公开(公告)号：US06692548B2

公开(公告)日：2004-02-17

申请号：US09887087

申请日：2001-06-25

Applicant: Kenji Sakai ,  Naohisa Kawakami ,  Satoru Kurimoto ,  Takashi Inaba ,  Koichi Yamamoto ,  Takayuki Shibayama

Inventor： Kenji Sakai ,  Naohisa Kawakami ,  Satoru Kurimoto ,  Takashi Inaba ,  Koichi Yamamoto ,  Takayuki Shibayama

IPC: C22C105

CPC classification number: F16C33/14 ,  B22F1/0003 ,  B22F2998/00 ,  B22F2999/00 ,  F16C33/12 ,  F16C2204/12 ,  F16C2220/20 ,  F16C2220/60 ,  Y10T428/12063 ,  B22F7/04 ,  C22C1/0425 ,  C22C32/00

Abstract: A copper-based sliding material produced by sintering, comprising at least two phases of copper and/or copper alloys which phases have hardness levels different form each other, and hard particles with an average particle size of 0.1 to 10 &mgr;m which are dispersed in at least one phase with the exception of a softest phase in an amount of 0.1 to 10 vol. % of the whole copper-based sliding material, said sliding material satisfying (H2/H1)≧1.2 in which H1 is the Vickers hardness of the softest phase and in which H2 is the Vickers hardness of a phase hardest in hardness including said hard particles.

Abstract translation: 通过烧结制造的铜基滑动材料，其包含至少两相的铜和/或铜合金，其相硬度水平彼此不同，并且平均粒度为0.1〜10μm的硬质粒子分散在 至少一相，除了0.1至10体积的最软相外。 全部铜基滑动材料的％，所述滑动材料满足（H2 / H1）> = 1.2，其中H1是最软相的维氏硬度，其中H 2是硬度最高硬度的维氏硬度，包括所述硬 粒子。

公开(公告)号：US06203414B1

公开(公告)日：2001-03-20

申请号：US09053062

申请日：1998-04-01

Applicant: Minoru Numoto ,  Takao Inaba ,  Kenji Sakai ,  Hisashi Terashita ,  Manabu Satoh

Inventor： Minoru Numoto ,  Takao Inaba ,  Kenji Sakai ,  Hisashi Terashita ,  Manabu Satoh

IPC: B24B722

CPC classification number: B24B37/30 ,  B24B49/16

Abstract: The polishing apparatus comprises a turn table, which polishes a semiconductor wafer, and a holding and pressing part, which holds and presses the semiconductor wafer against a polishing surface of the turn table. The holding and pressing part transmits a force from an air bag to the semiconductor wafer via a pressurized fluid layer to thereby press the semiconductor wafer against the polishing surface via the pressurized fluid layer, so that the semiconductor wafer can be polished. Thereby, it is possible to uniformly polish the semiconductor wafer.

Abstract translation: 抛光装置包括：抛光半导体晶片的转台，以及将半导体晶片压靠在转台的抛光表面上的保持和按压部分。 保持和按压部分经由加压流体层将气体从气囊传递到半导体晶片，从而经由加压流体层将半导体晶片压靠在抛光表面上，从而可以抛光半导体晶片。 由此，能够均匀地研磨半导体晶片。

公开(公告)号：USD306031S

公开(公告)日：1990-02-13

申请号：US142769

申请日：1988-01-11

Applicant: Shigeharu Ushiwata ,  Yoshio Matsumoto ,  Masayuki Sato ,  Kenji Sakai

