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公开(公告)号:US11749351B2
公开(公告)日:2023-09-05
申请号:US17404652
申请日:2021-08-17
Applicant: SK hynix Inc.
Inventor: Dong Uk Lee , Hae Chang Yang , Hun Wook Lee
CPC classification number: G11C16/102 , G11C16/08 , G11C16/14 , G11C16/26 , G11C16/30
Abstract: A memory controller that controls a memory device including a memory block includes an initial program controller configured to control the memory device to program at least one or more monitoring memory cells from among memory cells respectively connected to monitoring word lines from among a plurality of word lines connected to the memory block, a pre-read controller configured to generate a shifting information of a threshold voltage distribution of the monitoring memory cells based on a result of reading the monitoring memory cells before a read operation is performed on the memory block, and a pre-program controller configured to control the memory device to perform the read operation after applying a pre-program voltage having a voltage level determined according to the shifting information to the plurality of word lines.
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公开(公告)号:US11742034B2
公开(公告)日:2023-08-29
申请号:US17745415
申请日:2022-05-16
Applicant: Micron Technology, Inc.
Inventor: Eric N. Lee , Lawrence Celso Miranda
CPC classification number: G11C16/3404 , G11C16/10 , G11C16/26 , G11C16/30
Abstract: Some embodiments include apparatus and methods using access lines, first memory cells coupled to an access line of the access lines, and a control unit including circuitry. The control unit is configured to apply a first voltage to the access line; check first threshold voltages of the first memory cells after applying the first voltage; obtain offset information based on a determination that at least one of the first threshold voltages is greater than a selected voltage; generate a second voltage, the second voltage being a function of the first voltage and the offset information; and apply the second voltage to one of the access lines during an operation of storing information in second memory cells.
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公开(公告)号:US11742033B2
公开(公告)日:2023-08-29
申请号:US17647509
申请日:2022-01-10
Applicant: Kioxia Corporation
Inventor: Tatsuro Midorikawa , Masami Masuda
Abstract: According to one embodiment, a voltage generation circuit includes a first boost circuit, a voltage division circuit, a first detection circuit, a capacitor and a first switch. The first boost circuit outputs a first voltage. The voltage division circuit divides the first voltage. The first detection circuit is configured to detect a first monitor voltage supplied to the first input terminal, based on a reference voltage which is supplied to a second input terminal of the first detection circuit, and to control an operation of the first boost circuit. The capacitor is connected between an output terminal of the first boost circuit and the first input terminal of the first detection circuit. The first switch cuts off a connection between the capacitor and the first detection circuit, based on an output signal of the first detection circuit, until the first voltage is output from the first boost circuit.
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公开(公告)号:US11742029B2
公开(公告)日:2023-08-29
申请号:US17402279
申请日:2021-08-13
Applicant: MICRON TECHNOLOGY, INC.
Inventor: Zhongguang Xu , Tingjun Xie , Murong Lang , Zhenming Zhou
CPC classification number: G11C16/26 , G11C16/102 , G11C16/30 , G11C16/32 , G11C16/3404
Abstract: A method includes performing a first write operation that writes data to a first memory unit of a group of memory units in a memory device, determining a write-to-write (W2W) delay based on a time difference between the first write operation and a second write operation on a memory unit in the group of memory units, wherein the second write operation occurred prior to the first write operation, identifying a threshold time criterion that is satisfied by the W2W delay, identifying a first read voltage level associated with the threshold time criterion, and associating the first read voltage level with a second memory unit of the group of memory units. The second memory unit can be associated with a second read voltage level that satisfies a selection criterion based on a comparison of the second read voltage level to the first read voltage level.
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公开(公告)号:US11735277B2
公开(公告)日:2023-08-22
申请号:US17470002
申请日:2021-09-09
Applicant: Kioxia Corporation
Inventor: Tomohiko Ito , Kazuto Uehara
CPC classification number: G11C16/30 , G11C16/0483 , G11C16/08 , G11C16/10 , G11C16/3459
Abstract: According to one embodiment, a semiconductor memory device includes a first memory cell and a first boosting circuit. The first boosting circuit generates a first voltage, a second voltage, and a third voltage lower than the second voltage at a first output terminal. The first, second and third voltages is used for a write operation. The write operation includes a first program operation and a first verify operation executed after the first program operation. The first boosting circuit generates the first voltage at the first output terminal during the first program operation, generates the third voltage at the first output terminal at end of the first program operation, generates the second voltage at the first output terminal during the first verify operation, and then generates the first voltage to the first output terminal during the first verify operation.
