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公开(公告)号：US20190305766A1
公开(公告)日：2019-10-03
申请号：US16362810
申请日：2019-03-25
发明人： Jürgen SCHMIDT
IPC分类号： H03K17/041 , H03K3/012 , H02M1/08
摘要： A control device for a power semiconductor switch, includes an actuating device, a first current path, a second current path, which connects the second output of the actuating device to a circuit node of the control device in an electrically conductive manner, wherein the second current path incorporates an electrical switching off resistor which is electrically connected in-circuit between a second output of the actuating device and the circuit node of the control device, a third current path, which connects the circuit node of the control device to a control device terminal of the control device in an electrically conductive manner, and an switching off acceleration circuit, which is electrically connected in parallel with the switching off resistor, comprising a diode, an electrical resistor, and a capacitor which is electrically connected in parallel with said resistor, wherein the cathode of the diode is connected to a second electrical terminal of the capacitor in an electrically conductive manner, and a first electrical terminal of the capacitor is connected to a first terminal of the switching off resistor, which is electrically oriented towards the actuating device in an electrically conductive manner, and the anode of the diode is connected to a second electrical terminal of the switching off resistor in an electrically conductive manner.
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72.发明申请公开(公告)号：US20190148318A1
公开(公告)日：2019-05-16
申请号：US15358038
申请日：2016-11-21
IPC分类号： H01L23/00
摘要： A power semiconductor chip having: a semiconductor component body; a multilayer metallization arranged on the semiconductor component body; and a nickel layer arranged over the semiconductor component body. The invention further relates to a method for producing a power semiconductor chip and to a power semiconductor device. The invention provides a power semiconductor chip which has a metallization to which a copper wire, provided without a thick metallic coating, can be reliably bonded without damage to the power semiconductor chip during bonding.
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73.发明申请公开(公告)号：US20190043820A1
公开(公告)日：2019-02-07
申请号：US16020378
申请日：2018-06-27
发明人： Ulrich Sagebaum
CPC分类号： H01L24/29 , H01L23/145 , H01L23/15 , H01L24/05 , H01L24/27 , H01L24/32 , H01L24/33 , H01L24/50 , H01L24/75 , H01L24/79 , H01L24/83 , H01L24/86 , H01L2224/04026 , H01L2224/2732 , H01L2224/2783 , H01L2224/2784 , H01L2224/29017 , H01L2224/29019 , H01L2224/291 , H01L2224/2919 , H01L2224/29294 , H01L2224/29339 , H01L2224/32227 , H01L2224/33181 , H01L2224/50 , H01L2224/73269 , H01L2224/75303 , H01L2224/79303 , H01L2224/83345 , H01L2224/83447 , H01L2224/8384 , H01L2224/83862 , H01L2224/8684 , H01L2924/10158 , H01L2924/014 , H01L2924/00014 , H01L2924/00012
摘要： A power electronics method and assembly produced by the method. The assembly has a substrate, having a power semiconductor element, and an adhesion layer disposed therebetween, wherein the substrate has a first surface that faces a power semiconductor element, a power semiconductor element has a third surface that faces the substrate, the adhesion layer has a second surface which, preferably across the full area, contacts the third surface and has a first consistent surface contour having a first roughness, and wherein a fourth surface of the power semiconductor element that is opposite the third surface has a second surface contour having a second roughness, said second surface contour following the first surface contour.
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公开(公告)号：US10134608B2
公开(公告)日：2018-11-20
申请号：US15649999
申请日：2017-07-14
发明人： Nedzad Bakija , Christian Göbl
IPC分类号： G05F1/56 , H01L21/52 , H01L23/31 , H01L23/498 , H01L25/18 , H02M3/158 , H01L23/051 , H02M1/00
摘要： A switching device and a power semiconductor module are configured with a substrate, a power semiconductor component arranged thereupon and with a load connection device. The substrate incorporates mutually electrically-insulated printed conductors and wherein the load connection device, preferably for an AC potential, comprises at least two partial connection devices, having mutually corresponding contact surfaces and being interconnected in an force-fitted or materially-bonded manner and, on the contact surfaces, an electrically conductive manner, wherein a first partial connection device has a first contact device, which is force-fitted or materially-bonded to the printed conductor of the substrate, and wherein a second partial connection device has a second contact device for the further, preferably external, connection of a load connection device.
