公开(公告)号：US20230207342A1

公开(公告)日：2023-06-29

申请号：US18146800

申请日：2022-12-27

Applicant: SEMES CO., LTD.

Inventor： Young Jun SON ,  Tae Hoon LEE ,  Do Yeon KIM

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67051 ,  H01L21/6715 ,  H01L21/67253 ,  H01L21/68764

Abstract: Provided is an apparatus for treating a substrate. The substrate treating apparatus according to an exemplary embodiment may include: a support unit supporting a substrate; a treating container covering an outer side of the support unit; a liquid supply unit including a nozzle ejecting a liquid to the substrate supported on the support unit; and a home port which is positioned outside the treating container, and in which the nozzle waits, and the home port may include a body having a discharge space to which the liquid ejected from the nozzle is discharged therein, and a measurement unit connected to the body and measuring a charging amount of the liquid discharged from the discharge space.

公开(公告)号：US20230338993A1

公开(公告)日：2023-10-26

申请号：US17727659

申请日：2022-04-22

Applicant: SEMES CO., LTD.

Inventor： Yoon Ki SA ,  Do Yeon KIM ,  Pil Kyun HEO

IPC: B08B3/10 ,  B08B3/02

CPC classification number: B08B3/10 ,  B08B3/02 ,  B08B2203/007

Abstract: There are provided an apparatus for heating a chemical liquid that heats a chemical liquid using a heating element with a light source as a medium, and a system for treating a substrate with the apparatus. The apparatus for heating a chemical liquid includes: a flow path provided as a path through which a chemical liquid used to treat a substrate passes; a heating element disposed to surround at least a portion of the flow path; and a light source irradiating the heating element with light, wherein the heating element is heated using photon excitation, and heats the chemical liquid.

公开(公告)号：US20210013029A1

公开(公告)日：2021-01-14

申请号：US16920418

申请日：2020-07-02

Applicant: SEMES CO., LTD.

Inventor： Do Yeon KIM ,  Se Hoon OH ,  Won Geun KIM ,  Ju Mi LEE ,  Ho Jong HWANG ,  Pil Kyun HEO ,  Hyun YOON ,  Choong Hyun LEE ,  Hyun Goo PARK

IPC: H01L21/02 ,  H01L21/67

Abstract: Provided is a substrate treatment apparatus including a treatment container equipped with a conductive member. The conductive member is made of a material having a lower resistivity than that of the treatment container. The conductive member prevents a rise of an electric potential of the treatment container, which is caused by charging during treatment of a substrate, thereby preventing the substrate from being contaminated and damaged by particles and electrostatic arcing.

公开(公告)号：US20190043741A1

公开(公告)日：2019-02-07

申请号：US16051059

申请日：2018-07-31

Applicant: SEMES CO., LTD.

Inventor： Do Yeon KIM ,  Jin Kyu KIM ,  Yoon Jong JU ,  Min Sung HAN ,  Joon Ho WON ,  Yong Tak HYUN

IPC: H01L21/67 ,  H01L21/687

Abstract: The present disclosure relates to a substrate processing apparatus and a substrate processing method. The substrate processing apparatus according to the exemplary embodiment of the present disclosure may include: a processing liquid supply tube; a nozzle unit which is supplied with a processing liquid from the processing liquid supply tube and discharges the processing liquid to the substrate; and a light source unit which is provided to irradiate the processing liquid discharged from the nozzle unit with ultraviolet rays. According to the present disclosure, the processing liquid, which is electrified while passing the processing liquid supply tube, is irradiated with ultraviolet rays, such that electricity is eliminated from the electrified processing liquid, and as a result, it is possible to minimize a problem that the substrate is contaminated by peripheral particles or arcing occurs on the substrate.

公开(公告)号：US20230215742A1

公开(公告)日：2023-07-06

申请号：US17986894

申请日：2022-11-15

Applicant: SEMES CO., LTD.

Inventor： Young Jun SON ,  Tae Hoon LEE ,  Sung Gyu LEE ,  Hyun YOON ,  Do Yeon KIM

IPC: H01L21/67 ,  B01D35/02

CPC classification number: H01L21/67051 ,  B01D35/02

Abstract: A substrate processing apparatus includes: a nozzle unit configured to discharge a processing liquid to a substrate; a pipe connected to the nozzle unit and a processing liquid supply unit supplying the processing liquid; a charge amount control unit disposed at the pipe, including a filter unit charged with positive charges or negative charges, and including at least one of a control valve, controlling a flow rate of the processing liquid passing through an inside of the filter unit, and a power supply unit, applying a voltage to the filter unit, to control a charge amount of the processing liquid; and a control unit connected to the charge amount control unit.

公开(公告)号：US20230195030A1

公开(公告)日：2023-06-22

申请号：US18084381

申请日：2022-12-19

Applicant: SEMES CO., LTD.

