公开(公告)号：US20070176220A1

公开(公告)日：2007-08-02

申请号：US11622670

申请日：2007-01-12

申请人： Tetsuo Takahashi ,  Tomohide Terashima

发明人： Tetsuo Takahashi ,  Tomohide Terashima

IPC分类号： H01L29/94

CPC分类号： H01L29/7397 ,  H01L21/823878 ,  H01L29/0638 ,  H01L29/0692 ,  H01L29/407 ,  H01L29/41741

摘要： A semiconductor device, including: a semiconductor substrate of a first conductivity type; a semiconductor layer of a second conductivity type formed on the semiconductor substrate; a trench formed in the semiconductor region; a trench diffusion layer of the first conductivity type formed along wall surfaces of the trench; and a buried conductor buried in the trench, wherein an insulation film is further disposed between the wall surfaces of the trench and the buried conductor.

摘要翻译： 一种半导体器件，包括：第一导电类型的半导体衬底; 形成在半导体衬底上的第二导电类型的半导体层; 形成在半导体区域中的沟槽; 沿沟槽的壁表面形成的第一导电类型的沟槽扩散层; 以及埋在沟槽中的掩埋导体，其中绝缘膜进一步设置在沟槽的壁表面和掩埋导体之间。

公开(公告)号：US07241055B2

公开(公告)日：2007-07-10

申请号：US11105365

申请日：2005-04-14

申请人： Tetsuo Takahashi ,  Manabu Komatsubara

发明人： Tetsuo Takahashi ,  Manabu Komatsubara

IPC分类号： G02B6/26

CPC分类号： G02B6/3877 ,  G02B6/4292

摘要： A screwing part 1220 is inserted into a large through-hole 1110 from its front side and is screwed together with a male screw part of a jig. A convex part 1230 in an approximately ring shape is formed at a back end part of the screwing part 1220. The convex part 1230 is adjacent to a fitting part 1111 which is made of an approximately ring convex part projecting toward inside of the large through-hole 1110. The back of the fitting part 1111 is adjacent to a front end opening part 1310 of a back tubular part 1300. In short, the fitting part 1111 of the adaptor main body 1110 is sandwiched between the convex part 1230 and the front end opening part 1310. By inserting and pressing the back end opening part 1210 of the front tubular part 1200 into the front end opening part 1310 of the back tubular part 1300, the front tubular part 1200 and the back tubular part 1300 are connected and fixed with each other. Sign β represents their pressing part.

摘要翻译： 螺纹部1220从其前侧插入大的通孔1110中，并用夹具的外螺纹部分拧紧在一起。 在螺纹部1220的后端部形成大致环形的凸部1230。 凸部1230与配置部1111相邻，该嵌合部1111由朝向大通孔1110的内侧突出的大致环状的凸部形成。 配合部1111的背面与背部管状部1300的前端开口部1310相邻。 简而言之，适配器主体1110的嵌合部1111夹在凸部1230和前端开口部1310之间。 通过将前管状部分1200的后端开口部分1210插入并压入后管状部分1300的前端开口部分1310中，前管状部分1200和后管状部分1300彼此连接并固定。 标志测试版表示他们的紧迫部分。

公开(公告)号：US06897493B2

公开(公告)日：2005-05-24

申请号：US10457658

申请日：2003-06-10

申请人： Tetsuo Takahashi ,  Katsumi Nakamura ,  Tadaharu Minato ,  Masana Harada

发明人： Tetsuo Takahashi ,  Katsumi Nakamura ,  Tadaharu Minato ,  Masana Harada

IPC分类号： H01L21/331 ,  H01L29/06 ,  H01L29/423 ,  H01L29/739 ,  H01L29/74 ,  H01L29/76 ,  H01L29/768 ,  H01L29/861 ,  H01L29/868 ,  H01L31/111

CPC分类号： H01L29/7397 ,  H01L29/0692 ,  H01L29/0696 ,  H01L29/66348 ,  H01L29/66356 ,  H01L29/7391 ,  H01L29/7455 ,  H01L29/749 ,  H01L29/861 ,  H01L29/868

摘要： A pin diode is formed by a p+ collector region, an n type buffer region, an n− region and an n+ cathode region. A trench is formed from the surface of n+ cathode region through n+ cathode region to reach n− region. An insulating film is formed along an inner wall surface of trench. A gate electrode layer is formed to oppose to the sidewall of n+ cathode region with insulating film interposed. A cathode electrode is formed to be electrically connected to n+ cathode region. An anode electrode is formed to be electrically connected to p+ collector region. The n+ cathode region is formed entirely over the surface between trenches extending parallel to each other. Thus, a power semiconductor device in which gate control circuit is simplified and which has good on property can be obtained.

