Method and device for testing air tightness

    公开(公告)号:US10508969B2

    公开(公告)日:2019-12-17

    申请号:US15846026

    申请日:2017-12-18

    Abstract: A method for testing air tightness includes connecting a testing chamber and a storage chamber, supplying negative pressure to the storage chamber, measuring the pressure in the storage or testing chamber to obtain a first pressure value, determining air tightness of the testing chamber according to the negative pressure and the first pressure value, stopping the negative pressure to the storage chamber, measuring the pressure in the storage chamber to obtain a second pressure value, measuring the pressure in the storage chamber after stopping the negative pressure to the storage chamber to obtain a third pressure value, and determining air tightness of the testing chamber according to the second and third pressure values. The device includes testing and storage chambers, a negative pressure generator, and a pressure gauge connected to the storage chamber, which is connected to the testing chamber. The negative pressure generator is connected to the storage chamber.

    Optical measuring device
    62.
    发明授权

    公开(公告)号:US10436636B2

    公开(公告)日:2019-10-08

    申请号:US16158319

    申请日:2018-10-12

    Inventor: Wei-Yao Chang

    Abstract: An optical measuring device is configured to measure a light beam emitted from a light source. The optical measuring device includes a light collecting element, at least four light-sensing elements, a light splitting device, and at least one lens. The light collecting element is configured to collect the light beam. The light-sensing elements are configured to respectively sense the light fields of different light paths of the light beam. The respective distances of the light paths between the respective light-sensing elements and the light source are different from each other. The light splitting device is configured to split the light beam passing through the light collecting element and respectively guide the split light beams to the light sensing elements. The lens is disposed between at least one of the light-sensing elements and the light collecting element, and is configured to form images on the at least four light-sensing elements.

    Clamp-type probe device
    63.
    发明授权

    公开(公告)号:US10215812B2

    公开(公告)日:2019-02-26

    申请号:US15604602

    申请日:2017-05-24

    Abstract: A clamp-type probe device comprises a first pressed member, a second pressed member and a probe head. The first pressed member comprises a first clamping portion and a first mounted portion connected to each other, and has a first and a second assembly holes. The second pressed member comprises a second clamping portion and a second mounted portion connected to each other. The second and the first mounted portions are connected to each other. The second and the first clamping portions are separated from each other. The probe head comprises a plurality of contacting members. Each contacting member comprises two bending portions. Two ends of each contacting member are respectively disposed through the first and the second assembly holes. The two bending portions are respectively pressed against an inner side surface of the first assembly hole and an inner side surface of the second assembly hole.

    Inspection system and method for obtaining an adjusted light intensity image

    公开(公告)号:US09706098B2

    公开(公告)日:2017-07-11

    申请号:US14958904

    申请日:2015-12-03

    CPC classification number: H04N5/2256 H04N5/2354 H04N17/002

    Abstract: An inspection system for obtaining an adjusted light intensity image includes a light source, an image capturing device and a controller. A field of view of the image capturing device is adjusted within an illumination area of the light source. A plurality of light emitting units of the light source are turned on in sequence. The image capturing device captures a calibration image when each of the light emitting units is turned on to obtain a plurality of the calibration images. The controller adjusts the light emitting intensities of the light emitting units respectively according to the light intensity distributions of the calibration images to obtain a specific intensity distribution of an inspection image in the field of view and compensate a vignette effect of the image capturing device.

    Clock generating device
    66.
    发明授权

    公开(公告)号:US09647650B2

    公开(公告)日:2017-05-09

    申请号:US14971044

    申请日:2015-12-16

    CPC classification number: H03K5/135 G06F1/04 G06F1/06 H03K2005/00078

    Abstract: A clock generating device includes a first timing delay module, a multiplexer, and a second timing delay module. The multiplexer is electrically connected to the first timing delay module. The second timing delay module is electrically connected to the multiplexer. The first timing delay module generates a plurality of delayed clock signals based on a reference clock signal. The multiplexer outputs a first delayed clock signal and a second delayed clock signal, among the plurality of delayed clock signals, based on a clock generating signal. The second timing delay module generates an output clock signal based on the clock generating signal, the first delayed clock signal and the second delayed clock signal.

    Heating furnace
    68.
    发明授权
    Heating furnace 有权
    加热炉

    公开(公告)号:US09568245B2

    公开(公告)日:2017-02-14

    申请号:US14681093

    申请日:2015-04-08

    CPC classification number: F27B1/08 F27B17/0083 F27D7/04 F27D2007/045

    Abstract: The disclosure discloses a heating furnace including a housing, a first rack, a chamber, and at least one fan. The first rack is disposed in the housing. The chamber is disposed in the housing and located at a side of the first rack. The chamber includes an inlet, a first sidewall, and a second sidewall. The first sidewall is adjacent to the first rack. The first sidewall has a plurality of vents. The first sidewall and the second sidewall are disposed to face each other. A width is spaced between the first sidewall and the second sidewall, and the width is larger than or equal to 200 mm. The fan is disposed in the housing for generating an airflow to the inlet.

