Abstract:
A method for testing air tightness includes connecting a testing chamber and a storage chamber, supplying negative pressure to the storage chamber, measuring the pressure in the storage or testing chamber to obtain a first pressure value, determining air tightness of the testing chamber according to the negative pressure and the first pressure value, stopping the negative pressure to the storage chamber, measuring the pressure in the storage chamber to obtain a second pressure value, measuring the pressure in the storage chamber after stopping the negative pressure to the storage chamber to obtain a third pressure value, and determining air tightness of the testing chamber according to the second and third pressure values. The device includes testing and storage chambers, a negative pressure generator, and a pressure gauge connected to the storage chamber, which is connected to the testing chamber. The negative pressure generator is connected to the storage chamber.
Abstract:
An optical measuring device is configured to measure a light beam emitted from a light source. The optical measuring device includes a light collecting element, at least four light-sensing elements, a light splitting device, and at least one lens. The light collecting element is configured to collect the light beam. The light-sensing elements are configured to respectively sense the light fields of different light paths of the light beam. The respective distances of the light paths between the respective light-sensing elements and the light source are different from each other. The light splitting device is configured to split the light beam passing through the light collecting element and respectively guide the split light beams to the light sensing elements. The lens is disposed between at least one of the light-sensing elements and the light collecting element, and is configured to form images on the at least four light-sensing elements.
Abstract:
A clamp-type probe device comprises a first pressed member, a second pressed member and a probe head. The first pressed member comprises a first clamping portion and a first mounted portion connected to each other, and has a first and a second assembly holes. The second pressed member comprises a second clamping portion and a second mounted portion connected to each other. The second and the first mounted portions are connected to each other. The second and the first clamping portions are separated from each other. The probe head comprises a plurality of contacting members. Each contacting member comprises two bending portions. Two ends of each contacting member are respectively disposed through the first and the second assembly holes. The two bending portions are respectively pressed against an inner side surface of the first assembly hole and an inner side surface of the second assembly hole.
Abstract:
A calibration board and a timing calibration method thereof are provided. The calibration board for calibrating signal delays of test channels in an automatic test equipment is pluggably disposed in the automatic test equipment and includes calibration groups, a first common node, and a switching module. Each calibration group includes a second common node and conductive pads electrically connecting to the second common node. Each conductive pad selectively and electrically connects to one test channel. The switching module electrically connects to the first common node and each second common node. When a first delay calibration procedure is performed, the connection between the first common node and each second common node is disabled. When a second delay calibration procedure is performed, the connection between the first common node and each second common node is built.
Abstract:
An inspection system for obtaining an adjusted light intensity image includes a light source, an image capturing device and a controller. A field of view of the image capturing device is adjusted within an illumination area of the light source. A plurality of light emitting units of the light source are turned on in sequence. The image capturing device captures a calibration image when each of the light emitting units is turned on to obtain a plurality of the calibration images. The controller adjusts the light emitting intensities of the light emitting units respectively according to the light intensity distributions of the calibration images to obtain a specific intensity distribution of an inspection image in the field of view and compensate a vignette effect of the image capturing device.
Abstract:
A clock generating device includes a first timing delay module, a multiplexer, and a second timing delay module. The multiplexer is electrically connected to the first timing delay module. The second timing delay module is electrically connected to the multiplexer. The first timing delay module generates a plurality of delayed clock signals based on a reference clock signal. The multiplexer outputs a first delayed clock signal and a second delayed clock signal, among the plurality of delayed clock signals, based on a clock generating signal. The second timing delay module generates an output clock signal based on the clock generating signal, the first delayed clock signal and the second delayed clock signal.
Abstract:
A test system with rotational test arms for testing semiconductor components includes a transport device, a first test socket, a second test socket, a first test arm, and a second test arm. The first test socket and the second test socket are electrically connected to different test signals respectively and correspond to the first test arm and the second test arm. The first test arm and the second test arm test arms operate rotationally to carry and place the semiconductor components to the transport device, the first test socket and the second test socket, so the test time is improved.
Abstract:
The disclosure discloses a heating furnace including a housing, a first rack, a chamber, and at least one fan. The first rack is disposed in the housing. The chamber is disposed in the housing and located at a side of the first rack. The chamber includes an inlet, a first sidewall, and a second sidewall. The first sidewall is adjacent to the first rack. The first sidewall has a plurality of vents. The first sidewall and the second sidewall are disposed to face each other. A width is spaced between the first sidewall and the second sidewall, and the width is larger than or equal to 200 mm. The fan is disposed in the housing for generating an airflow to the inlet.
Abstract:
A testing system for testing semiconductor package stacking chips is disclosed. The system includes a testing socket, a testing arm, and a testing mechanism. The testing mechanism includes a probe testing device. The probe testing device has a testing chip inside and a plurality of testing probes electrically connected to the testing chip. The plurality of testing probes extends toward the testing socket for contacting a chip-under-test loaded on the testing socket. When the testing mechanism moves to an upper position between the testing socket and the testing arm, the testing arm moves downward in the vertical direction and presses down the testing mechanism thereby coercing the plurality of testing probes in the testing mechanism to closely abut against the chip-under-test, so that the testing chip inside the testing mechanism can electrically connect to the chip-under-test for forming a test loop.
Abstract:
An automatic retest method for a system-level IC test equipment and the IC test equipment is disclosed, wherein the IC test equipment includes multiple testing units, a loading/unloading unit, and a processing unit; each testing unit is capable of testing an IC individually and has a pass rate. When the testing unit finishes a test operation, it will send test report of the IC to the processing unit. The processing unit will determine whether the IC has reached a pass threshold of the testing unit. The processing unit will issue a command, according to a predetermined rule, to transfer the IC that failed to reach the pass threshold to one of the testing units conforming to the predetermined rule to conduct a retest operation. Finally, the processing unit will confirm whether the IC that failed to reach the pass threshold has reached the pass threshold in the retest operation.