摘要翻译： pin二极管由p + +集电极区，n型缓冲区，n + SUP区和n + + SUP阴极区形成。 从n + +阴极区域的表面形成沟槽，以通过n + + + / - >阴极区域形成沟槽，以达到n + - SUP区域。 绝缘膜沿沟槽的内壁表面形成。 形成与绝缘膜插入的n + +阴极区的侧壁相对的栅极电极层。 阴极电极形成为与n + +阴极区电连接。 阳极电极形成为与p + +集电极区域电连接。 阴极区域整体形成在彼此平行延伸的沟槽之间的表面上。 因此，可以获得其中简化了栅极控制电路并且具有良好的性能的功率半导体器件。

公开(公告)号：US06639732B2

公开(公告)日：2003-10-28

申请号：US10310780

申请日：2002-12-06

申请人： Yasuhiro Omura ,  Tetsuo Takahashi ,  Masatoshi Ikeda ,  Shiwen Li

发明人： Yasuhiro Omura ,  Tetsuo Takahashi ,  Masatoshi Ikeda ,  Shiwen Li

IPC分类号： G02B1700

CPC分类号： G02B17/0892 ,  G02B13/143 ,  G02B17/08 ,  G03F7/70225 ,  G03F7/70275 ,  G03F7/70808 ,  G03F7/70825 ,  G03F7/70833

摘要： The present invention relates to a projection exposure apparatus (10) for and method of imaging a reticle (R) having patterned surface onto a substrate (W) in photolithographic processes for manufacturing a variety of devices. The invention further relates to an optical system (C) having a folding member (M1) suited to the projection exposure apparatus, and a method for manufacturing the optical system. The projection exposure apparatus comprises an illumination optical system (IS) and a reticle stage (RS) capable of holding the reticle so the normal line to its patterned surface is in the direction of gravity. The apparatus also includes a substrate stage (WS) capable of holding the substrate with its surface normal parallel to the direction of gravity. The optical system includes a first imaging optical system (A) comprising a concave reflecting mirror and a dioptric optical member arranged along a first optical axis. The first imaging optical system (A) forms an intermediate image of the patterned surface. The optical system also includes a second imaging optical system (B) having a second optical axis, and forms a reduced image of the intermediate image on the substrate. The first folding member is arranged in the optical path from the first imaging optical system to the second imaging optical system. The first and second imaging optical systems and the first and second folding members are positioned so that a reduced image of the pattered surface is formed parallel to the pattern surface of the reticle, and the first and second optical axes are positioned so that they are substantially parallel to the direction of gravity.

公开(公告)号：US06188109B1

公开(公告)日：2001-02-13

申请号：US09212263

申请日：1998-12-16

申请人： Tetsuo Takahashi

发明人： Tetsuo Takahashi

IPC分类号： H01L2362

CPC分类号： H01L29/66348 ,  H01L22/34 ,  H01L27/0248 ,  H01L27/0629 ,  H01L29/7397 ,  H01L2924/0002 ,  H01L2924/00

摘要： A buried sense electrode (8) having the same structure as that of a buried gate electrode (7) is provided in an n− layer (3) of an IGBT with a sense oxide film (10) interposed therebetween. The buried sense electrode (8) senses an electric potential of the n− layer (3). If an electric potential sensed by the buried sense electrode (8) is increased to exceed a gate threshold voltage of a MOSFET (21) having an n+ drain region (22), a p well region (23) and an n+ source region (24), the MOSFET (21) is turned ON. At this time, a gate voltage applied across a gate electrode (13) and an emitter electrode (11) of the IGBT is reduced to a value obtained by a sum of an ON-state voltage of the MOSFET (21), a breakdown voltage of a Zener diode (16) having an n+ cathode region (17) and a p+ anode region (18), and a forward voltage of a diode (19) having the p+ anode region (18) and an n+ cathode region (20). As a result, various abnormalities such as overvoltage abnormalities as well as overcurrent abnormalities are detected.

