公开(公告)号：US20160074988A1

公开(公告)日：2016-03-17

申请号：US14849500

申请日：2015-09-09

Applicant: EBARA CORPORATION

Inventor： Kuniaki YAMAGUCHI ,  Toshio MIZUNO ,  Itsuki KOBATA

IPC: B24B37/005 ,  B24B49/12 ,  H01L21/66 ,  H01L21/67 ,  H01L21/306 ,  B24B49/10 ,  B24B49/02

CPC classification number: B24B37/005 ,  B24B49/02 ,  B24B49/105 ,  B24B49/12 ,  H01L21/30625 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/67178 ,  H01L21/67219 ,  H01L22/26

Abstract: PROBLEMAn upper treatment module performs polishing treatment by, while bringing a pad smaller in diameter than a wafer into contact with the wafer, relatively moving the wafer and the pad.MEANS FOR SOLVINGThe upper treatment module includes a state detecting section configured to detect states of a polishing treatment surface of the wafer before the polishing treatment or during the polishing treatment and a control section configured to control conditions of the polishing treatment in a portion of the surface of the wafer according to the states of the polishing treatment surface detected by the state detecting section.

Abstract translation: 问题上处理模块通过在使晶片直径小于晶片的晶片与晶片接触的同时进行抛光处理，相对移动晶片和焊盘。 解决方案上述处理模块包括状态检测部，其被配置为检测在抛光处理之前或抛光处理期间的晶片的抛光处理表面的状态;以及控制部，其被配置为控制所述抛光处理的一部分中的抛光处理的条件 根据由状态检测部检测到的抛光处理面的状态，晶片的表面。

公开(公告)号：US09283651B2

公开(公告)日：2016-03-15

申请号：US14019903

申请日：2013-09-06

Applicant: Seagate Technology LLC

Inventor： Yongjun Zhao ,  David C. Seets ,  Mark Ostrowski

IPC: B24B37/10 ,  B24B49/10 ,  B24B37/013 ,  G11B5/31

CPC classification number: B24B49/10 ,  B24B37/013 ,  G11B5/3169 ,  G11B5/3173

Abstract: An electrical lapping guide has a body with a thickness along a wafer axis, the body comprising a layer of conductive material having a resistivity. The conductive material layer comprises a first contact region and a second contact region, the first and second contact regions configured to electrically connect the electrical lapping guide to electrical leads. A lapping edge comprises an air-bearing plane axis perpendicular to a lapping axis, and a back edge opposite the lapping edge, the back edge comprising a plurality of notches.

Abstract translation: 电研磨引导件具有沿着晶片轴线的厚度的主体，主体包括具有电阻率的导电材料层。 导电材料层包括第一接触区域和第二接触区域，第一和第二接触区域被配置为将电研磨引导件电连接到电引线。 研磨边缘包括垂直于研磨轴线的空气轴承平面轴线和与研磨边缘相对的后边缘，后边缘包括多个凹口。

公开(公告)号：US09275917B2

公开(公告)日：2016-03-01

申请号：US14066509

申请日：2013-10-29

Applicant: Applied Materials, Inc.

Inventor： Kun Xu ,  Shih-Haur Shen ,  Boguslaw A. Swedek ,  Ingemar Carlsson ,  Doyle E. Bennett ,  Wen-Chiang Tu ,  Hassan G. Iravani ,  Tzu-Yu Liu

IPC: H01L21/66 ,  H01L21/321 ,  B24B37/013 ,  B24B49/10

CPC classification number: H01L22/26 ,  B24B37/013 ,  B24B49/105 ,  H01L21/3212 ,  H01L22/14

Abstract: In one aspect, a method of controlling polishing includes receiving a measurement of an initial thickness of a conductive film on a first substrate prior to polishing the first substrate from an in-line or stand-alone monitoring system, polishing one or more substrates in a polishing system, the one or more substrates including the first substrate, during polishing of the one or more substrates, monitoring the one or more substrates with an eddy current monitoring system to generate a first signal, determining a starting value of the first signal for a start of polishing of the first substrate, determining a gain based on the starting value and the measurement of the initial thickness, for at least a portion of the first signal collected during polishing of at least one substrate of the one or more substrates, and calculating a second signal based on the first signal and the gain.

