公开(公告)号：US20230350438A1

公开(公告)日：2023-11-02

申请号：US17732553

申请日：2022-04-29

Applicant: SEMES Co., Ltd.

Inventor： Yong Jun Seo ,  Sang Hyun Son ,  Sang Min Ha ,  Hyeong Jun Cho ,  Dong Ok Ahn

IPC: H01L21/67 ,  G05D23/19 ,  G01K3/14

CPC classification number: G05D23/1927 ,  G01K3/14 ,  H01L21/67248 ,  H01L21/67103

Abstract: A process measurement apparatus and method capable of increasing production by decreasing an operating time are provided. The process measurement method is performed by a computing device, and includes receiving a plurality of sensed values from a plurality of sensors disposed in a wafer-type temperature sensor, generating a first temperature value of a first heating zone based on the plurality of sensed values, and determining a first compensation value based on a first difference value corresponding to a difference between the first temperature value and a target value, wherein a first compensation ratio between the first difference value and the first compensation value when the first difference value is a first value is different from a second compensation ratio between the first difference value and the first compensation value when the first difference value is a second value.

公开(公告)号：US11919303B2

公开(公告)日：2024-03-05

申请号：US17734080

申请日：2022-05-01

Applicant: SEMES CO., LTD.

Inventor： Sang Min Ha ,  Sang Hyun Son ,  Young Joo Seo ,  Hyeong Jun Cho ,  Jae Hong Kim

IPC: B41J2/045 ,  B41J2/07 ,  B41J2/125

CPC classification number: B41J2/04581 ,  B41J2/04518 ,  B41J2/072 ,  B41J2/125

Abstract: Provided is a jetting driver that can be used for various types of heads with minimal changes. The jetting driver includes: an image board receiving raw image data and generating image data by transforming the raw image data into a form suitable for a type of heads used; and an interface board physically separated from the image board, receiving the image data, and transmitting the image data to the heads through a plurality of channels.

公开(公告)号：US12123903B2

公开(公告)日：2024-10-22

申请号：US17837027

申请日：2022-06-10

Applicant: SEMES CO., LTD.

Inventor： Jun Ho Oh ,  Kwang Sup Kim ,  Jae Hong Kim ,  Kyung Hun Jang ,  Young Ho Park ,  Jong Min Lee ,  Yeon Chul Song ,  Sang Min Ha ,  Ji Hoon Yoo ,  Myeong Jun Lim

IPC: G01R29/24

CPC classification number: G01R29/24

Abstract: A static electricity visualization apparatus capable of visually identifying a measured level of static electricity is provided. The static electricity visualization apparatus comprises a photographing unit for generating a first photographed image obtained by photographing a measurement target at a first distance from the measurement target in a first mode, and generating a second photographed image obtained by photographing the measurement target at a second distance from the measurement target in a second mode, a static electricity sensor for measuring a static electricity level of the measurement target at the second distance from the measurement target, a processor for matching the second photographed image with the first photographed image, and an output unit for outputting a static electricity visualization image that visualizes a static electricity level measured by the static electricity sensor on the first photographed image, wherein the static electricity visualization image comprises a color corresponding to the static electricity level of the measurement target measured by the static electricity sensor at a position where the second photographed image matches on the first photographed image.

公开(公告)号：US11756815B2

公开(公告)日：2023-09-12

申请号：US17083189

申请日：2020-10-28

Applicant: SEMES CO., LTD.

Inventor： Yong Jun Seo ,  Sang Hyun Son ,  Sang Min Ha ,  Dong Ok Ahn

IPC: H01L21/67 ,  H01L23/00 ,  H01L21/324 ,  G01P15/02 ,  G01C19/00 ,  H01L23/498

CPC classification number: H01L21/67248 ,  G01C19/00 ,  G01P15/02 ,  H01L21/324 ,  H01L21/67103 ,  H01L23/4985 ,  H01L23/562

Abstract: Disclosed is an apparatus for precisely monitoring warpage deformation of a substrate. The apparatus includes a sensing unit and a processor. The sensing unit is removably mounted on the substrate and detects information on the warpage deformation of the substrate during a treatment process performed on the substrate. The processor generates warpage state information on the basis of the warpage information detected by the sensing unit.