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公开(公告)号：US10054615B2
公开(公告)日：2018-08-21
申请号：US15267089
申请日：2016-09-15
发明人： Alexander Schneider , Hartmut Kulas
CPC分类号： G01R15/181 , G01R1/04
摘要： A centering holding device for a Rogowski coil. The holding device comprises a virtual axis; a first cutout running from a first main side to a second main side thereof through the holding device and is arranged centrally with respect to the axis. The holding device has a channel in the shape of a circle arc around the axis and around the first cutout from a first channel opening to a second channel opening. The first cutout and the channel are coaxial relative to the axis of the holding device. The holding device has a second cutout, which leaves out an edge region of the holding device. The first and second channel openings lead into the second cutout. Furthermore, the invention relates to a method for arranging a Rogowski coil by the holding device.
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公开(公告)号：US09735524B1
公开(公告)日：2017-08-15
申请号：US15468367
申请日：2017-03-24
发明人： Ingo Rabl
CPC分类号： H01R25/167 , H01R4/30 , H01R25/162 , H02B1/20 , H02G5/005 , H02M7/003 , H02M7/487 , H05K7/1432
摘要： A connecting arrangement for a three-level converter arrangement includes a first to third connection rail which are each in the form of a shaped metal body. The respective connection rail has a line section and a connection section which has a connection means. The respective connecting rail has a line section and a connecting section which, for its part, has an associated respective connecting means. The respective connection means forms, with the connecting means, a force-fitting, electrically conductive connection. The connection rails are connected to the connecting rails with the correct polarity. The respective line sections of the connection rails and the connecting rails are situated one above the other in a stack, wherein the first connecting section, in projection in the normal direction of the first connection section, covers the first connection section; wherein the second connecting section, in projection in the normal direction of the second connection section, covers the first connection section and the second connection section, and wherein the third connecting section, in projection in the normal direction of the third connection section, covers the second connection section and the third connection section.
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77.发明申请公开(公告)号：US20170144246A1
公开(公告)日：2017-05-25
申请号：US15356655
申请日：2016-11-20
CPC分类号： B23K20/002 , B23K20/023 , B23K20/10 , B23K20/26 , H01L24/32 , H01L24/50 , H01L24/75 , H01L24/79 , H01L24/83 , H01L24/86 , H01L2224/32227 , H01L2224/73269 , H01L2224/75251 , H01L2224/75252 , H01L2224/75314 , H01L2224/75315 , H01L2224/75316 , H01L2224/7532 , H01L2224/75343 , H01L2224/75704 , H01L2224/7598 , H01L2224/79251 , H01L2224/79252 , H01L2224/79314 , H01L2224/79316 , H01L2224/7932 , H01L2224/79343 , H01L2224/83203 , H01L2224/8384 , H01L2224/86203 , H01L2924/00014 , H01L2924/00012
摘要： A pressing ram having an elastic cushion element and intended for the material-bonded press-sintering connection of a first connection partner to a second connection partner of a power-electronics component. The elastic cushion element of the pressing ram is enclosed by a dimensionally stable frame, within which the cushion element and a guide part of the pressing ram are guided for linear movement such that the dimensionally stable frame lowers onto the first connection partner, or a workpiece carrier with the first connection partner arranged therein, and, following abutment against the same, the pressing ram together with the elastic cushion element is lowered onto the second connection partner and the elastic cushion exerts a pressure necessary for connecting the first connection partner to the second connection partner.
