passivation layer to cover the display unit and the peripheral device.

公开(公告)号：US10153163B2

公开(公告)日：2018-12-11

申请号：US15611935

申请日：2017-06-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyeonjin Shin ,  Sangwon Kim ,  Seongjun Park

IPC: H01L21/033 ,  H01L21/02 ,  C08K3/38 ,  C08K3/30 ,  C08K5/56 ,  C08K3/22 ,  C09D7/63 ,  C09D7/61 ,  G03F7/09 ,  H01L21/311

Abstract: Example embodiments relate to a hardmask composition and/or a method of forming a fine pattern by using the hardmask composition, wherein the hardmask composition includes at least one of a two-dimensional layered nanostructure and a precursor thereof, and a solvent, and an amount of the at least one of a two-dimensional layered nanostructure and the precursor is about 0.01 part to about 40 parts by weight based on 100 parts by weight of the hardmask composition.

公开(公告)号：US09989853B2

公开(公告)日：2018-06-05

申请号：US14791912

申请日：2015-07-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyeonjin Shin ,  Sangwon Kim ,  Seongjun Park

IPC: G03F7/11 ,  H01L21/47 ,  H01L21/4757 ,  C08K3/38 ,  C08K3/30 ,  G03F7/40 ,  C08G83/00 ,  G03F7/09

Abstract: A hardmask composition includes a first material including one of an aromatic ring-containing monomer and a polymer containing a repeating unit including an aromatic ring-containing monomer, a second material including at least one of a hexagonal boron nitride and a precursor thereof, a chalcogenide-based material and a precursor thereof, and a two-dimensional carbon nanostructure and a precursor thereof, the two-dimensional carbon nanostructure containing about 0.01 atom % to about 40 atom % of oxygen, and a solvent.

公开(公告)号：US20160035676A1

公开(公告)日：2016-02-04

申请号：US14681313

申请日：2015-04-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dong-Hyun Im ,  Hyun Park ,  Soongun Lee ,  Chang Seok Lee ,  Sangwon Kim ,  Seongjun Park ,  Hyeon Jin Shin ,  Hanjin Lim

IPC: H01L23/532 ,  H01L23/528 ,  H01L21/768 ,  H01L21/3213 ,  H01L29/06 ,  H01L27/108 ,  H01L21/02

CPC classification number: H01L23/53276 ,  H01L21/02527 ,  H01L21/32139 ,  H01L21/768 ,  H01L21/76834 ,  H01L21/7685 ,  H01L21/76852 ,  H01L21/76885 ,  H01L23/528 ,  H01L23/53209 ,  H01L23/53214 ,  H01L23/53223 ,  H01L23/53228 ,  H01L23/53238 ,  H01L23/53257 ,  H01L23/53266 ,  H01L23/53271 ,  H01L27/10814 ,  H01L27/10852 ,  H01L27/10855 ,  H01L27/10873 ,  H01L27/10885 ,  H01L27/10888 ,  H01L29/0642 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Semiconductor devices may include a substrate including an active region defined by a device isolation layer, source/drain regions in the active region, word lines extending in a first direction parallel to the active region and being arranged in a second direction crossing the first direction, a bit line pattern extending in the second direction and crossing over a portion of the active region positioned between the word lines, and a graphene pattern covering at least a portion of the bit line pattern.

Abstract translation: 半导体器件可以包括：衬底，其包括由器件隔离层限定的有源区，有源区中的源极/漏极区，在与有源区平行的第一方向上延伸的并且沿与第一方向交叉的第二方向布置的字线; 在第二方向上延伸并与位于字线之间的有源区的一部分交叉的位线图形，以及覆盖位线图案的至少一部分的石墨烯图案。

公开(公告)号：US20130193588A1

公开(公告)日：2013-08-01

申请号：US13733481

申请日：2013-01-03

Applicant: Samsung Electronics Co, Ltd.

Inventor： Ji-Seok Hong ,  Kwang-chul Choi ,  Sangwon Kim ,  Hyun-Jung Song ,  Eun-Kyoung Choi

IPC: H01L23/29

CPC classification number: H01L23/29 ,  H01L21/561 ,  H01L21/563 ,  H01L23/3114 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16146 ,  H01L2224/29017 ,  H01L2224/29036 ,  H01L2224/29099 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/33051 ,  H01L2224/33505 ,  H01L2224/73104 ,  H01L2224/81191 ,  H01L2224/81201 ,  H01L2224/83104 ,  H01L2224/83191 ,  H01L2224/83986 ,  H01L2224/84201 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/0665 ,  H01L2924/01014 ,  H01L2924/014 ,  H01L2924/00012

Abstract: A semiconductor package includes first and second semiconductor elements electrically interconnected by a connection structure. The first and second semiconductor elements are joined by a protection structure that includes an adhesive layer surrounded by a retention layer.

Abstract translation: 半导体封装包括通过连接结构电互连的第一和第二半导体元件。 第一和第二半导体元件通过保护结构连接，保护结构包括由保持层包围的粘合剂层。