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公开(公告)号:US11733868B2
公开(公告)日:2023-08-22
申请号:US17382019
申请日:2021-07-21
Applicant: Kioxia Corporation
Inventor: Yaron Klein
CPC classification number: G06F3/061 , G06F3/0653 , G06F3/0659 , G06F3/0679 , G06F3/0688 , G11C7/04 , G11C16/10 , G11C16/26 , G11C16/30 , G11C16/3495
Abstract: Disclosed herein is a device and method for dynamically processing of a command within a storage system. This includes identifying a plurality of non-volatile memory storage locations of the storage system that have at least one operation parameter associated with the plurality of non-volatile memory storage locations. For each identified plurality of non-volatile memory storage locations, there is a determination whether a value of the at least one operation parameter exceeds a predetermined threshold value. That value is representative of operation effects of the storage system on a corresponding storage location of the identified plurality of non-volatile memory storage locations. During operation of the storage system, there is a throttling of execution of the command to access a storage location of the identified plurality of non-volatile memory storage locations that has the value determined to exceed the predetermined threshold value by a throttle amount determined to mitigate an effect of the value exceeding the predetermined threshold value.
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公开(公告)号:US11727994B2
公开(公告)日:2023-08-15
申请号:US17542694
申请日:2021-12-06
Applicant: Micron Technology, Inc.
Inventor: Michael Sheperek , Kishore Kumar Muchherla , Mustafa N. Kaynak , Vamsi Pavan Rayaprolu , Bruce A. Liikanen , Larry J. Koudele
CPC classification number: G11C16/20 , G11C16/26 , G11C16/30 , G11C16/32 , G11C16/3404 , G11C2207/2254
Abstract: An example memory sub-system includes a memory device and a processing device, operatively coupled to the memory device. The processing device is configured to program a first block in a first die of the memory device and a second block in a second die of the memory device, wherein the first die and the second die are assigned to a die group; and associate the die group with a threshold voltage offset bin.
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公开(公告)号:US20230253059A1
公开(公告)日:2023-08-10
申请号:US18301377
申请日:2023-04-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: KYUNG-MIN KANG , DONGKU KANG , SU CHANG JEON , WON-TAECK JUNG
CPC classification number: G11C16/3481 , G11C16/10 , G11C16/30 , G11C16/28 , G11C16/08
Abstract: A nonvolatile memory device includes a peripheral circuit region and a memory cell region vertically connected with the peripheral circuit region, the peripheral circuit region including at least one first metal pad, and the memory cell region including at least one second metal pad directly connected with the at least one first metal pad. A method of programming the nonvolatile memory device incudes: receiving a programming command, data for a plurality of pages, and an address corresponding to a selected word-line; programming the data for one of the pages to an unselected word-line; reading data of a previously programmed page from the selected word-line; and programming the data for the remaining pages and the data of the previously programmed page to the selected word-line.
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公开(公告)号:US20230253055A1
公开(公告)日:2023-08-10
申请号:US18303016
申请日:2023-04-19
Applicant: Yangtze Memory Technologies Co., Ltd.
Inventor: Jason GUO
CPC classification number: G11C16/30 , G11C16/32 , G11C16/0483
Abstract: Methods of peak power management (PPM) for a storage system having multiple memory dies are disclosed. Each memory die includes a first PPM circuit and a second PPM circuit. First PPM circuits of the multiple memory dies are electrically connected to form a first PPM group. Similarly, second PPM circuits are electrically connected to form a second PPM group. Peak power operations can be managed by switching on a first pull-down driver of the first PPM circuit on a selected memory die when a first PPM enablement signal of the first PPM group is zero; waiting for a first delay period; switching on a second pull-down driver of the second PPM circuit on the selected memory die when a second PPM enablement signal of the second PPM group is zero. The first and second PPM enablement signals depend on the current flowing through each pull-down driver in the first and second PPM groups.
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公开(公告)号:US11721400B2
公开(公告)日:2023-08-08
申请号:US17020897
申请日:2020-09-15
Applicant: MICRON TECHNOLOGY, INC.
Inventor: Tomoharu Tanaka
IPC: G11C16/30 , G11C5/14 , G11C16/04 , G01R19/10 , G06F1/3296 , G01R19/165 , G06F1/28
CPC classification number: G11C16/30 , G01R19/10 , G01R19/16571 , G06F1/28 , G06F1/3296 , G11C5/145 , G11C16/0483
Abstract: A semiconductor package includes an external power supply node, a current monitoring node, and a plurality of semiconductor dies. Each semiconductor die of the plurality of semiconductor dies includes a first circuit and a second circuit. The first circuit is configured to supply a first operating current to that semiconductor die from the external power supply node. The second circuit is configured to measure the first operating current and output the measured first operating current to the current monitoring node. The measured first operating current from each semiconductor die of the plurality of semiconductor dies is summed on the current monitoring node.
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