SUBSTRATE PROCESSING APPARATUS
    71.
    发明公开

    公开(公告)号:US20230369018A1

    公开(公告)日:2023-11-16

    申请号:US18310740

    申请日:2023-05-02

    申请人: SEMES CO., LTD.

    IPC分类号: H01J37/32

    摘要: There is provided a substrate processing apparatus including a chamber having a processing space therein, a dielectric window arranged at an upper portion of the chamber and configured to cover an upper surface of the chamber, and an RF source disposed on the dielectric window and configured to supply RF power to generate plasma from gas in the processing space, wherein the RF source includes an RF electrode disposed on the dielectric window and an RF plate disposed on the RF electrode, the dielectric window includes a groove extending vertically downward from an uppermost surface of the dielectric window, and the RF plate has a ring shape.

    SUBSTRATE PROCESSING APPARATUS AND METHOD THEREOF

    公开(公告)号:US20230367233A1

    公开(公告)日:2023-11-16

    申请号:US17990659

    申请日:2022-11-19

    申请人: SEMES CO., LTD.

    IPC分类号: G03F7/00 G03F7/16

    摘要: Provided is a substrate processing apparatus capable of effectively removing contaminants in an edge region of a substrate. The substrate processing apparatus comprises: a support configured to rotate a substrate; a first bath installed around the support and configured to store a cleaning liquid and form a first opening on an upper surface thereof; and a first ultrasonic oscillator installed in the first bath and configured to provide an ultrasonic wave towards a surface of the cleaning liquid exposed by the first opening and form a first water film protruding from the surface of the cleaning liquid, wherein the substrate is not immersed in the first bath, and the edge region of the substrate is cleaned by the protruding first water film while rotating the substrate by the support.

    APPARATUS AND METHOD FOR DISPENSING TREATMENT LIQUID

    公开(公告)号:US20230352325A1

    公开(公告)日:2023-11-02

    申请号:US18302303

    申请日:2023-04-18

    申请人: SEMES CO., LTD.

    IPC分类号: H01L21/67 H01L21/02

    摘要: An apparatus and method for dispensing treatment liquid, which enable treatment liquid to be accurately dispensed to an intended position on a substrate having a non-planar surface on the basis of measurement information obtained by three-dimensionally measuring the substrate. The apparatus may include: a substrate support unit on which a substrate is seated; a three-dimensional (3D) measurement device configured to three-dimensionally measure the substrate seated on the substrate support unit; a head unit configured to dispense treatment liquid onto the substrate seated on the substrate support unit; and a controller configured to receive actually measured 3D substrate information of the substrate from the 3D measurement device, generate printing pattern image information based on the actually measured 3D substrate information, and apply printing command information to the head unit according to the generated printing pattern image information.

    TREATMENT LIQUID EJECTION METHOD AND APPARATUS

    公开(公告)号:US20230352319A1

    公开(公告)日:2023-11-02

    申请号:US18302287

    申请日:2023-04-18

    申请人: SEMES CO., LTD.

    IPC分类号: H01L21/67 H01L21/02

    摘要: Provided is a treatment liquid ejection method and apparatus capable of significantly increasing productivity and quality by greatly reducing a maintenance time of a head unit, the treatment liquid ejection method including (a) obtaining test image information by test-photographing a treatment liquid test-printed by a head unit, (b) generating nozzle-specific characteristic information by using the test image information, (c) generating print file information to be printed, in consideration of the nozzle-specific characteristic information, (d) reflecting recipe information of a substrate or the head unit to prepare the print file information in an outputtable state, and (e) printing, on the substrate by the head unit, the print file information to which the recipe information is reflected.

    PROCESS MEASUREMENT APPARATUS AND METHOD
    76.
    发明公开

    公开(公告)号:US20230350438A1

    公开(公告)日:2023-11-02

    申请号:US17732553

    申请日:2022-04-29

    申请人: SEMES Co., Ltd.

    IPC分类号: H01L21/67 G05D23/19 G01K3/14

    摘要: A process measurement apparatus and method capable of increasing production by decreasing an operating time are provided. The process measurement method is performed by a computing device, and includes receiving a plurality of sensed values from a plurality of sensors disposed in a wafer-type temperature sensor, generating a first temperature value of a first heating zone based on the plurality of sensed values, and determining a first compensation value based on a first difference value corresponding to a difference between the first temperature value and a target value, wherein a first compensation ratio between the first difference value and the first compensation value when the first difference value is a first value is different from a second compensation ratio between the first difference value and the first compensation value when the first difference value is a second value.

    APPARATUS FOR HEATING CHEMICAL LIQUID AND SYSTEM FOR TREATING SUBSTRATE INCLUDING THE SAME

    公开(公告)号:US20230338993A1

    公开(公告)日:2023-10-26

    申请号:US17727659

    申请日:2022-04-22

    申请人: SEMES CO., LTD.

    IPC分类号: B08B3/10 B08B3/02

    摘要: There are provided an apparatus for heating a chemical liquid that heats a chemical liquid using a heating element with a light source as a medium, and a system for treating a substrate with the apparatus. The apparatus for heating a chemical liquid includes: a flow path provided as a path through which a chemical liquid used to treat a substrate passes; a heating element disposed to surround at least a portion of the flow path; and a light source irradiating the heating element with light, wherein the heating element is heated using photon excitation, and heats the chemical liquid.

    Liquid supply unit and substrate treating apparatus and method

    公开(公告)号:US11794219B2

    公开(公告)日:2023-10-24

    申请号:US16912754

    申请日:2020-06-26

    申请人: SEMES CO., LTD.

    IPC分类号: B08B3/10 H01L21/67

    CPC分类号: B08B3/10 H01L21/67051

    摘要: The inventive concept relates to an apparatus for treating a substrate. According to an embodiment, the substrate treating apparatus includes a housing having a process space therein, a support unit that supports the substrate in the housing, a nozzle that dispenses a treatment liquid onto the substrate supported on the support unit, and a liquid supply unit that supplies the treatment liquid to the nozzle, in which the liquid supply unit includes a container having a storage space in which the treatment liquid is stored, a liquid supply tube that causes the treatment liquid to flow from the container to the nozzle, and a microwave applying member that applies microwaves to the treatment liquid before the treatment liquid is supplied to the nozzle.

    TRANSPORT SYSTEM INCLUDING DISTURBANCE OBSERVER AND CONTROL METHOD THEREOF

    公开(公告)号:US20230327595A1

    公开(公告)日:2023-10-12

    申请号:US18091372

    申请日:2022-12-30

    申请人: SEMES CO., LTD.

    摘要: Provided is a transport system to minimize an interference between motors of a transport vehicle. The transport system comprises: a first motor controller corresponding to a first wheel and configured to generate a first current value; a first motor system configured to move based on the first current value and provide a first position value according to the movement; a disturbance observer configured to receive the first current value and the first position value and calculate a first disturbance value affecting the first motor system; a second motor controller corresponding to a second wheel and configured to generate a second current value; a compensation current generator configured to generate a second compensation current value based on the second current value and the first disturbance value; and a second motor system configured to move by the second compensation current value and provide a second position value according to the movement.