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公开(公告)号：US10752534B2
公开(公告)日：2020-08-25
申请号：US15795870
申请日：2017-10-27
Applicant: Corning Incorporated
Inventor： Albert Roth Nieber , Kristopher Allen Wieland
IPC: B23K26/53 , B23K26/57 , C03B33/07 , B32B17/10 , B23K26/08 , B23K26/55 , B23K26/0622 , B23K26/00 , B23K26/073 , B23K26/70 , B23K26/38 , B23K26/402 , C03B33/02 , C03B33/04 , B23K101/18 , B23K101/00 , B23K103/00 , B23K103/18 , B23K103/16
Abstract: A method for laser processing a laminate workpiece stack includes forming a contour line in a first transparent workpiece of the laminate workpiece stack having a resin layer disposed between the first transparent workpiece and a second transparent workpiece. Forming the contour line includes focusing a pulsed laser beam into a pulsed laser beam focal line directed into the first transparent workpiece to generate an induced absorption within the first transparent workpiece and translating the pulsed laser beam focal line along a first workpiece separation line, thereby laser forming the contour line having a plurality of defects. The method also includes separating the resin layer along a resin separation line by focusing the pulsed laser beam into the pulsed laser beam focal line directed into the resin layer and translating the pulsed laser beam focal line along the resin separation line, thereby laser ablating the resin layer.
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公开(公告)号：US20180179100A1
公开(公告)日：2018-06-28
申请号：US15812156
申请日：2017-11-14
Applicant: Corning Incorporated
Inventor： Sasha Marjanovic , Albert Roth Nieber , Garrett Andrew Piech , Helmut Schillinger , Sergio Tsuda , Robert Stephen Wagner
CPC classification number: C03B33/0222 , B23K26/0622 , B23K26/40 , B23K26/53 , B23K26/57 , B23K2103/172 , B23K2103/50 , C03B17/064 , C03B25/087 , C03B29/10 , C03B33/0215 , C03B33/07 , C03B33/091 , Y02P40/57 , Y10T428/24777 , Y10T428/249921
Abstract: The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of >1 m/sec, to cut sharp radii outer corners (
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公开(公告)号：US10335902B2
公开(公告)日：2019-07-02
申请号：US15325893
申请日：2015-07-14
Applicant: Corning Incorporated
Inventor： Dana Craig Bookbinder , Stephan Lvovich Logunov , Albert Roth Nieber , Garrett Andrew Piech , Pushkar Tandon , Sergio Tsuda
IPC: B23K26/402 , B23K26/0622 , B23K26/064 , B23K26/08 , B23K26/359 , B23K26/57 , B23K26/53 , B23K26/073 , C03B33/07 , C03B33/02 , B23K103/00
Abstract: A method of arresting propagation of an incident crack through a transparent material includes focusing pulsed laser beams into a laser beam focal line directed into the transparent material a series of locations corresponding to a predetermined pattern that is designed to arrest an incident crack that propagates through the transparent material, and generating, with the laser beam focal line (1460), an induced absorption within the transparent material in order to produce a defect (1440) in the transparent material.
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4.发明申请公开(公告)号：US20180118602A1
公开(公告)日：2018-05-03
申请号：US15792873
申请日：2017-10-25
Applicant: Corning Incorporated
Inventor： Thomas Hackert , Frank Fabian Herrnberger , Tim Meyne , Albert Roth Nieber , Florian Spaeth
CPC classification number: C03B33/03 , B65G49/064 , B65G2249/045 , B65H5/026 , B65H2404/25 , C03B33/0222 , C03B33/082 , C03B35/18
Abstract: A glass sheet processing apparatus includes a glass sheet processing station including a laser cutting assembly that includes an optical arrangement positioned in a beam path of the laser providing a laser beam focal line that is formed on a beam output side of the optical arrangement. A glass holding conveyor belt carries a glass sheet by the laser cutting assembly so that the laser beam focal line is positioned on the glass sheet with the glass sheet on the glass holding conveyor belt. The glass holding conveyor belt is configured to carry multiple glass sheets to the laser cutting assembly for cutting the multiple glass sheets on the glass holding conveyor belt in a repeated fashion.