Abstract translation: 一方面，一种控制抛光的方法包括：在从第一基板或独立监视系统抛光第一基板之前，在第一基板上接收导电膜的初始厚度的测量，在一个或多个基板中抛光一个或多个基板 抛光系统，所述一个或多个衬底包括第一衬底，在一个或多个衬底的抛光期间，用涡流监视系统监测该一个或多个衬底以产生第一信号，确定第一信号的起始值 开始抛光第一衬底，对于在一个或多个衬底的至少一个衬底的抛光期间收集的第一信号的至少一部分，基于起始值和初始厚度的测量来确定增益，并且计算 基于第一信号和增益的第二信号。

公开(公告)号：US09254545B2

公开(公告)日：2016-02-09

申请号：US13634705

申请日：2011-03-09

Applicant: Jaehong Park

Inventor： Jaehong Park

IPC: B24B37/20 ,  B24B49/10 ,  B24B37/005 ,  B24B37/015

CPC classification number: B24B37/20 ,  B24B37/005 ,  B24B37/015 ,  B24B49/10

Abstract: A polishing pad has structural parts embedded therein; sensors, a memory for storing detected information obtained by the sensors, and a communication unit driven by a power supply unit to communicate with outside in a non-contact manner. The polishing pad and a communication unit configured to communicate with the communication unit of the polishing pad in a non-contact manner constitute a polishing information management system. The polishing pad and a communication unit configured to transmit and receive the information to and from the communication unit of the polishing pad in a non-contact manner constitute a polishing apparatus.

Abstract translation: 抛光垫具有嵌入其中的结构部件; 传感器，用于存储由传感器获得的检测信息的存储器，以及由电源单元驱动的通信单元，以非接触方式与外部通信。 抛光垫和配置为以非接触方式与抛光垫的通信单元通信的通信单元构成抛光信息管理系统。 抛光垫和配置成以非接触方式向抛光垫的通信单元发送信息和从抛光垫的通信单元接收信息的通信单元构成抛光装置。

公开(公告)号：US20150183080A1

公开(公告)日：2015-07-02

申请号：US14145192

申请日：2013-12-31

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： CHUNG-LIANG CHENG ,  YEN-YU CHEN ,  CHANG-SHENG LEE ,  WEI ZHANG

IPC: B24B37/013 ,  B24B37/20 ,  B24B49/10

CPC classification number: B24B37/013 ,  B24B37/205 ,  B24B49/10

Abstract: An apparatus for chemical mechanical polishing includes a wafer carrier, a first electrode, a rotatable pedestal, a second electrode, and an electric current detector. The first electrode is disposed at the wafer carrier. The rotatable pedestal is positioned opposite to the wafer carrier in order to perform a polishing operation with the wafer carrier accordingly. The second electrode is disposed at the rotatable pedestal and electrically coupled to the first electrode in order to form a circuit loop. The electric current detector is between the first electrode and the second electrode.

Abstract translation: 用于化学机械抛光的设备包括晶片载体，第一电极，可旋转底座，第二电极和电流检测器。 第一电极设置在晶片载体上。 可旋转基座与晶片载体相对定位，以便相应地与晶片载体进行抛光操作。 第二电极设置在可旋转的基座处并电耦合到第一电极以形成电路回路。 电流检测器位于第一电极和第二电极之间。

公开(公告)号：US09050708B2

公开(公告)日：2015-06-09

申请号：US13953318

申请日：2013-07-29

Applicant: Roland Schmitz

Inventor： Roland Schmitz

IPC: B24D13/02 ,  B24B49/08 ,  B24B49/10 ,  B24B5/42

CPC classification number: B24D13/02 ,  B24B5/42 ,  B24B49/08 ,  B24B49/10

Abstract: A grinding wheel assembly has a support disk centered on an axis and having an outer edge and a pair of axially opposite faces. An annular abrasive ring is juxtaposed with the outer edge, and a flexible hinge formation joins the ring to the outer edge of the disk at one of the faces. An actuator body of controlledly radially variable dimension joins the ring to outer edge of the disk at the other of the faces for deforming the ring and flexing the hinge formation so as to vary a shape of an outer face of the ring radially of the axis. Thus with this system the exact shape of the outer face of the abrasive ring can be controlled remotely. The control can be very accurate, and can be monitored by sensors in a feedback system to ensure exact position of the outer ring surface.

Abstract translation: 砂轮组件具有以轴为中心并具有外边缘和一对轴向相对面的支撑盘。 环形研磨环与外边缘并置，并且柔性铰链形式将环连接到盘的一个面上的外边缘。 可控地径向可变尺寸的致动器主体在另一个面处将环连接到盘的外边缘，用于使环变形并使铰链结构弯曲，以便改变环的径向外侧面的形状。 因此，利用该系统，可以远程控制研磨环的外表面的确切形状。 控制可以非常准确，并且可以通过反馈系统中的传感器进行监控，以确保外圈表面的精确位置。

公开(公告)号：US09050702B2

公开(公告)日：2015-06-09

申请号：US13737520

申请日：2013-01-09

Applicant: Supfina Grieshaber GmbH & Co. KG

Inventor： Oliver Hildebrandt

IPC: B24B49/16 ,  B24B5/42 ,  B24B21/02 ,  B24B35/00 ,  B24B49/10 ,  G01B7/16 ,  B23Q17/09

CPC classification number: B24B49/16 ,  B23Q17/0966 ,  B24B5/42 ,  B24B21/02 ,  B24B35/00 ,  B24B49/10 ,  G01B7/16

Abstract: A finishing device for finish-machining of a workpiece includes a force-generating device for generating a driving force, a force-transmitting arm and a pressing device for applying a working force to a finishing tool, and further a measuring device for measuring a deformation of a segment of the force-transmitting arm arranged in the force flux between the driving force and working force and/or for measuring a deformation force applied in the segment.