摘要翻译： 具有与埋入栅电极（7）相同结构的掩埋感测电极（8）设置在IGBT的n层（3）中，其间插入有感应氧化膜（10）。 掩埋感测电极（8）感测n层（3）的电位。 如果掩埋感测电极（8）感测到的电位增加到超过具有n +漏极区域（22），p阱区域（23）和n +源极区域（24）的MOSFET（21）的栅极阈值电压， ，MOSFET（21）导通。 此时，施加在栅极电极（13）和IGBT的发射极（11）两端的栅极电压降低到通过MOSFET（21）的导通电压之和获得的值，击穿电压 具有n +阴极区域（17）和p +阳极区域（18）的齐纳二极管（16）和具有p +阳极区域（18）和n +阴极区域（20）的二极管（19）的正向电压， 。 结果，检测到过电压异常以及过电流异常等各种异常。

公开(公告)号：US06152087A

公开(公告)日：2000-11-28

申请号：US987422

申请日：1997-12-09

申请人： Toshio Shibata ,  Shigeo Ito ,  Kazuhiro Mizuno ,  Yasuhiro Terashima ,  Yuji Nakagawa ,  Keita Inoue ,  Norihiko Orita ,  Tetsuo Takahashi ,  Kazuo Yamamura

发明人： Toshio Shibata ,  Shigeo Ito ,  Kazuhiro Mizuno ,  Yasuhiro Terashima ,  Yuji Nakagawa ,  Keita Inoue ,  Norihiko Orita ,  Tetsuo Takahashi ,  Kazuo Yamamura

IPC分类号： F22B37/10 ,  F23J3/00 ,  F28F19/02 ,  F22B17/02

CPC分类号： F28F19/02 ,  F22B37/107 ,  F23J3/00 ,  Y10S122/13 ,  Y10T156/1089 ,  Y10T29/4935 ,  Y10T29/49352

摘要： A boiler tube protector having a cylindrical or semi-cylindrical shape and adapted to be attached around an outer peripheral face of a boiler tube with mortar, which boiler tube protector includes a plurality of ceramic bodies closely arranged along their parting planes, wherein the parting planes includes a restraining portion for restraining slippage of each of the ceramic bodies.

摘要翻译： 一种锅炉管保护器，其具有圆柱形或半圆柱形形状，并且适于用迫击炮安装在锅炉管的外周面周围，该锅炉管保护器包括沿其分开平面紧密布置的多个陶瓷体，其中， 包括用于抑制每个陶瓷体的滑动的约束部分。

公开(公告)号：US6012401A

公开(公告)日：2000-01-11

申请号：US51445

申请日：1998-09-28

申请人： Norihiko Orita ,  Yuji Nakagawa ,  Takeo Takaishi ,  Tetsuo Takahashi ,  Chuhachi Goto ,  Yuzo Kawahara ,  Minoru Ike ,  Yasuhiro Terashima ,  Keita Inoue

发明人： Norihiko Orita ,  Yuji Nakagawa ,  Takeo Takaishi ,  Tetsuo Takahashi ,  Chuhachi Goto ,  Yuzo Kawahara ,  Minoru Ike ,  Yasuhiro Terashima ,  Keita Inoue

IPC分类号： F22B37/10 ,  F23M5/04 ,  F23M5/08 ,  F23M9/00 ,  F23M9/10

CPC分类号： F23M5/08 ,  F22B37/107 ,  F22B37/108 ,  F23M5/04 ,  Y10S122/13

摘要： A heat-resistant assembly to shield boiler tubes which does not entail a thick heat-resistant block. This structure would be interposed between the boiler tubes and the combustion gases. Such a structure would be distinguished by the fact that it comprises heat-resistant block 16, itself composed of curved portion 16a, whose inner surface at one point comes in contact with the aforesaid boiler tube 11, and connecting portions 16b, and the aforesaid boiler tube assembly 12. The interlocking attachment structure which interlockingly secures these two components together in such a way that the block can be mounted or removed comprises recess 17, 58 or 68 and tongue 18, 59 or 69.

摘要翻译： PCT No.PCT / JP97 / 02626 Sec。 371日期：1998年9月28日 102（e）1998年9月28日PCT PCT 1997年7月29日PCT公布。 公开号WO98 / 05901 日期1998年12月2日一种用于屏蔽锅炉管的耐热组件，其不需要厚的耐热块。 该结构将介于锅炉管和燃烧气体之间。 这种结构的区别在于它包括耐热块16，其本身由弯曲部分16a组成，弯曲部分16a的一个内表面与上述锅炉管11接触，连接部分16b和上述锅炉 管组件12.将这两个部件互锁地固定在一起以使得块可以被安装或移除的方式的联锁附接结构包括凹部17,58或68以及舌部18,59或69。

公开(公告)号：US5835284A

公开(公告)日：1998-11-10

申请号：US882939

申请日：1997-06-26

申请人： Tetsuo Takahashi ,  Yasuhiro Omura

发明人： Tetsuo Takahashi ,  Yasuhiro Omura

IPC分类号： G02B17/08 ,  G03F7/20 ,  H01L21/027

CPC分类号： G02B17/0892 ,  G02B17/08 ,  G03F7/70225 ,  G03F7/70275

摘要： A catadioptric optical system in which a first imaging optical system is constructed of a unidirectional optical apparatus which transmits outgoing light from a first plane in one direction only and a bidirectional optical apparatus for transmitting the light that enters and reflecting the same to form an interim image of the first plane. A light guide guides the light from the interim image to a second imaging optical system through which the interim image is reimaged on a second plane. The unidirectional optical apparatus has an optical axis and at least one lens movable along the optical axis.

