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    Laminated ceramic electronic component
    2.
    发明授权
    Laminated ceramic electronic component 有权
    层压陶瓷电子元件

    公开(公告)号：US08125765B2

    公开(公告)日：2012-02-28

    申请号：US12759807

    申请日：2010-04-14

    申请人： Atsushi Ishida ,  Takumi Taniguchi ,  Masaki Tani

    发明人： Atsushi Ishida ,  Takumi Taniguchi ,  Masaki Tani

    IPC分类号： H01G4/06

    CPC分类号： H01G4/232 ,  H01G4/012 ,  H01G4/30

    摘要： In a laminated ceramic electronic component including a ceramic element body including a plurality of effective sections, each of which constitutes a circuit element such as a laminated capacitor unit, bumps generated between the effective portions and a gap interposed between the effective portions can be made minimized. Specifically, the ceramic element body includes a first effective section including a first circuit element and a second effective section including a second circuit element. A gap is provided between the first and second effective section. Floating internal conductors are arranged in the gap at least in one of first and second external layer sections, the first external section being interposed between a first main surface and the first and second effective sections, and the second external layer section being interposed between a second main surface and the first and second effective sections.

    摘要翻译： 在包括具有多个有效部分的陶瓷元件体的层叠陶瓷电子部件中，每个有效部分构成诸如层叠电容器单元之类的电路元件，可以使有效部分之间产生的凸起和插入在有效部分之间的间隙最小化 。 具体地，陶瓷元件体包括第一有效部分，其包括第一电路元件和包括第二电路元件的第二有效部分。 在第一和第二有效部分之间提供间隙。 浮动的内部导体至少在第一和第二外部层中的一个中间排列在间隙中，第一外部部分介于第一主表面和第一和第二有效部分之间，第二外部部分介于第二外部部分之间 主表面和第一和第二有效部分。

    WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
    3.
    发明申请
    WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 有权
    接线板及其制造方法

    公开(公告)号：US20110284282A1

    公开(公告)日：2011-11-24

    申请号：US13053644

    申请日：2011-03-22

    申请人： Atsushi Ishida ,  Ryojiro Tominaga ,  Haruhiko Morita

    发明人： Atsushi Ishida ,  Ryojiro Tominaga ,  Haruhiko Morita

    IPC分类号： H05K1/11 ,  H05K3/42

    CPC分类号： H05K1/0251 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/09809 ,  Y10T29/49165

    摘要： A printed wiring board wiring board including a substrate having a first penetrating hole and multiple second penetrating holes formed around the first penetrating hole, a first conductive portion and a second conductive portion formed on one surface of the substrate, a third conductive portion and a fourth conductive portion formed on the opposite surface of the substrate, a first through-hole conductor formed in the first penetrating hole and connecting the first conductive portion and the third conductive portion, and multiple second through-hole conductors formed in the second penetrating holes and connecting the second conductive portion and the fourth conductive portion. The first through-hole conductor and the second through-hole conductors are made of conductive material filled in the first penetrating hole or the second penetrating holes.

    摘要翻译： 一种印刷线路板布线板，包括：具有形成在第一贯通孔周围的第一贯通孔和多个第二贯通孔的基板，形成在基板的一个面上的第一导电部和第二导电部，第三导电部和第四导电部 形成在所述基板的相对表面上的导电部分，形成在所述第一贯通孔中并连接所述第一导电部和所述第三导电部的第一通孔导体，以及形成在所述第二贯通孔中的多个第二通孔导体， 第二导电部分和第四导电部分。 第一通孔导体和第二通孔导体由填充在第一贯通孔或第二贯通孔中的导电材料构成。

    CERAMIC ELECTRONIC COMPONENT
    4.
    发明申请
    CERAMIC ELECTRONIC COMPONENT 有权
    陶瓷电子元件

    公开(公告)号：US20110255209A1

    公开(公告)日：2011-10-20

    申请号：US13079049

    申请日：2011-04-04

    申请人： Atsushi ISHIDA ,  Takumi TANIGUCHI ,  Takehisa SASABAYASHI ,  Tomoyuki KUWANO ,  Akihiro MOTOKI ,  Toshiyuki IWANAGA

    发明人： Atsushi ISHIDA ,  Takumi TANIGUCHI ,  Takehisa SASABAYASHI ,  Tomoyuki KUWANO ,  Akihiro MOTOKI ,  Toshiyuki IWANAGA

    IPC分类号： H01G4/228

    CPC分类号： H01G4/2325 ,  H01G4/232 ,  H01G4/30

    摘要： A ceramic electronic component includes a ceramic element including opposed side surfaces, an inner electrode, and an external terminal electrode. The external terminal electrode includes a first conductive layer and a second conductive layer. The first conductive layer is formed by plating so as to be electrically coupled to an exposed section of the internal electrode exposed to the side surfaces. The second conductive layer is arranged so as to cover the first conductive layer and includes conductive resin. The value of T2/T1 is in the range of about 3.4 to about 11.3, where T1 indicates the thickness of the first conductive layer and T2 indicates the thickness of the second conductive layer.