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公开(公告)号：US20180044219A1
公开(公告)日：2018-02-15
申请号：US15660009
申请日：2017-07-26
Applicant: Corning Incorporated
Inventor： Sasha Marjanovic , Albert Roth Nieber , Garrett Andrew Piech , Helmut Schillinger , Sergio Tsuda , Robert Stephen Wagner
IPC: C03B33/02 , C03B33/09 , B23K26/035 , B23K26/0622 , B23K26/361 , C03B33/08 , B23K26/402 , B23K26/362 , B23K26/08 , B23K26/04 , B23K26/02 , C03C21/00 , B23K26/00 , B23K103/00
Abstract: Processes of chamfering and/or beveling an edge of a glass or other substrate of arbitrary shape using lasers are described herein. Three general methods to produce chamfers on glass substrates are disclosed. The first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser. Treatment with the ultra-short laser may be optionally followed by a CO2 laser for fully automated separation. The second method is based on thermal stress peeling of a sharp edge corner, and it has been demonstrated to work with different combination of an ultrashort pulse and/or CO2 lasers. A third method relies on stresses induced by ion exchange to effect separation of material along a fault line produced by an ultra-short laser to form a chamfered edge of desired shape.
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Patent Agency Ranking
公开(公告)号：US20180029920A1
公开(公告)日：2018-02-01
申请号：US15662788
申请日：2017-07-28
Applicant: Corning Incorporated
Inventor： Sasha Marjanovic , Albert Roth Nieber , Garrett Andrew Piech , Sergio Tsuda , Robert Stephen Wagner
IPC: C03B33/09 , C03B33/08 , B23K26/0622 , B23K26/53 , B23K26/00 , B23K26/08 , B23K26/402 , C03B33/033 , C03B33/02 , C03B23/025 , C03B23/023 , C03B23/02 , C03B33/10 , B23K103/16 , B23K103/00 , C03B33/023 , C03B33/04
CPC classification number: C03B33/091 , B23K26/0622 , B23K26/0624 , B23K26/0884 , B23K26/359 , B23K26/402 , B23K26/53 , B23K2103/172 , B23K2103/50 , B23K2103/54 , B65G2249/04 , C03B23/02 , C03B23/023 , C03B23/025 , C03B33/0222 , C03B33/023 , C03B33/033 , C03B33/04 , C03B33/082 , C03B33/102 , Y02P40/57 , Y10T428/15 , Y10T428/24777
Abstract: Methods are provided for laser processing arbitrary shapes of molded 3D thin transparent brittle parts from substrates with particular interest in substrates formed from strengthened or non-strengthened Corning Gorilla® glass (all codes). The developed laser methods can be tailored for manual separation of the parts from the panel or full laser separation by thermal stressing the desired profile. Methods can be used to form 3D surfaces with small radii of curvature. The method involves the utilization of an ultra-short pulse laser that may be optionally followed by a CO2 laser for fully automated separation.