Designer： Shigeharu Ushiwata ,  Yoshio Matsumoto ,  Masayuki Sato ,  Kenji Sakai

公开(公告)号：US4533272A

公开(公告)日：1985-08-06

申请号：US554409

申请日：1983-11-22

Applicant: Kenji Sakai

Inventor： Kenji Sakai

IPC: B43K5/17 ,  B43K7/12 ,  B43K8/02 ,  B43K24/06 ,  B43K9/00

CPC classification number: B43K7/12 ,  B43K24/06 ,  B43K8/028

Abstract: A writing instrument with a movable closure, having a snap member for automatically closing the opening at the forward portion of the tapered front end of the writing instrument as the writing unit, within the writing instrument, is retracted. The snap member includes a cylindrical end and a plurality of resilient support segments extending from said cylindrical end and terminating in covers attached to or integrally formed on the ends of the support segments opposite the cylindrical end. These covers provide an airtight seal at the open front end of the writing instrument as they close upon each other in response to the forward movement of the snap member, when the writing instrument is placed in its projected, writing position, the snap member is moved rearwardly, out of the open front end of the writing instrument toward the larger diameter section of the tapered front end. Since the resilient support segments are no longer constricted within the narrow diameter front end opening, they expand radially, opening the covers to provide a passage through which the writing unit can pass.

Abstract translation: 具有可移动闭合件的书写工具具有用于在书写工具内自动关闭作为书写单元的书写工具的锥形前端的前部的开口的卡扣构件。 卡扣构件包括圆柱形端部和从所述圆柱形端部延伸并终止于附接到或整体形成在与圆柱形端部相对的支撑段的端部上的盖的多个弹性支撑段。 当书写工具放置在其突出的书写位置时，这些盖在书写工具的敞开的前端提供气密密封，因为它们相对于卡扣构件的向前移动彼此靠近，卡扣构件被移动 向后，从书写工具的敞开的前端朝向锥形前端的较大直径部分。 由于弹性支撑段在窄直径前端开口内不再收缩，所以它们径向膨胀，打开盖子以提供书写单元能通过的通道。

公开(公告)号：US08815597B2

公开(公告)日：2014-08-26

申请号：US12377234

申请日：2007-08-23

Applicant: Hideto Chono ,  Junichi Mineno ,  Kazutoh Takesako ,  Takao Yoshida ,  Takashi Morimura ,  Kenji Sakai ,  Shin-ichi Yamada ,  Noritsugu Yabe ,  Yuko Taguchi

Inventor： Hideto Chono ,  Junichi Mineno ,  Kazutoh Takesako ,  Takao Yoshida ,  Takashi Morimura ,  Kenji Sakai ,  Shin-ichi Yamada ,  Noritsugu Yabe ,  Yuko Taguchi

IPC: C12N1/00 ,  C12M1/42 ,  C12N15/87 ,  A61J1/10 ,  C12M1/00 ,  C12M3/00 ,  C12N15/00 ,  C12P21/04 ,  C12P21/06 ,  B01L3/00

CPC classification number: A61J1/10 ,  B01L3/5021 ,  B01L3/505 ,  C12M23/14 ,  C12M35/04 ,  C12N15/87

Abstract: The present invention provides a baglike container for centrifugation that is mounted in a centrifuge to thereby allow centrifugation of a dispersion liquid accommodated therein. The baglike container for centrifugation is less likely to tear or break as a result of centrifugation by disposing a container wall surface of the baglike container so as to apply centrifugal force perpendicular to the container wall surface.

Abstract translation: 本发明提供一种用于离心的袋状容器，其安装在离心机中，从而允许其中容纳的分散液的离心。 用于离心的袋状容器由于通过设置袋状容器的容器壁表面而离心而不易撕裂或破裂，从而施加垂直于容器壁表面的离心力。

公开(公告)号：US08803561B2

公开(公告)日：2014-08-12

申请号：US13228903

申请日：2011-09-09

Applicant: Motoki Imanishi ,  Kenji Sakai ,  Yoshikazu Tanaka ,  Kyouko Oyama

Inventor： Motoki Imanishi ,  Kenji Sakai ,  Yoshikazu Tanaka ,  Kyouko Oyama

IPC: H03K3/00

CPC classification number: H03K17/162 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor circuit of the present invention comprises a capacitor for charging ON driven electric charges in response to an ON driving signal, a capacitor for charging OFF driven electric charges in response to an OFF driving signal, a signal generating circuit for generating a first trigger signal in response to the ON driving signal, a signal generating circuit for generating a second trigger signal in response to the OFF driving signal, a discharging circuit for discharging the ON driven electric charges in response to the second trigger signal, and a discharging circuit for discharging the OFF driven electric charges in response to the first trigger signal. With this configuration, it is possible to provide a semiconductor circuit and a semiconductor device both of which have a general-purpose malfunction prevention function by which a malfunction due to dV/dt can be prevented without being affected by any external factor.