    摘要翻译： 陶瓷电子部件包括：陶瓷元件，其包括相对的侧面，内部电极和外部端子电极。 外部端子电极包括第一导电层和第二导电层。 第一导电层通过电镀形成，以便电连接到暴露于侧表面的内部电极的暴露部分。 第二导电层被布置成覆盖第一导电层并且包括导电树脂。 T2 / T1的值在约3.4至约11.3的范围内，其中T1表示第一导电层的厚度，T2表示第二导电层的厚度。

    SUBSTRATE WITH METAL FILM AND METHOD FOR MANUFACTURING THE SAME
    5.
    发明申请
    SUBSTRATE WITH METAL FILM AND METHOD FOR MANUFACTURING THE SAME 有权
    具有金属膜的基板及其制造方法

    公开(公告)号：US20100243311A1

    公开(公告)日：2010-09-30

    申请号：US12607666

    申请日：2009-10-28

    申请人： Ayao NIKI ,  Atsushi Ishida ,  Ryojiro Tominaga

    发明人： Ayao NIKI ,  Atsushi Ishida ,  Ryojiro Tominaga

    IPC分类号： H01R12/04 ,  H01K3/10

    CPC分类号： H05K3/4661 ,  H05K3/0035 ,  H05K3/387 ,  H05K3/422 ,  H05K3/4682 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/09581 ,  H05K2201/09827 ,  H05K2203/1168

    摘要： A method for manufacturing a substrate with a metal film includes preparing a first insulation layer having first and second surfaces, forming a first conductive circuit on the first surface of the first insulation layer, forming on the first surface of the first insulation layer and on the first conductive circuit a second insulation layer having first and second surfaces, forming in the second insulation layer a penetrating hole tapering from the first surface toward the first conductive circuit, forming on the inner wall of the penetrating hole, a composition containing a polymerization initiator and a polymerizable compound, providing a polymer on the inner wall of the penetrating hole by irradiating the composition, applying a plating catalyst on the polymer, and forming a plated-metal film on the inner wall of the penetrating hole. The first surface of the first insulation layer faces the second surface of the second insulation layer.

    摘要翻译： 一种用金属膜制造衬底的方法包括制备具有第一和第二表面的第一绝缘层，在第一绝缘层的第一表面上形成第一导电电路，在第一绝缘层的第一表面上形成第一绝缘层， 第一导电电路，具有第一和第二表面的第二绝缘层，在所述第二绝缘层中形成从所述第一表面向所述第一导电电路渐缩的穿透孔，在所述穿透孔的内壁上形成含有聚合引发剂和 聚合性化合物，通过照射该组合物，在该聚合物上涂布电镀催化剂，在该贯通孔的内壁上形成聚合物，在该贯通孔的内壁上形成电镀金属膜。 第一绝缘层的第一表面面向第二绝缘层的第二表面。

    Tone data processing device and method
    6.
    发明授权
    Tone data processing device and method 失效
    音调数据处理装置及方法

    公开(公告)号：US06826435B1

    公开(公告)日：2004-11-30

    申请号：US09306303

    申请日：1999-05-06

    申请人： Atsushi Ishida

    发明人： Atsushi Ishida

    IPC分类号： G10H106

    CPC分类号： G10H7/004 ,  G10H2250/541

    摘要： Tone generator LSI generates a subframe start signal to be interruptively given to a microprogram, by which the microprogram is activated to issue an interrupt signal to a device driver. In response to the interrupt signal, the device driver prepares control data for use in a next frame. The microprogram receives control data from a RAM at the beginning of each frame and calculates control data for individual samples of the frame on the basis of the received control data as well as control data generated for the last sample of an immediately preceding frame, so as to create a plurality of samples of tone data for each subframe. The thus-created tone data are temporarily written into a buffer and then read out from the buffer in accordance with predetermined clock pulses.

