NON-ORTHOGONALITY ADJUSTMENT BASED ON A DUTY CYCLE

    公开(公告)号:US20220179013A1

    公开(公告)日:2022-06-09

    申请号:US17112107

    申请日:2020-12-04

    摘要: According to some embodiments, a method implemented in electronic circuitry includes: receiving a first signal having a sinusoidal waveform; receiving a second signal having a sinusoidal waveform; generating a composite signal responsive to the first and second signals; determining an orthogonality adjustment coefficient based on a duty cycle of the composite signal; and applying the orthogonality adjustment coefficient to generate an adjusted second signal that is substantially orthogonal to the first signal.

    Signal isolator having at least one isolation island

    公开(公告)号:US11342288B2

    公开(公告)日:2022-05-24

    申请号:US16430849

    申请日:2019-06-04

    摘要: Methods and apparatus for a signal isolator having reduced parasitics. An example embodiment, a signal isolator and include a first metal region electrically connected to a first die portion, a second die portion isolated from the first die portion, and a second metal region electrically connected to the second die portion. A third metal region can be electrically isolated from the first and second metal regions and a third die portion can be electrically isolated from the first, second and third metal regions. In embodiments, the first metal region, the second metal region, and the third metal region provide a first isolated signal path from the first die portion to the second die portion.

    Sensors having dynamic phase compensation

    公开(公告)号:US11333718B2

    公开(公告)日:2022-05-17

    申请号:US16849179

    申请日:2020-04-15

    IPC分类号: G01R33/00 G01R33/07

    摘要: Methods and apparatus for a magnetic field sensor having dynamic offset compensation that determines offset voltages for a number of phases each having a bias current across a magnetic field sensing element in a different direction. Pairs of the determined offset voltages for the phases are combined and one of the combined pairs of offset voltages is selected based on a criteria, such as lowest voltage level.

    Differential current sensor
    64.
    发明授权

    公开(公告)号:US11320466B1

    公开(公告)日:2022-05-03

    申请号:US17083487

    申请日:2020-10-29

    IPC分类号: G01R19/10 G01R19/15

    摘要: Methods and apparatus for measuring a current difference between at least two current traces in a circuit board. Each wire or trace generates a magnetic field which may then be measured by at least one magnetic field sensing element positioned on an integrated circuit, such as a current sensor integrated circuit or a differential magnetic field sensor integrated circuit. An output disconnect signal may be provided from the current sensor or differential magnetic field sensing integrated circuit to indicate that a current difference above a predetermined threshold exists in the two or more current traces.

    Photodetector with a buried layer
    65.
    发明授权

    公开(公告)号:US11296247B2

    公开(公告)日:2022-04-05

    申请号:US16272005

    申请日:2019-02-11

    摘要: An electronics module assembly for detecting photons is provided to include: a substrate layer; a buried layer deposited upon a first surface area of the substrate layer; an intrinsic layer deposited upon a first portion of a first surface area of the buried layer; a plug layer deposited upon a second portion of the first surface area of the buried layer; a p-plus layer deposited upon a first surface area of the intrinsic layer; an n-plus layer deposited upon a first surface area of the plug layer; a pre-metal dielectric (PMD) layer deposited upon the p-plus layer and n-plus layer; a first node coupled, through the PMD layer, to the p-plus layer; and a second node coupled, through the PMD layer, to the n-plus layer.

    SEMICONDUCTOR DEVICE
    66.
    发明申请

    公开(公告)号:US20220093727A1

    公开(公告)日:2022-03-24

    申请号:US17163626

    申请日:2021-02-01

    发明人: Taro KONDO

    摘要: A semiconductor device is disclosed including a sub-layer with first conductivity type, a drift layer with first conductivity type, a base region with second conductivity type positioned on the drift layer, a source region in contact with the base region, a source electrode, a plurality of trenches, at least one of the trenches in contact with the drift layer, the base region, and the source region, a plurality of insulating regions, at least one of the insulating regions positioned inside of each trench, a plurality of gate electrodes, at least one of the gate electrodes positioned inside of each trench; and a plurality of field plates, at least one of the field plates electrically connected to the source electrode and positioned in the insulating region in the trench. The field plate comprises high-resistance polysilicon.

    Constant power light emitting diode (LED) driver

    公开(公告)号:US11272591B1

    公开(公告)日:2022-03-08

    申请号:US17109215

    申请日:2020-12-02

    发明人: Nai-Chi Lee

    摘要: An LED driver includes a voltage detector and a controller. The voltage detector is configured to couple to an LED string comprising a plurality of series-coupled LEDs and to detect a voltage across the LED string to generate a feedback signal. The controller is configured to control an amount of current provided to the LED string in response to the feedback signal, with an amount of power provided to the LED string being substantially constant. The voltage detector can be coupled in parallel with the LED string, and may be a resistor divider. The controller is further configured to couple to a DC-DC converter comprising a switch controlled by the controller and configured to generate an output current and an output voltage coupled to the LED string to provide the amount of power to the LED string.

    FREQUENCY DETECTION ON SENSOR INTEGRATED CIRCUITS

    公开(公告)号:US20220034976A1

    公开(公告)日:2022-02-03

    申请号:US16944509

    申请日:2020-07-31

    发明人: Jan Palascak

    IPC分类号: G01R33/00

    摘要: According to an embodiment of the present disclosure, an integrated circuit includes: at least one sensing element configured to generate a sensed signal responsive to an electrical or magnetic phenomenon; an analog-to-digital converter configured to convert the sensed signal into a digital signal; and a digital processor configured to detect a target frequency of the electrical or magnetic phenomenon by iteratively applying a first real-valued coefficient to samples of the digital signal using real-valued arithmetic.

    Magnetic field sensor with fault reporting

    公开(公告)号:US11221203B1

    公开(公告)日:2022-01-11

    申请号:US17009072

    申请日:2020-09-01

    IPC分类号: G01B7/30 G01D5/14

    摘要: In one aspect, a magnetic field sensor includes a magnetic field sensing element configured to detect changes in a magnetic field caused by a target and an encoder configured to process signals originating from the magnetic field element. The encoder is configured to generate a first output signal and a second output signal. In a non-fault state, the first and second output signals are 90 electrical degrees out of phase from one another, and in a fault state, the first and second output signals are in phase with each other.

    CURRENT SENSOR INTEGRATED CIRCUITS
    70.
    发明申请

    公开(公告)号:US20210405092A1

    公开(公告)日:2021-12-30

    申请号:US17472769

    申请日:2021-09-13

    IPC分类号: G01R15/08 H01L43/04 H01L43/06

    摘要: A current sensor integrated circuit (IC) includes a unitary lead frame having at least one first lead having a terminal end, at least one second lead having a terminal end, and a paddle having a first surface and a second opposing surface. A semiconductor die is supported by the first surface of the paddle, wherein the at least one first lead is electrically coupled to the semiconductor die and the at least one second lead is electrically isolated from the semiconductor die. The current sensor IC further includes a first mold material configured to enclose the semiconductor die and the paddle and a second mold material configured to enclose at least a portion of the first mold material, wherein the terminal end of the at least one first lead and the terminal end of the at least one second lead are external to the second mold material.