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    TILED DISPLAYS AND METHODS OF MANUFACTURING THE SAME
    61.
    发明申请
    TILED DISPLAYS AND METHODS OF MANUFACTURING THE SAME 审中-公开

    公开(公告)号：US20200163233A1

    公开(公告)日：2020-05-21

    申请号：US16630206

    申请日：2018-07-05

    Applicant: CORNING INCORPORATED

    Inventor： Douglas Edward Brackley ,  Alexander Lee Cuno ,  Scott Winfield Deming ,  Sean Matthew Garner ,  Gregory Scott Glaesemann ,  Garrett Andrew Piech

    IPC: H05K5/00 ,  H01L25/075 ,  H01L23/544 ,  G02F1/1333

    Abstract: A tiled display having pixels arranged in rows and columns, and including first and second tiles. The tiles comprise a substrate carrying a matrix of pixels arranged at a pixel pitch. The substrates comprise an edge extending between opposing faces in a depth direction. The substrate edges have a complementary shape, and face one another to establish a seam. The pixel pitch is maintained across the seam. Pixels of the second tile are not interposed between pixels of the first tile. The complementary shape includes a segment of the seam being oblique to the pixel rows, or the substrate edge of the first tile profiled in the depth direction whereby at least a section of the edge is non-perpendicular to the faces. The tiled display can maintain the pixel pitch at the seams at high resolutions (e.g., pixel pitch less than 0.5 mm).

    APPARATUSES AND METHODS FOR LASER PROCESSING TRANSPARENT WORKPIECES USING NON-AXISYMMETRIC BEAM SPOTS
    64.
    发明申请
    APPARATUSES AND METHODS FOR LASER PROCESSING TRANSPARENT WORKPIECES USING NON-AXISYMMETRIC BEAM SPOTS 审中-公开

    公开(公告)号：US20180093914A1

    公开(公告)日：2018-04-05

    申请号：US15718848

    申请日：2017-09-28

    Applicant: CORNING INCORPORATED

    Inventor： Ravindra Kumar Akarapu ,  Garrett Andrew Piech ,  Sergio Tsuda ,  James Andrew West

    IPC: C03B33/08 ,  C03B33/10 ,  B23K26/00 ,  B23K26/06 ,  B23K26/073 ,  B23K26/08 ,  B23K26/38 ,  B23K26/067

    Abstract: A method for laser processing a transparent workpiece includes forming a contour line that includes defects, by directing a pulsed laser beam output by a beam source through an aspheric optical element positioned offset in a radial direction from the beam pathway and into the transparent workpiece such that the portion of the pulsed laser beam directed into the transparent workpiece generates an induced absorption within the transparent workpiece that produces a defect within the transparent workpiece. The portion of the pulsed laser beam directed into the transparent workpiece includes a wavelength λ, an effective spot size wo,eff, and a non-axisymmetric beam cross section having a minimum Rayleigh range ZRx,min in an x-direction and a minimum Rayleigh range ZRy,min in a y-direction. Further, the smaller of ZRx,min and ZRy,min is greater than F D  π   w 0 , eff 2 λ , where FD is a dimensionless divergence factor comprising a value of 10 or greater.

    METHODS OF CONTINUOUS FABRICATION OF HOLES IN FLEXIBLE SUBSTRATE SHEETS AND PRODUCTS RELATING TO THE SAME
    69.
    发明申请
    METHODS OF CONTINUOUS FABRICATION OF HOLES IN FLEXIBLE SUBSTRATE SHEETS AND PRODUCTS RELATING TO THE SAME 审中-公开
    连续制造柔性基材片和相关产品的方法

    公开(公告)号：US20170008122A1

    公开(公告)日：2017-01-12

    申请号：US15205284

    申请日：2016-07-08

    Applicant: CORNING INCORPORATED

    Inventor： Kristopher Allen Wieland ,  Garrett Andrew Piech ,  John Tyler Keech ,  Jeffrey Mathew Clark

    IPC: B23K26/00 ,  B32B3/26 ,  B23K26/386 ,  B32B17/06

    CPC classification number: B32B3/266 ,  B23K26/0604 ,  B23K26/53 ,  B23K2103/54 ,  B32B17/06 ,  B32B2307/412 ,  C03B33/0222 ,  C03C15/00 ,  C03C17/06 ,  H01L21/486 ,  H01L23/15 ,  H01L23/49827 ,  Y02P40/57

    Abstract: Systems and processes of cutting and drilling in a target substrate uses a laser (e.g., a pulsed laser) and an optical system to generate a line focus of the laser beam within the target substrate, such as a glass substrate sheet, are provided. The laser cutting and drilling system and process creates holes or defects that, in certain embodiments, extend the full depth of the glass sheet with each individual laser pulse, and allows the laser system to cut and separate the target substrate into any desired contour by creating a series of perforations that form a contour or desired part shape. Since a glass substrate sheet is brittle, cracking will then follow the perforated contour, allowing the glass substrate sheet to separate into any required shape defined by the perforations.

    Abstract translation: 在靶基板中切割和钻孔的系统和工艺使用激光器（例如脉冲激光器）和光学系统来产生激光束在诸如玻璃基板之类的目标基板内的线焦点。 激光切割和钻孔系统和工艺产生孔或缺陷，在某些实施例中，使用每个单独的激光脉冲来延伸玻璃板的整个深度，并且允许激光系统通过产生目标基板来切割和分离任何期望的轮廓 形成轮廓或期望的部件形状的一系列穿孔。 由于玻璃基片是脆性的，因此随着穿孔轮廓的开裂，允许玻璃基片分离成由穿孔限定的任何所需形状。

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