Inventor： Young Jun SON ,  Tae Hoon LEE ,  Hyun YOON ,  Do Yeon KIM

IPC: G03G21/18 ,  G03G15/02 ,  G03G15/00

CPC classification number: G03G21/1842 ,  G03G15/0233 ,  G03G15/60 ,  G03G15/80 ,  G03G2215/0872 ,  G03G2221/0084 ,  G03G2221/1651

Abstract: Proposed are a home port and a substrate processing apparatus using the same. The home port is installed in the substrate processing apparatus to temporarily mount a nozzle for discharging a process liquid to a substrate, and includes a main body having a space therein, a nozzle holder provided at an upper portion of the main body and configured to mount the nozzle, an inclined surface formed below the nozzle holder in the space, a first supply pipe configured to discharge a rinse liquid to a tip of the nozzle, a second supply pipe configured to inject the rinse liquid into the main body, a conductive wire configured to electrically connect the inclined surface and the first supply pipe, and a first switch installed on the conductive wire.

公开(公告)号：US20210183660A1

公开(公告)日：2021-06-17

申请号：US17115313

申请日：2020-12-08

Applicant: SEMES CO., LTD.

Inventor： Jung Suk GOH ,  Jae Seong LEE ,  Do Youn LIM ,  Kuk Saeng KIM ,  Young Dae CHUNG ,  Tae Shin KIM ,  Jee Young LEE ,  Won Geun KIM ,  Ji Hoon JEONG ,  Kwang Sup KIM ,  Pil Kyun HEO ,  Yoon Ki SA ,  Ye Rim YEON ,  Hyun YOON ,  Do Yeon KIM ,  Yong Jun SEO ,  Byeong Geun KIM ,  Young Je UM

IPC: H01L21/311 ,  H01L21/66 ,  H01L21/67

Abstract: Method and apparatus for etching a thin layer including silicon nitride formed on a substrate are disclosed. Etchant including phosphoric acid and water is supplied on the substrate so that a liquid layer is formed on the substrate. The thin layer is etched by reaction between the thin layer and the etchant. Thickness of the liquid layer is measured to detect variation in the thickness of the liquid layer while etching the thin layer. Variation in the concentration of the phosphoric acid and the water is calculated based on the variation in the thickness of the liquid layer. Water is supplied on the substrate based on the variation in the concentration of the phosphoric acid and the water so that the concentration of the phosphoric acid and the water becomes a predetermined value.

公开(公告)号：US20230307260A1

公开(公告)日：2023-09-28

申请号：US17703255

申请日：2022-03-24

Applicant: SEMES CO., LTD.

Inventor： Ho Jong HWANG ,  Do Yeon KIM ,  Hyun YOON

IPC: H01L21/67 ,  H01L21/687 ,  B08B3/08 ,  B08B3/04 ,  B08B3/02

CPC classification number: H01L21/67051 ,  H01L21/68764 ,  B08B3/08 ,  B08B3/041 ,  B08B3/022

Abstract: The present invention provides a substrate treating apparatus. The substrate treating apparatus includes: a cup having a treatment space therein; a support unit configured to support a substrate within the treatment space, and including a rotatable support plate; and a liquid discharge unit configured to discharge a chemical liquid to the substrate supported by the support unit, in which the support unit includes: a plurality of pin members provided to the support plate to support the substrate placed on the support plate; and a discharge member coupled to the pin member to discharge charges to the air according to a rotation of the support plate, and the discharge member is provided as a conductive member.

公开(公告)号：US20230207341A1

公开(公告)日：2023-06-29

申请号：US18146723

申请日：2022-12-27

Applicant: SEMES CO., LTD.

Inventor： Do Yeon KIM ,  Young Jun SON ,  Tae Hoon LEE ,  Sung-gyu LEE ,  Hyun YOON

IPC: H01L21/67

CPC classification number: H01L21/67051 ,  H01L21/67242 ,  H01L21/6715

Abstract: Provided is an apparatus for treating a substrate. The substrate treating apparatus may include: a substrate support unit supporting a substrate; a nozzle supplying a liquid to the substrate supported on the substrate support unit; a home port in which the nozzle waits; and an electrostatic measurement member measuring an electrostatic amount of a liquid dispensed from the nozzle in the home port.

公开(公告)号：US20230205088A1

公开(公告)日：2023-06-29

申请号：US18146606

申请日：2022-12-27

Applicant: SEMES CO.,LTD

Inventor： Do Yeon KIM ,  Tae Hoon LEE

IPC: G03F7/16

CPC classification number: G03F7/162

Abstract: Provided is an apparatus and a method for liquid-treating a substrate. A substrate treating apparatus may include: a substrate support unit supporting a substrate; and a liquid supply unit applying a photosensitive liquid onto the substrate supported on the substrate support unit, and the liquid supply unit may include an application nozzle supplying the photosensitive liquid, a nozzle arm in which the application nozzle is positioned at one end portion, and a driving member positioned at the other end portion of the nozzle arm and moving the nozzle arm, and the application nozzle may include a nozzle body supported on the nozzle arm, a nozzle tip connected to the nozzle body, and an anti-static surface having an internal flow path through which the photosensitive liquid is ejected and capable of removing static electricity, a nozzle nut member fastened to a thread of the nozzle body so that the nozzle tip is fixed to the nozzle body, and contacting the nozzle tip, and a grounding member having one end contacting the nozzle nut member and the other end grounded through the nozzle arm.