Abstract translation: 本发明的半导体电路包括：用于响应于ON驱动信号对接通驱动电荷进行充电的电容器;响应于OFF驱动信号而对驱动电荷进行充电的电容器;产生第一触发信号的信号产生电路 响应于ON驱动信号，产生响应于OFF驱动信号产生第二触发信号的信号发生电路，用于响应于第二触发信号对ON驱动电荷进行放电的放电电路，以及用于放电的放电电路 OFF驱动电荷响应于第一触发信号。 利用这种结构，可以提供一种具有通用故障防止功能的半导体电路和半导体器件，通过该功能可以防止由于dV / dt引起的故障，而不受任何外部因素的影响。

公开(公告)号：US08624127B2

公开(公告)日：2014-01-07

申请号：US12952864

申请日：2010-11-23

Applicant: Atsushi Ishida ,  Ryojiro Tominaga ,  Kenji Sakai

Inventor： Atsushi Ishida ,  Ryojiro Tominaga ,  Kenji Sakai

IPC: H05K1/09

CPC classification number: H05K3/4038 ,  H05K1/0222 ,  H05K1/0231 ,  H05K1/115 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49165

Abstract: A wiring board includes a substrate having first and second surfaces and a first penetrating hole through the substrate, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, an interlayer insulation layer on the substrate and the first or second circuit, and a third conductive circuit on the interlayer layer. The interlayer layer has a via conductor in the interlayer layer and connecting the third circuit and the second conductor. The substrate has a first through-hole conductor connecting the first and second circuits and on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor in the second hole. The via conductor is shifted from the center of the second conductor in the direction parallel to the first surface of the substrate.

Abstract translation: 布线板包括具有第一表面和第二表面的基底和穿过基底的第一穿透孔，在基底的第一表面上的第一导电电路，在基底的第二表面上的第二导电电路， 衬底和第一或第二电路，以及在层间层上的第三导电电路。 层间层在层间层中具有通孔导体，并连接第三电路和第二导体。 衬底具有第一通孔导体，其连接第一和第二电路，并且在第一孔的内壁上填充填充在第一导体内部并形成第二穿透孔的填充物，以及在第二孔中形成第二通孔导体 。 通孔导体在平行于基板的第一表面的方向上从第二导体的中心偏移。

公开(公告)号：US08307991B2

公开(公告)日：2012-11-13

申请号：US12442084

申请日：2007-09-12

Applicant: Hirofumi Morikawa ,  Yuji Tanaka ,  Kenji Sakai ,  Hidetada Kobayashi

Inventor： Hirofumi Morikawa ,  Yuji Tanaka ,  Kenji Sakai ,  Hidetada Kobayashi

IPC: B01D35/22 ,  B01D35/31 ,  B01D63/02

CPC classification number: B01D63/022 ,  B01D63/02 ,  B01D2313/08 ,  B01D2313/20 ,  B01D2313/21

Abstract: This invention provides a hollow fiber membrane module which can reduce pressure loss in discharging water within a module and can reduce operating power. A hollow fiber membrane bundle is disposed within a cylindrical case having in its side face an opening part for the inflow/outflow of water, and the end of the hollow fiber membrane bundle is bonded at an axially outer position with respect to the opening for the inflow/outflow of water. A distribution holes is provided axially inward of the opening for the inflow/outflow of water and so as to surround the outer periphery of the hollow fiber membrane bundle, and grooves and/or corrugated protrusions are provided on the inner face of the distribution cylinder so as to be in communication with each other among the distribution holes.