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公开(公告)号：US09850160B2
公开(公告)日：2017-12-26
申请号：US14529520
申请日：2014-10-31
Applicant: Corning Incorporated
Inventor： Sasha Marjanovic , Albert Roth Nieber , Garrett Andrew Piech , Helmut Schillinger , Sergio Tsuda , Robert Stephen Wagner
CPC classification number: C03B33/0222 , B23K26/0622 , B23K26/40 , B23K26/53 , B23K26/57 , B23K2103/172 , B23K2103/50 , C03B17/064 , C03B25/087 , C03B29/10 , C03B33/0215 , C03B33/07 , C03B33/091 , Y02P40/57 , Y10T428/24777 , Y10T428/249921
Abstract: The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of >1 m/sec, to cut sharp radii outer corners (
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公开(公告)号：US20170197862A1
公开(公告)日：2017-07-13
申请号：US15472593
申请日：2017-03-29
Applicant: Corning Incorporated
Inventor： Dana Craig Bookbinder , Albert Roth Nieber , Stephan Lvovich Logunov , Pushkar Tandon , Sergio Tsuda
CPC classification number: C03B9/46 , B23K26/0624 , B23K26/0648 , B23K26/0652 , B23K26/0738 , B23K26/0838 , B23K26/103 , B23K26/38 , B23K26/382 , B23K26/402 , B23K2101/04 , B23K2103/50 , B23K2103/54 , C03B9/12 , C03B9/42 , C03B13/04 , C03B21/04 , C03B33/0222 , C03B33/04 , C03B33/082 , C03B33/091
Abstract: Methods of fabricating formed glass articles are described herein. In one embodiment, a method for fabricating a formed glass article may include forming a glass ribbon, forming a parson, and shaping the parson to form a glass article. The glass article may be attached to the glass ribbon at an attachment region defining an edge of the glass article. The process may also include contacting the attachment region with a focal line of a laser beam and separating the glass article from the glass ribbon at the attachment region. The attachment region may be perforated by the laser beam and the focal line may be substantially perpendicular to the plane of the glass ribbon.
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9.发明授权公开(公告)号：US09701564B2
公开(公告)日：2017-07-11
申请号：US14794378
申请日：2015-07-08
Applicant: Corning Incorporated
Inventor： Dana Craig Bookbinder , Lewis Kirk Klingensmith , Stephan Lvovich Logunov , Albert Roth Nieber , Helmut Schillinger , Pushkar Tandon , Sergio Tsuda
IPC: C03B33/06 , C03B17/04 , C03B33/09 , C03B33/10 , C03B33/02 , C03B9/12 , C03B33/095 , B23K103/00
CPC classification number: C03B33/06 , B23K2103/54 , C03B9/12 , C03B33/0222 , C03B33/095 , C03B33/0955
Abstract: Embodiments of the present method of laser cutting a laser wavelength transparent glass article comprises feeding at least one glass article to a pulsed laser assembly having at least one pulsed laser, wherein the pulsed laser defines a laser beam focal line with a length of 0.1-100 mm, the glass article being comprised of two end sections, and at least one lateral surface disposed lengthwise between the end sections. The method further comprises laser cutting at least one perforation line onto the lateral surface of the glass article while there is relative motion between the glass article and the pulsed laser and separating the glass article along the at least one perforation line to yield a laser cut glass article.
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公开(公告)号：US20160311717A1
公开(公告)日：2016-10-27
申请号：US15105741
申请日：2014-12-17
Applicant: CORNING INCORPORATED
Inventor： Albert Roth Nieber , Sergio Tsuda
IPC: C03B33/02 , C03B23/035 , B23K26/0622 , B23K26/359 , B23K26/386 , B23K26/402 , C03B23/023 , B23K26/00
CPC classification number: C03B33/0222 , B23K26/0622 , B23K26/359 , B23K26/382 , B23K26/386 , B23K26/389 , B23K26/402 , B23K26/55 , B23K26/57 , B23K2103/50 , B23K2103/54 , B23K2103/56 , C03B23/02 , C03B23/023 , C03B23/0252 , C03B23/0357 , Y02P40/57
Abstract: A method of making a glass article having non-flat portions, said method comprising the steps of (i) perforating a glass blank along a contour with a laser and forming multiple perforations in the glass blank; (ii) bending the glass bank along at least one area containing perforations, such that the glass is curved, forming a glass article having the non-flat portion.
Abstract translation: 一种制造具有非平坦部分的玻璃制品的方法，所述方法包括以下步骤：（i）用激光沿轮廓穿孔玻璃坯料，并在玻璃坯料中形成多个穿孔; （ii）沿着包含穿孔的至少一个区域弯曲玻璃组，使得玻璃弯曲，形成具有非平坦部分的玻璃制品。
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