    Abstract translation: 本公开公开了一种加热炉,其包括壳体,第一齿条,腔室和至少一个风扇。 第一个机架设置在外壳中。 腔室设置在壳体中并且位于第一齿条的一侧。 腔室包括入口,第一侧壁和第二侧壁。 第一侧壁与第一机架相邻。 第一侧壁具有多个通风孔。 第一侧壁和第二侧壁被设置为彼此面对。 宽度在第一侧壁和第二侧壁之间间隔开,并且宽度大于或等于200mm。 风扇设置在壳体中以产生到入口的气流。

    Testing system for testing semiconductor package stacking chips and semiconductor automatic tester thereof
    69.
    发明授权
    Testing system for testing semiconductor package stacking chips and semiconductor automatic tester thereof 有权
    半导体封装堆垛芯片测试系统及其半导体自动测试仪

    公开(公告)号:US09250292B2

    公开(公告)日:2016-02-02

    申请号:US13854372

    申请日:2013-04-01

    Inventor: Chien-Ming Chen

    CPC classification number: G01R31/2896 G01R31/2887

    Abstract: A testing system for testing semiconductor package stacking chips is disclosed. The system includes a testing socket, a testing arm, and a testing mechanism. The testing mechanism includes a probe testing device. The probe testing device has a testing chip inside and a plurality of testing probes electrically connected to the testing chip. The plurality of testing probes extends toward the testing socket for contacting a chip-under-test loaded on the testing socket. When the testing mechanism moves to an upper position between the testing socket and the testing arm, the testing arm moves downward in the vertical direction and presses down the testing mechanism thereby coercing the plurality of testing probes in the testing mechanism to closely abut against the chip-under-test, so that the testing chip inside the testing mechanism can electrically connect to the chip-under-test for forming a test loop.

    Abstract translation: 公开了一种用于测试半导体封装堆叠芯片的测试系统。 该系统包括测试插座,测试臂和测试机构。 测试机构包括探针测试装置。 探针测试装置内部具有测试芯片,并且多个测试探针电连接到测试芯片。 多个测试探针延伸到测试插座,用于接触加载在测试插座上的芯片下测试。 当测试机构移动到测试插座和测试臂之间的上部位置时,测试臂沿垂直方向向下移动并按压测试机构,从而迫使测试机构中的多个测试探针紧紧靠在芯片上 - 测试,使测试机构内的测试芯片可以电连接到芯片下测试以形成测试回路。

    AUTOMATIC RETEST METHOD FOR SYSTEM-LEVEL IC TEST EQUIPMENT AND IC TEST EQUIPMENT USING SAME
    70.
    发明申请
    AUTOMATIC RETEST METHOD FOR SYSTEM-LEVEL IC TEST EQUIPMENT AND IC TEST EQUIPMENT USING SAME 审中-公开
    用于系统级IC测试设备的自动反馈方法和使用该测试设备的IC测试设备

    公开(公告)号:US20150066414A1

    公开(公告)日:2015-03-05

    申请号:US14261427

    申请日:2014-04-25

    CPC classification number: G01R31/2894 G01R31/287

    Abstract: An automatic retest method for a system-level IC test equipment and the IC test equipment is disclosed, wherein the IC test equipment includes multiple testing units, a loading/unloading unit, and a processing unit; each testing unit is capable of testing an IC individually and has a pass rate. When the testing unit finishes a test operation, it will send test report of the IC to the processing unit. The processing unit will determine whether the IC has reached a pass threshold of the testing unit. The processing unit will issue a command, according to a predetermined rule, to transfer the IC that failed to reach the pass threshold to one of the testing units conforming to the predetermined rule to conduct a retest operation. Finally, the processing unit will confirm whether the IC that failed to reach the pass threshold has reached the pass threshold in the retest operation.

    Abstract translation: 公开了一种用于系统级IC测试设备和IC测试设备的自动再测试方法,其中IC测试设备包括多个测试单元,加载/卸载单元和处理单元; 每个测试单元都能够单独测试IC并具有合格率。 当测试单元完成测试操作时,它将向处理单元发送IC的测试报告。 处理单元将确定IC是否已达到测试单元的通过阈值。 处理单元将根据预定规则发出命令,将未达到通过阈值的IC传送到符合预定规则的测试单元之一,以进行重新测试操作。 最后,处理单元将确认在重新测试操作中未达到通过阈值的IC是否达到通过阈值。

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