Abstract:
A Metal-Oxide-Semiconductor Field-Effect-Transistor (MOSFET) can be formed by growing an epitaxial semiconductor layer on an upper surface of a sacrificial crystalline structure and on a substrate to form a buried sacrificial structure. The buried sacrificial structure can be removed to form a void in place of the buried sacrificial structure and a device isolation layer can be formed in the void.
Abstract:
A semiconductor device having a field effect transistor and a method of fabricating the same. In-situ doped epitaxial patterns are respectively formed at both sidewalls of a protruded channel pattern from a substrate by performing an in-situ doped epitaxial growth process. The in-situ doped epitaxial pattern has a conformal impurity concentration throughout. Accordingly, source/drain regions with a conformal impurity concentration are connected throughout a channel width of a channel region including both sidewalls of a protruded channel pattern. As a result, it is possible to maximize a driving current of the filed effect transistor, and an on-off characteristic can be highly stabilized.
Abstract:
An integrated circuit device structure can be formed by forming an implant mask having a window therein on a structure including upper and lower Si layers and an intermediate SiGex layer therebetween. Ions are implanted through the upper Si layer and into a portion of the intermediate SiGex layer exposed through the window in the implant mask and blocking implantation of ions into portions of the intermediate SiGex layer outside the window. The portions of the intermediate SiGex layer outside the window are etched and the portion of the intermediate SiGex layer exposed through the window having ions implanted therein is not substantially etched to form a patterned intermediate SiGex layer.
Abstract:
An adhesive composition for semiconductors, an adhesive film, and a semiconductor device, wherein, in a curing process including a first stage at a temperature ranging from 120° C. to 130° C. for 1 to 20 minutes, a second stage at a temperature ranging from 140° C. to 150° C. for 1 to 10 minutes, a third stage at a temperature ranging from 160° C. to 180° C. for 30 seconds to 10 minutes, and a fourth stage at a temperature ranging from 160° C. to 180° C. for 10 minutes to 2 hours, the adhesive film has a DSC curing rate in the first stage that is 40% or less of a total curing rate, a DSC curing rate in the fourth stage that is 30% to 60% higher than a DSC curing rate in the third stage, and DSC curing rates in each of the second and third stages that are 5% or more higher than a DSC curing rate of a preceding stage thereof.
Abstract:
A semiconductor device includes first through fourth active fins, which extend alongside one another in a first direction; and a field insulating film that covers lower portions of the first through fourth active fins, the first and second active fins protrude from the field insulating film at a first height, the third active fin protrudes from the field insulating film at a second height different from the first height, and an interval between the first and second active fins is different from an interval between the third and fourth active fins.
Abstract:
A ZnSnO3/ZnO nanowire, a method of forming a ZnSnO3/ZnO nanowire, a nanogenerator including a ZnSnO3/ZnO nanowire, a method of forming a ZnSnO3 nanowire, and a nanogenerator including a ZnSnO3 nanowire are provided. The ZnSnO3/ZnO nanowire includes a core and a shell that surrounds the core, wherein the core includes ZnSnO3 and the shell includes ZnO.
Abstract:
A nanopiezoelectric generator is provided. The nanopiezoelectric generator includes a first electrode; a second electrode; at least one nanostructure that is interposed between the first electrode and the second electrode, and includes a piezoelectric material and first carriers; and a concentration adjusting unit that adjusts a concentration of the first carriers in the at least one nanostructure.
Abstract:
Wideband single resonance antenna. An antenna may include a first conductor unit and a second conductor unit. The first conductor unit may be configured to have one end electrically coupled to a power. The second conductor unit may be configured to have one end electrically coupled to a ground, to surround at least one side of the first conductor unit, and to be electrically separated from the first conductor unit.
Abstract:
An electric energy generating device. The electric energy generating device includes a piezoelectric structure including a material having piezoelectric characteristics, and an insulating film including a material having electret characteristics. When external energy is supplied to the insulating film, the insulating film contacts the piezoelectric structure and the piezoelectric structure is then deformed to generate electric energy. Also, electric energy is generated when an electrostatic capacitance between the insulating film and a substrate adjacent to the insulating film changes.
Abstract:
Disclosed is a stent for the coil embolization of a cerebral aneurysm. The stent according to one embodiment of the present invention is shaped as a cylinder formed of a mesh-structured metal thin wire to enable a coil to fill the inside of said cerebral aneurysm through the mesh of the stent. And the stent has such a shape as the maximum diameter of the center portion of the stent is larger than the maximum diameter of each of both end portions of the stent. For example, the stent may have a fusiform shape in which the center portion protrudes further than the end portions.