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1.发明申请公开(公告)号：US20220319049A1
公开(公告)日：2022-10-06
申请号：US17710321
申请日：2022-03-31
申请人： CORNING INCORPORATED
摘要： Durable calibration standards are described herein for inspection systems for manufactured vials, such as glass pharmaceutical vials, and methods of using the same. A grayscale calibration standard is provided for calibration of camera settings of imaging components in an inspection system. The grayscale calibration standard comprises a vial having a laser etched gradient image on a portion of the vial. A region of interest (ROI) calibration standard is provided for calibration of spatial difference of imaging components and to align imaging components in an inspection system to capture desired regions of interest. The ROI calibration standard comprises a vial comprising laser etchings on one or more portions of the vial, wherein the laser etchings comprise laser markings formed in a geometric pattern. By providing laser-marked calibration standards, the calibration standards may be used in many different modes of metrology.
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公开(公告)号：US20200148577A1
公开(公告)日：2020-05-14
申请号：US16746096
申请日：2020-01-17
申请人： Corning Incorporated
IPC分类号： C03B33/023 , C03C23/00 , C03C15/00 , C03B33/02 , C03C21/00
摘要： A method of forming a glass article includes steps of: providing a glass substrate sheet, forming a first array of first damage regions, forming a second array of second damage regions which define a plurality of portions, wherein the second array of second damage regions define one or more interrupted zones. The interrupted zones may have a largest dimension of about 10 microns or greater. The method further includes steps of etching the glass substrate and singulating the plurality of portions from the glass substrate sheet.
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3.发明申请公开(公告)号：US20190389007A1
公开(公告)日：2019-12-26
申请号：US16430985
申请日：2019-06-04
申请人： CORNING INCORPORATED
IPC分类号： B23K26/364 , C03C23/00
摘要： A method for laser processing a substrate stack includes forming a defect in a transparent workpiece of the substrate stack having a black matrix layer. Forming the defect includes directing a portion of a pulsed laser beam into the transparent workpiece. The pulsed laser beam includes a wavelength λ, a spot size wo, and a Rayleigh range ZR that is greater than F D π w 0 , 2 λ , where FD is a dimensionless divergence factor comprising a value of 10 or greater. The pulsed laser beam directed into the transparent workpiece of the substrate stack forms a pulsed laser beam focal line disposed within the transparent workpiece, where a center of the pulsed laser beam focal line is offset from an edge of the black matrix layer by a distance that is about 20% or less of a total thickness of the substrate stack and generates an induced absorption within the transparent workpiece.
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公开(公告)号：US20190144325A1
公开(公告)日：2019-05-16
申请号：US16097999
申请日：2017-05-04
申请人： CORNING INCORPORATED
发明人： Bradley Frederick Bowden , Xiaoju Guo , Thomas Hackert , Garrett Andrew Piech , Kristopher Allen Wieland
摘要： A method for cutting, separating and removing interior contoured shapes in thin substrates, particularly glass substrates. The method involves the utilization of an ultra-short pulse laser to form defect lines in the substrate that may be followed by use of a second laser beam to promote isolation of the part defined by the interior contour.
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公开(公告)号：US10252931B2
公开(公告)日：2019-04-09
申请号：US14993236
申请日：2016-01-12
申请人： Corning Incorporated
发明人： Moussa N'Gom , Garrett Andrew Piech , James Joseph Watkins , Kristopher Allen Wieland , Chad Michael Wilcox
IPC分类号： B32B3/10 , C03B33/02 , B23K26/38 , B23K26/402 , B23K26/0622 , B23K26/359 , B23K26/53 , B23K103/00
摘要： Systems and methods for laser-cutting thermally tempered substrates are disclosed. In one embodiment, a method of separating a thermally tempered substrate includes directing a laser beam focal line such that at least a portion of the laser beam focal line is within a bulk of the thermally tempered substrate. The focused pulsed laser beam is pulsed to form a sequence of pulse bursts comprising one or more sub-pulses. The laser beam focal line produces a damage track within the bulk of the tempered substrate along the laser beam focal line. Relative motion is provided between the focused pulsed laser beam and the tempered substrate such that the pulsed laser beam forms a sequence of damage tracks within the tempered substrate. Individual damage tracks of the sequence of damage tracks are separated by a lateral spacing, and one or more microcracks connect adjacent damage tracks of the sequence of damage tracks.
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公开(公告)号：US11344973B2
公开(公告)日：2022-05-31
申请号：US16377947
申请日：2019-04-08
申请人： Corning Incorporated
IPC分类号： C03C23/00 , B23K26/382 , C03C15/00 , C04B41/00 , C04B41/53 , B23K26/00 , B23K26/16 , B23K26/53 , C04B41/45 , B23K103/16 , B23K101/42
摘要： Methods for forming holes in a substrate by reducing back reflections of a quasi-non-diffracting beam into the substrate are described herein. In some embodiments, a method of processing a substrate having a first surface and a second surface includes applying an exit material to the second surface of the substrate, wherein a difference between a refractive index of the exit material and a refractive index of the substrate is 0.4 or less, and focusing a pulsed laser beam into a quasi-non-diffracting beam directed into the substrate such that the quasi-non-diffracting beam enters the substrate through the first surface. The substrate is transparent to at least one wavelength of the pulsed laser beam. The quasi-non-diffracting beam generates an induced absorption within the substrate that produces a damage track within the substrate.