Abstract translation: 用于工件精加工的精加工装置包括用于产生驱动力的力产生装置，传力臂和用于对精加工工具施加作用力的加压装置，还有用于测量变形的测量装置 设置在驱动力和作用力之间的力通量中的力传递臂的一部分和/或用于测量施加在该段中的变形力。

公开(公告)号：US09012246B2

公开(公告)日：2015-04-21

申请号：US13779093

申请日：2013-02-27

Applicant: Kabushiki Kaisha Toshiba

Inventor： Hajime Eda ,  Gaku Minamihaba ,  Yukiteru Matsui ,  Akifumi Gawase

IPC: H01L21/66 ,  B24B49/02 ,  B24B37/013 ,  B24B49/10 ,  H01L21/768 ,  H01L21/321

CPC classification number: H01L22/14 ,  B24B37/013 ,  B24B49/02 ,  B24B49/105 ,  H01L21/3212 ,  H01L21/7684 ,  H01L22/26

Abstract: According to an embodiment, a method of manufacturing a semiconductor device includes forming a wiring groove on an insulating film; forming a barrier metal layer and a metal layer; polishing the metal layer by applying a first load on the metal layer; and subsequently polishing the metal layer while applying a second load larger than the first load on the metal layer and spraying a gas onto a polishing pad. The polishing pad is in contact with the metal layer. The barrier metal layer covers an upper surface of the insulating film and an inner surface of the wiring groove, and the metal layer fills an inside of the wiring groove and covers the barrier metal layer.

Abstract translation: 根据实施例，制造半导体器件的方法包括在绝缘膜上形成布线槽; 形成阻挡金属层和金属层; 通过在金属层上施加第一负载来抛光金属层; 并且随后在金属层上施加大于第一负载的第二负载并将气体喷射到抛光垫上的同时抛光金属层。 抛光垫与金属层接触。 阻挡金属层覆盖绝缘膜的上表面和布线槽的内表面，金属层填充布线槽的内部并覆盖阻挡金属层。

公开(公告)号：US20150099427A1

公开(公告)日：2015-04-09

申请号：US14045494

申请日：2013-10-03

Applicant: Seagate Technology LLC

Inventor： Mark Allen Herendeen

IPC: B24B37/013 ,  B24B49/10 ,  B24B37/30

CPC classification number: B24B37/013 ,  B24B37/048 ,  B24B37/30 ,  B24B49/10

Abstract: A carrier may be configured and operated to engage a lapping plate with a plurality of physically separated sliders attached to a common adhesive of the carrier. The carrier can be constructed to have at least one finger adjacent to and capable of translating a single slider of the plurality of physically separated sliders.

Abstract translation: 载体可以被构造和操作以使研磨板与附接到载体的共同粘合剂的多个物理分离的滑块接合。 载体可以构造成具有与多个物理上分离的滑块的单个滑块相邻并且能​​够平移的至少一个手指。

公开(公告)号：US20150072593A1

公开(公告)日：2015-03-12

申请号：US14019903

申请日：2013-09-06

Applicant: Seagate Technology LLC

Inventor： Yongjun Zhao ,  David C. Seets ,  Mark Ostrowski

IPC: B24B49/10 ,  G11B5/31 ,  B24B37/013

CPC classification number: B24B49/10 ,  B24B37/013 ,  G11B5/3169 ,  G11B5/3173

Abstract: An electrical lapping guide has a body with a thickness along a wafer axis, the body comprising a layer of conductive material having a resistivity. The conductive material layer comprises a first contact region and a second contact region, the first and second contact regions configured to electrically connect the electrical lapping guide to electrical leads. A lapping edge comprises an air-bearing plane axis perpendicular to a lapping axis, and a back edge opposite the lapping edge, the back edge comprising a plurality of notches.

Abstract translation: 电研磨引导件具有沿着晶片轴线的厚度的主体，主体包括具有电阻率的导电材料层。 导电材料层包括第一接触区域和第二接触区域，第一和第二接触区域被配置为将电研磨引导件电连接到电引线。 研磨边缘包括垂直于研磨轴线的空气轴承平面轴线和与研磨边缘相对的后边缘，后边缘包括多个凹口。