    摘要翻译： 音调发生器LSI产生中断给予微程序的子帧起始信号，通过该微程序，微程序被激活以向设备驱动器发出中断信号。 响应于中断信号，设备驱动程序准备用于下一帧的控制数据。 该微程序在每帧的开始处从RAM接收控制数据，并根据接收的控制数据以及为紧接在前的帧的最后一个样本生成的控制数据计算该帧的各个采样的控制数据，以便 以创建用于每个子帧的多个音调数据样本。 这样创建的音调数据被临时写入缓冲器，然后根据预定的时钟脉冲从缓冲器中读出。

    Engine mounting structure in motorcycle
    7.
    发明授权
    Engine mounting structure in motorcycle 失效
    发动机安装结构在摩托车

    公开(公告)号：US06758296B2

    公开(公告)日：2004-07-06

    申请号：US09947607

    申请日：2001-09-07

    申请人： Hiroshi Inaoka ,  Tsutomu Takeuchi ,  Atsushi Ishida ,  Kazuo Satoh

    发明人： Hiroshi Inaoka ,  Tsutomu Takeuchi ,  Atsushi Ishida ,  Kazuo Satoh

    IPC分类号： B62K1102

    CPC分类号： B62K11/10 ,  B62K25/283 ,  B62K2202/00 ,  B62M7/12 ,  F02B61/02

    摘要： A scooter type motorcycle includes a rear fork for supporting a rear wheel of the motorcycle. A front portion of the rear fork is attached to a crankcase of an engine in a vertically swingable manner. The engine is mounted to a body frame through elastic members. The mounting arrangement enhances the comfort of the ride of the motorcycle by reducing vibrations from being transmitted from the rear wheel to the rider.

    摘要翻译： 摩托车型摩托车包括用于支撑摩托车的后轮的后叉。 后叉的前部以垂直摆动的方式安装在发动机的曲轴箱上。 发动机通过弹性构件安装到车架上。 安装布置通过减少从后轮传递到骑手的振动来增强摩托车的乘坐舒适性。

    Device for switching valve operation modes in an internal combustion engine
    8.
    发明授权
    Device for switching valve operation modes in an internal combustion engine 失效
    用于在内燃机中切换阀门操作模式的装置

    公开(公告)号：US4911114A

    公开(公告)日：1990-03-27

    申请号：US349703

    申请日：1989-05-10

    申请人： Tsuneo Konno ,  Atsushi Ishida

    发明人： Tsuneo Konno ,  Atsushi Ishida

    IPC分类号： F01L1/18 ,  F01L1/26 ,  F01L13/00

    CPC分类号： F01L1/267 ,  F01L2820/031

    摘要： A device for switching valve operation modes in an internal combustion engine with a rotatable camshaft having cams integral therewith, valves disposed in intake or exhaust ports of the combustion chamber and normally urged closed by a spring, and the valves being openable by the cams through a plurality of rocker arms disposed adjacent to each other for imparting the cam lifts to the valves. A coupling mechanism selectively connects and disconnects the rocker arms by means of pistons in aligned guide holes in the rocker arms movable between positions to either extend across the adjacent sides of the rocker arms or be aligned with such sides. A solenoid is provided in one rocker arm and surrounds a piston to selectively cause movement of that piston. Springs urge the pistons to the position controlled by the solenoid.

    Wiring board and method for manufacturing the same
    9.
    发明授权
    Wiring board and method for manufacturing the same 有权
    接线板及其制造方法

    公开(公告)号：US08586875B2

    公开(公告)日：2013-11-19

    申请号：US12956753

    申请日：2010-11-30

    申请人： Haruhiko Morita ,  Atsushi Ishida ,  Ryojiro Tominaga

    发明人： Haruhiko Morita ,  Atsushi Ishida ,  Ryojiro Tominaga

    IPC分类号： H05K1/11

    CPC分类号： H05K1/0222 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/10015

    摘要： A wiring board includes a substrate having a first penetrating hole penetrating through the substrate, a first through-hole conductor formed on the inner wall of the first penetrating hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor formed in the second penetrating hole, a first conductive circuit formed on a first surface of the substrate; a second conductive circuit formed on a second surface of the substrate; a first conductive portion formed on one end of the second penetrating hole, and a second conductive portion formed on the opposite end of the second penetrating hole. The first conductor is connecting the first and second circuits. The second conductor is connecting the first and second conductive portions. The first circuit has the thickness which is set greater than the thickness of the first conductive portion.

    摘要翻译： 布线基板包括具有贯穿基板的第一穿透孔的基板，形成在第一贯通孔的内壁上的第一通孔导体，填充在第一导体内部并形成第二贯通孔的填充物， 形成在第二穿透孔中的通孔导体，形成在基板的第一表面上的第一导电电路; 形成在所述基板的第二表面上的第二导电电路; 形成在所述第二贯通孔的一端的第一导电部，以及形成在所述第二贯通孔的相对端的第二导电部。 第一个导体连接第一和第二个电路。 第二导体连接第一和第二导电部分。 第一电路的厚度被设定为大于第一导电部分的厚度。