摘要翻译： 一种反折射光学系统，其中第一成像光学系统由仅在一个方向上传输来自第一平面的出射光的单向光学装置和用于透射进入并反射其的光的双向光学装置形成临时图像 的第一架飞机。 光引导件将来自中间图像的光引导到第二成像光学系统，通过该第二成像光学系统在第二平面上再次成像临时图像。 单向光学装置具有光轴和至少一个可沿光轴移动的透镜。

公开(公告)号：US5364219A

公开(公告)日：1994-11-15

申请号：US902720

申请日：1992-06-23

申请人： Tetsuo Takahashi ,  Eisaku Miyauchi ,  Toshihiko Miyajima ,  Hideaki Watanabe

发明人： Tetsuo Takahashi ,  Eisaku Miyauchi ,  Toshihiko Miyajima ,  Hideaki Watanabe

IPC分类号： B25J19/00 ,  B65D85/86 ,  B65G47/52 ,  B65G49/00 ,  B65G49/07 ,  F24F7/06 ,  H01L21/673 ,  H01L21/677 ,  B65G65/00

CPC分类号： H01L21/67724 ,  H01L21/67736 ,  H01L21/67772 ,  H01L21/67775 ,  Y10S414/139

摘要： A clean transfer system having a first vacuum chamber with a first transfer port, a first shutter for opening and closing the first transfer port and a first connecting member surrounding the first transfer port. The first connecting member is provided with at least an exterior portion. A second vaccum chamber includes a second transfer port, a second shutter for opening and closing the second transfer port, and a second connecting member surrounding the second transfer port. The second connecting member has at least an exterior portion. A closed space is formed between the first and second connecting members, so that the first and second shutters are movable within the closed space.

摘要翻译： 一种清洁的传送系统，具有具有第一传送口的第一真空室，用于打开和关闭第一传送口的第一快门以及围绕第一传送口的第一连接部件。 第一连接构件设置有至少外部部分。 第二真空室包括第二输送口，用于打开和关闭第二输送口的第二闸门以及围绕第二输送口的第二连接构件。 第二连接构件至少具有外部部分。 在第一和第二连接构件之间形成封闭空间，使得第一和第二快门在封闭空间内是可移动的。

公开(公告)号：US5143253A

公开(公告)日：1992-09-01

申请号：US402041

申请日：1989-09-01

申请人： Kuniaki Takahashi ,  Koji Kudo ,  Tetsuo Takahashi

发明人： Kuniaki Takahashi ,  Koji Kudo ,  Tetsuo Takahashi

IPC分类号： B65G51/03 ,  H05K13/02

CPC分类号： H05K13/027 ,  B65G51/03

摘要： A chip packaging casing for packing chips and also serving as a chip supply source comprises a substantially plate-like body having a spiral passageway formed in its interior, and a plurality of chips received in a row in the spiral passageway of the body. The plate-like body further has a chip-outlet formed therein as a continuation of the spiral passageway to communicate with the exterior of the body and at least one air-intake formed therein to communicate between the passageway and the exterior of the body. The air-intake is adapted to be connected to an air supply source and serves to facilitate the forwarding of the chips along the passageway toward the outlet to discharge the chips form the outlet. A chip supply mechanism is provided for supplying chips to a mounting head of an automatic chip mounting apparatus by using the chip packaging casing.

摘要翻译： 用于包装芯片并且还用作芯片供应源的芯片封装壳体包括在其内部形成有螺旋形通道的基本上板状的主体，以及在主体的螺旋通道中并排接收的多个芯片。 板状体还具有形成在其中作为螺旋通道的延续部分的芯片出口，其与主体的外部连通并且形成在其中的至少一个进气口在主体的通道和外部之间连通。 进气口适于连接到空气供应源，并且用于促进沿着通道朝向出口排出切屑以从出口排出芯片。 提供了一种芯片供给机构，用于通过使用芯片封装壳体将芯片供应到自动芯片安装装置的安装头。