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78.发明授权公开(公告)号：US09661740B2
公开(公告)日：2017-05-23
申请号：US14881325
申请日：2015-10-13
发明人： Roland Bittner , Marco Lederer , Sven Teuber , Matthias Spang
CPC分类号： H05K1/025 , H01L23/48 , H01L23/642 , H01L25/072 , H01L2924/0002 , H01L2924/19041 , H02M7/003 , H05K7/026 , H05K7/12 , H05K2201/10015 , H01L2924/00012
摘要： An arrangement comprising a power semiconductor module, a capacitor, a DC-voltage busbar and a connection device. The module has two flat DC-voltage connection conductors each having a contact section. The DC-voltage connection conductors are arranged closely adjacent to one another on and close to the respective contact sections in the normal direction. The capacitor has two flat capacitor connection conductors each having a contact section. The DC-voltage busbar has two partial busbars each having a contact section. The connection device has a yoke with a die and a bearing. The respective contact sections of the DC-voltage connection conductors are clamped flat above one another between the die and the bearing. The contact sections, of the capacitor or the DC-voltage busbar, are arranged closely adjacent to one another on and close to the respective contact sections in the normal direction, and are thus force-fittingly and electrically conductively connected to one another.
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79.发明申请公开(公告)号：US20170025806A1
公开(公告)日：2017-01-26
申请号：US15096245
申请日：2016-04-11
发明人： Roland Bittner
IPC分类号： H01R25/16 , H01R13/621
CPC分类号： H01R25/162 , H01R4/36 , H01R13/621 , H01R2201/26 , H02G5/02
摘要： An arrangement having a DC-voltage busbar and a power component. The power component has two flat DC-voltage connection conductors, each with a contact section and arranged closely adjacent to one another. Each connection conductor has a clamping section beside the respective contact section in the direction of current flow. The busbar has two partial busbars, each with a contact section and arranged closely adjacent to one another. Each partial busbar has a clamping section beside the respective contact section in the direction of current flow. The contact section of at least one connection conductor is electrically connected to the contact section of the associated partial busbar by connecting the clamping sections of the connection conductor to the clamping section of the partial busbars in a flat and force-fitting manner above one another and the respective contact sections therefore lying directly flat on one another.
摘要翻译： 具有直流电压母线和功率部件的装置。 功率部件具有两个扁平的直流电压连接导体，每个具有接触部分并彼此紧密相邻地布置。 每个连接导体在电流方向上具有在相应的接触部分旁边的夹紧部分。 母线具有两个部分母线，每个母线具有接触部分并彼此靠近地布置。 每个部分母线在电流方向上具有在相应的接触部分旁边的夹紧部分。 至少一个连接导体的接触部分通过将连接导体的夹紧部分以彼此相互平坦且强力配合的方式连接到部分母线的夹紧部分而电连接到相关部分母线的接触部分， 因此，相应的接触部分彼此直接平坦地放置。
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公开(公告)号：US20170005594A1
公开(公告)日：2017-01-05
申请号：US15199969
申请日：2016-06-30
发明人： Gunther KOENIGSMANN , Thomas ECK
IPC分类号： H02M7/5387 , G01R19/165 , H02M1/32
摘要： A power semiconductor circuit comprising a field effect transistor having a drain, a source and a gate as terminals, and further comprising a control device having a drive device and an undervoltage detection circuit. The drive device drives the field effect transistor and is electrically connected to the gate of the field effect transistor. The undervoltage detection circuit generates an undervoltage detection signal if a power semiconductor voltage present between the drain and the source of the field effect transistor falls below a specific voltage value. The drive device switches on the field effect transistor when a switch-on command for switching on the field effect transistor and the undervoltage detection signal are present. The invention provides a power semiconductor circuit with low energy loss.
摘要翻译： 一种功率半导体电路，包括具有漏极，源极和栅极作为端子的场效应晶体管，并且还包括具有驱动装置和欠压检测电路的控制装置。 驱动装置驱动场效应晶体管并且电连接到场效应晶体管的栅极。 如果存在于场效应晶体管的漏极和源极之间的功率半导体电压低于特定电压值，则欠压检测电路产生欠压检测信号。 当存在用于接通场效应晶体管的接通命令和欠压检测信号时，驱动装置接通场效应晶体管。 本发明提供了具有低能量损失的功率半导体电路。
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