Abstract translation: 本发明提供一种中空纤维膜组件，其可以减少在模块内排放水中的压力损失并且可以降低操作功率。 中空纤维膜束设置在圆筒形壳体中，其侧面具有用于水的流入/流出的开口部分，并且中空纤维膜束的端部相对于开口部分的轴向外部位置接合 水的流入/流出。 在开口的轴向内侧设置有用于水的流入/流出的分配孔，并且围绕中空纤维膜束的外周，并且在分配筒的内表面上设置有槽和/或波纹状突起， 以便在分配孔中彼此连通。

公开(公告)号：US20120061347A1

公开(公告)日：2012-03-15

申请号：US13273335

申请日：2011-10-14

Applicant: Satoru KAWAI ,  Kenji Sakai ,  Liyi Chen

Inventor： Satoru KAWAI ,  Kenji Sakai ,  Liyi Chen

IPC: H05K3/46

CPC classification number: H05K3/4007 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/113 ,  H05K3/205 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/09436 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49162 ,  Y10T29/49213 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method for manufacturing a printed wiring board including preparing a carrier, forming a metal layer on the carrier, forming an etching resist on the metal layer, forming a metal film from the metal layer underneath the resist by removing portion of the metal layer exposed through the resist and part of the metal layer contiguous to the portion of the metal layer and underneath the resist, forming a coating layer on side surface of the film and the carrier, forming a pad on the coating layer, removing the resist, forming a resin insulation layer on the film and surface of the pad, forming an opening reaching the surface of the pad in the insulation layer, forming a conductive circuit on the insulation layer, forming a via conductor connecting the circuit and the pad in the opening, removing the carrier from the film and coating layer, and removing the film.

Abstract translation: 一种制造印刷电路板的方法，包括制备载体，在载体上形成金属层，在金属层上形成抗蚀剂，在抗蚀剂下面的金属层形成金属膜，除去暴露于金属层的部分 所述抗蚀剂和所述金属层的与所述金属层的所述部分相邻并且在所述抗蚀剂下方的部分，在所述膜和载体的侧表面上形成涂层，在所述涂层上形成焊盘，除去所述抗蚀剂，形成树脂 在所述膜的表面和所述垫的表面上形成绝缘层，形成在所述绝缘层中到达所述焊盘表面的开口，在所述绝缘层上形成导电电路，形成在所述开口中连接所述电路和所述焊盘的通孔导体， 载体从膜和涂层，并去除膜。

公开(公告)号：US20110286846A1

公开(公告)日：2011-11-24

申请号：US12678821

申请日：2010-01-29

Applicant: Katsuhiko Shoda ,  Kenji Sakai ,  Kazutaka Suzuki

Inventor： Katsuhiko Shoda ,  Kenji Sakai ,  Kazutaka Suzuki

IPC: F03D11/02 ,  F16H57/08

CPC classification number: F16H1/46 ,  F03D15/00 ,  F03D15/10 ,  F03D80/70 ,  F05B2260/40311 ,  Y02E10/722

Abstract: A sun-and-planet speed-up gear includes a low-speed-stage sun-and-planet gearing and a high-speed-stage sun-and-planet gearing, in which an input shaft is connected to a low-speed-stage ring gear, the position of a shaft of a low-speed-stage planet gear is secured, a shaft of a low-speed-stage sun gear is connected to a high-speed-stage carrier, and an output shaft is connected to a high-speed-stage sun gear. In order to automatically center the low-speed-stage sun gear to prevent damage to gears and a bearing, a flange formed at a tip of the shaft of the low-speed-stage sun gear and a flange formed at a tip of a coupling that is directly attached to the high-speed-stage carrier or that is formed on the high-speed-stage carrier are coupled via a sleeve.

Abstract translation: 太阳和行星加速装置包括低速级太阳和行星齿轮传动装置和高速级太阳和行星齿轮传动装置，其中输入轴连接到低速 - 固定低速级行星齿轮的轴的位置，将低速级太阳齿轮的轴连接到高速载物台，输出轴连接到 一个高速阶段的太阳齿轮。 为了使低速级太阳齿轮自动对中以防止齿轮和轴承的损坏，形成在低速级太阳齿轮的轴的尖端处的凸缘和形成在联轴器的尖端处的凸缘 直接连接在高速载物台上或形成在高速载物台上的装置通过套筒连接。