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公开(公告)号：US20180362387A1
公开(公告)日：2018-12-20
申请号：US16007015
申请日：2018-06-13
申请人： Corning Incorporated
IPC分类号： C03B33/023 , C03C23/00 , C03C15/00 , C03B33/02
摘要： A method of forming a glass article includes steps of: providing a glass substrate sheet, forming a first array of first damage regions, forming a second array of second damage regions which define a plurality of portions, wherein the second array of second damage regions define one or more interrupted zones. The interrupted zones may have a largest dimension of about 10 microns or greater. The method further includes steps of etching the glass substrate and singulating the plurality of portions from the glass substrate sheet.
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公开(公告)号：US20180105455A1
公开(公告)日：2018-04-19
申请号：US15783536
申请日：2017-10-13
申请人： Corning Incorporated
CPC分类号： C03C15/00 , B01L3/5027 , B01L2300/0887 , B01L2300/0896 , B23K26/0006 , B23K26/36 , B82Y20/00 , C03B33/0222 , G01R1/06711 , G01R1/06727 , G02B6/107
摘要： A device includes a sheet of high purity fused silica that has a thickness of less than 500 μm, where the sheet includes features in the sheet, wherein the features have a cross-sectional dimension of less than 50 μm and a depth of at least 100 nm, wherein the features are spaced apart from one another by a distance of less than 50 μm, and wherein the silica is free of indicia of grinding and polishing.
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9.发明申请公开(公告)号：US20170008122A1
公开(公告)日：2017-01-12
申请号：US15205284
申请日：2016-07-08
申请人： CORNING INCORPORATED
IPC分类号： B23K26/00 , B32B3/26 , B23K26/386 , B32B17/06
CPC分类号： B32B3/266 , B23K26/0604 , B23K26/53 , B23K2103/54 , B32B17/06 , B32B2307/412 , C03B33/0222 , C03C15/00 , C03C17/06 , H01L21/486 , H01L23/15 , H01L23/49827 , Y02P40/57
摘要： Systems and processes of cutting and drilling in a target substrate uses a laser (e.g., a pulsed laser) and an optical system to generate a line focus of the laser beam within the target substrate, such as a glass substrate sheet, are provided. The laser cutting and drilling system and process creates holes or defects that, in certain embodiments, extend the full depth of the glass sheet with each individual laser pulse, and allows the laser system to cut and separate the target substrate into any desired contour by creating a series of perforations that form a contour or desired part shape. Since a glass substrate sheet is brittle, cracking will then follow the perforated contour, allowing the glass substrate sheet to separate into any required shape defined by the perforations.
摘要翻译： 在靶基板中切割和钻孔的系统和工艺使用激光器（例如脉冲激光器）和光学系统来产生激光束在诸如玻璃基板之类的目标基板内的线焦点。 激光切割和钻孔系统和工艺产生孔或缺陷，在某些实施例中，使用每个单独的激光脉冲来延伸玻璃板的整个深度，并且允许激光系统通过产生目标基板来切割和分离任何期望的轮廓 形成轮廓或期望的部件形状的一系列穿孔。 由于玻璃基片是脆性的，因此随着穿孔轮廓的开裂，允许玻璃基片分离成由穿孔限定的任何所需形状。
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公开(公告)号：US20160200621A1
公开(公告)日：2016-07-14
申请号：US14993236
申请日：2016-01-12
申请人： Corning Incorporated
发明人： Moussa N'Gom , Garrett Andrew Piech , James Joseph Watkins , Kristopher Allen Wieland , Chad Michael Wilcox
IPC分类号： C03B33/02 , B23K26/402 , B23K26/38
CPC分类号： C03B33/0222 , B23K26/0622 , B23K26/359 , B23K26/53 , B23K2103/54 , Y02P40/57
摘要： Systems and methods for laser-cutting thermally tempered substrates are disclosed. In one embodiment, a method of separating a thermally tempered substrate includes directing a laser beam focal line such that at least a portion of the laser beam focal line is within a bulk of the thermally tempered substrate. The focused pulsed laser beam is pulsed to form a sequence of pulse bursts comprising one or more sub-pulses. The laser beam focal line produces a damage track within the bulk of the tempered substrate along the laser beam focal line. Relative motion is provided between the focused pulsed laser beam and the tempered substrate such that the pulsed laser beam forms a sequence of damage tracks within the tempered substrate. Individual damage tracks of the sequence of damage tracks are separated by a lateral spacing, and one or more microcracks connect adjacent damage tracks of the sequence of damage tracks.
摘要翻译： 公开了用于激光切割热回火衬底的系统和方法。 在一个实施例中，分离热回火衬底的方法包括引导激光束焦线，使得激光束焦线的至少一部分在热回火衬底的主体内。 聚焦的脉冲激光束被脉冲以形成包括一个或多个子脉冲的脉冲串序列。 激光束焦线沿着激光束焦线在回火基板的主体内产生损伤轨迹。 在聚焦的脉冲激光束和回火衬底之间提供相对运动，使得脉冲激光束在回火衬底内形成一系列损伤轨迹。 损伤轨迹序列的单个损伤轨迹由横向间隔分开，并且一个或多个微裂纹连接损坏轨迹序列的相邻损伤轨迹。
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