APPARATUS AND METHOD FOR TREATING SUBSTRATE
    1.
    发明申请

    公开(公告)号:US20200273681A1

    公开(公告)日:2020-08-27

    申请号:US16793028

    申请日:2020-02-18

    Applicant: Semes Co., Ltd

    Abstract: The substrate treating apparatus includes a processing module and an index module on which a cassette having the substrate received therein is placed and that includes an index robot that transfers the substrate between the cassette and the processing module. The processing module includes a process chamber and a transfer chamber. The process chamber includes a support unit. The support unit includes a support on which the substrate is placed and a ring member that surrounds the substrate placed on the support and that is provided so as to be detachable from the support. The apparatus further includes a carrier storage unit that stores a carrier that is mounted on a hand of the main transfer robot or the index robot and on which the ring member is placed when the ring member is transferred by the main transfer robot or the index robot.

    APPARATUS AND METHOD FOR PROCESSING SUBSTRATE

    公开(公告)号:US20200294830A1

    公开(公告)日:2020-09-17

    申请号:US16811133

    申请日:2020-03-06

    Applicant: Semes Co., Ltd

    Abstract: The inventive concept provides an apparatus and method for processing a substrate. The apparatus includes an index module and a processing module that is disposed adjacent to the index module and that processes the substrate. The index module includes one or more load ports, on each of which a carrier having the substrate received therein is placed, a side storage that stores the substrate subjected to a process in the processing module and removes fumes on the substrate, and a transfer frame including an index robot that transfers the substrate between the carrier placed on the load port, the side storage, and the processing module. The side storage includes a housing having an interior space, a partitioning unit that partitions the interior space into a plurality of receiving spaces independent of one another, and an exhaust unit that independently and separately evacuates the plurality of receiving spaces.

    TRANSFER PLATE SET AND SUBSTRATE TRANSFER APPARATUS

    公开(公告)号:US20230348207A1

    公开(公告)日:2023-11-02

    申请号:US18141411

    申请日:2023-04-29

    CPC classification number: B65G47/90 H01L21/67706 H01L21/67709 H01L21/67742

    Abstract: Disclosed is a transfer plate set. More particularly, the transfer plate set serves to guide a substrate transfer unit to move, the transfer plate set including a first plate part; and a second plate part inserted and fixed to the first plate part, wherein the first plate part includes a first base; a first guide member disposed on the first base; and a receiving part formed to be stepped on a side facing the second plate part, and wherein the second plate part includes a second base; a second guide member disposed on the second base; and an insertion part formed to protrude from a side facing the first plate part and provided to be inserted into the receiving part.

    PLASMA PROCESSING APPARATUS
    5.
    发明公开

    公开(公告)号:US20230317428A1

    公开(公告)日:2023-10-05

    申请号:US18190442

    申请日:2023-03-27

    Abstract: According to an aspect of the inventive concept, there is provided a plasma processing apparatus including a housing including a space accommodating a wafer therein, a gas supply member configured to supply gas into the housing, a plasma source generating a plasma from the gas supplied into the housing, and a magnetic field generating member disposed on the housing and configured to generate a magnetic field inside the housing, wherein the magnetic field generating member includes a first magnet unit disposed on the housing, and a second magnet unit disposed on the first magnet unit, wherein the second magnet unit is rotatable to change the magnetic pole of the upper portion and lower portion of the second magnet unit.

    APPARATUS AND METHOD FOR TREATING SUBSTRATE

    公开(公告)号:US20210217594A1

    公开(公告)日:2021-07-15

    申请号:US17216972

    申请日:2021-03-30

    Abstract: The substrate treating apparatus includes a processing module and an index module on which a cassette having the substrate received therein is placed and that includes an index robot that transfers the substrate between the cassette and the processing module. The processing module includes a process chamber and a transfer chamber. The process chamber includes a support unit. The support unit includes a support on which the substrate is placed and a ring member that surrounds the substrate placed on the support and that is provided so as to be detachable from the support. The apparatus further includes a carrier storage unit that stores a carrier that is mounted on a hand of the main transfer robot or the index robot and on which the ring member is placed when the ring member is transferred by the main transfer robot or the index robot.

    SUBSTRATE PROCESSING DEVICE AND IMPEDANCE MATCHING METHOD
    8.
    发明申请
    SUBSTRATE PROCESSING DEVICE AND IMPEDANCE MATCHING METHOD 审中-公开
    基板处理装置和阻抗匹配方法

    公开(公告)号:US20130105082A1

    公开(公告)日:2013-05-02

    申请号:US13664970

    申请日:2012-10-31

    Abstract: Provided are a substrate processing device and an impedance matching method. The substrate processing device includes: a high frequency power source for generating high frequency power; a process chamber for performing a plasma process by using the high frequency power; a matching circuit for compensating for a changed impedance of the process chamber; and a transformer disposed between the process chamber and the matching circuit in order to reduce the impedance of the process chamber.

    Abstract translation: 提供了基板处理装置和阻抗匹配方法。 基板处理装置包括:高频电源,用于产生高频电力; 处理室,用于通过使用高频功率来执行等离子体处理; 用于补偿处理室的改变的阻抗的匹配电路; 以及设置在处理室和匹配电路之间的变压器,以便减小处理室的阻抗。

Patent Agency Ranking