公开(公告)号：US20190321921A1

公开(公告)日：2019-10-24

申请号：US16377947

申请日：2019-04-08

Applicant: Corning Incorporated

Inventor： Bertrand Paris ,  Garrett Andrew Piech ,  Kristopher Allen Wieland

IPC: B23K26/382 ,  C03C15/00 ,  C03C23/00 ,  C04B41/00 ,  C04B41/53 ,  C04B41/45 ,  B23K26/00 ,  B23K26/16 ,  B23K26/53

Abstract: Methods for forming holes in a substrate by reducing back reflections of a quasi-non-diffracting beam into the substrate are described herein. In some embodiments, a method of processing a substrate having a first surface and a second surface includes applying an exit material to the second surface of the substrate, wherein a difference between a refractive index of the exit material and a refractive index of the substrate is 0.4 or less, and focusing a pulsed laser beam into a quasi-non-diffracting beam directed into the substrate such that the quasi-non-diffracting beam enters the substrate through the first surface. The substrate is transparent to at least one wavelength of the pulsed laser beam. The quasi-non-diffracting beam generates an induced absorption within the substrate that produces a damage track within the substrate.

公开(公告)号：US20240058895A1

公开(公告)日：2024-02-22

申请号：US18233438

申请日：2023-08-14

Applicant: CORNING INCORPORATED

Inventor： Bertrand Paris

IPC: B23K26/20 ,  B23K26/00 ,  B23K26/60

CPC classification number: B23K26/206 ,  B23K26/0006 ,  B23K26/60 ,  B23K2103/54

Abstract: A method of sealing a glass assembly includes contacting a first glass substrate with a first metal foil to create a first contact location; directing a laser beam on a second surface of the first metal foil opposite the first contact location to bond the first glass substrate to the first metal foil and form a first bond location; rotating the glass assembly 180 degrees about a longitudinal axis of the glass assembly; contacting a second glass substrate with a second metal foil to create a second contact location; and directing the laser beam on a second surface of the second metal foil opposite the second contact location to bond the second glass substrate to the second metal foil and form a second bond location.

公开(公告)号：US20230264294A1

公开(公告)日：2023-08-24

申请号：US18111754

申请日：2023-02-20

Applicant: CORNING INCORPORATED

Inventor： Sasha Marjanovic ,  Bertrand Paris ,  Kristopher Allen Wieland

IPC: B23K26/244 ,  B23K26/324 ,  B23K26/57 ,  B23K26/082

CPC classification number: B23K26/244 ,  B23K26/324 ,  B23K26/57 ,  B23K26/082 ,  B23K2103/54

Abstract: A method of preparing a workpiece for laser bonding includes positioning a first metal gasket on a fixture; positioning a first surface of a substrate on the first metal gasket, wherein the fixture, the first metal gasket and the first surface of the substrate define a first cavity; applying a vacuum to the first cavity, the vacuum pulling the substrate against the first metal gasket; and directing a laser at an interface of the first metal gasket and the first surface of the substrate, wherein the laser forms a bond between the first metal gasket and the first surface of the substrate.

公开(公告)号：US11344973B2

公开(公告)日：2022-05-31

申请号：US16377947

申请日：2019-04-08

Applicant: Corning Incorporated

Inventor： Bertrand Paris ,  Garrett Andrew Piech ,  Kristopher Allen Wieland

IPC: C03C23/00 ,  B23K26/382 ,  C03C15/00 ,  C04B41/00 ,  C04B41/53 ,  B23K26/00 ,  B23K26/16 ,  B23K26/53 ,  C04B41/45 ,  B23K103/16 ,  B23K101/42

Abstract: Methods for forming holes in a substrate by reducing back reflections of a quasi-non-diffracting beam into the substrate are described herein. In some embodiments, a method of processing a substrate having a first surface and a second surface includes applying an exit material to the second surface of the substrate, wherein a difference between a refractive index of the exit material and a refractive index of the substrate is 0.4 or less, and focusing a pulsed laser beam into a quasi-non-diffracting beam directed into the substrate such that the quasi-non-diffracting beam enters the substrate through the first surface. The substrate is transparent to at least one wavelength of the pulsed laser beam. The quasi-non-diffracting beam generates an induced absorption within the substrate that produces a damage track within the substrate.

公开(公告)号：US20250128986A1

公开(公告)日：2025-04-24

申请号：US18687025

申请日：2022-08-26

Applicant: CORNING INCORPORATED

Inventor： Jason Roy Grenier ,  Sasha Marjanovic ,  Bertrand Paris ,  Jonathan David Pesansky ,  Kristopher Allen Wieland ,  Ming Ying

IPC: C03C27/02 ,  B23K26/06 ,  B23K26/0622 ,  B23K26/324 ,  B23K26/57 ,  B23K103/00

Abstract: A method of laser bonding glass to metal foil includes contacting a first glass substrate with a first metal foil to create a first contact location; directing a laser beam on the first contact location to bond the first glass substrate to the first metal foil; contacting a second glass substrate with a second metal foil to create a second contact location; and directing the laser beam on the second contact location to bond the second glass substrate to the second metal foil, wherein the first metal foil and the second metal foil each have a thickness from 5 μm to 100 μm, and wherein the laser beam comprises a pulsed laser comprising: a pulse energy from 2.8 μJ to 1000 μJ; and a wavelength such that the first and second glass substrates are substantially transparent to the wavelength.