公开(公告)号：US09706694B2

公开(公告)日：2017-07-11

申请号：US13870108

申请日：2013-04-25

Applicant: Valeo Systemes de Controle Moteur

Inventor： Bruno Lefevre ,  Christian Schwartz ,  Jean-Yves Moreno

IPC: B23P19/00 ,  H05K13/00 ,  H05K3/34 ,  H05K13/04 ,  H05K1/18 ,  B23K3/047

CPC classification number: H05K13/00 ,  B23K3/047 ,  H05K1/181 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/3494 ,  H05K13/0465 ,  H05K2201/10515 ,  H05K2201/10848 ,  H05K2203/1115 ,  H05K2203/1476 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/53174

Abstract: A production line for producing electronic modules including a printed-circuit board, at least one first-type component, and at least one second-type component, wherein the production line includes a unit for putting the first-type component in place, a general heating unit for melting a solder placed between the at least one first-type component and the circuit, a unit for putting the second-type component in place, and a local heating unit for melting a solder placed between the at least one second-type component and the circuit.

公开(公告)号：US09629245B2

公开(公告)日：2017-04-18

申请号：US14405094

申请日：2013-05-23

Applicant: SAGEMCOM BROADBAND SAS

Inventor： Stephane Kohn

IPC: F16B37/06 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H05K1/11

CPC classification number: H05K1/14 ,  H05K1/11 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/10242 ,  H05K2201/10409 ,  H05K2201/10803 ,  H05K2201/1081 ,  H05K2201/10818 ,  H05K2201/10848 ,  H05K2201/10871 ,  H05K2201/2036

Abstract: The invention provides a spacer for soldering comprising an elongate body having one end provided with a tapped hole and an opposite end provided with a transverse bearing surface having a smooth centering peg projecting therefrom, the peg has a longitudinal outer passage extending over at least a fraction of its length as far as the transverse bearing surface to enable molten solder to penetrate by capillarity as far as the transverse bearing surface. The invention also provides a module including such a spacer.

公开(公告)号：US07911062B2

公开(公告)日：2011-03-22

申请号：US11670499

申请日：2007-02-02

Applicant: Tetsuya Nakatsuka ,  Koji Serizawa

Inventor： Tetsuya Nakatsuka ,  Koji Serizawa

IPC: H01L29/40 ,  H01L21/60 ,  H01L23/49

CPC classification number: H01L23/49537 ,  H01L23/3107 ,  H01L23/49579 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/19041 ,  H05K3/3426 ,  H05K2201/10689 ,  H05K2201/10848 ,  H05K2201/10909 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention proposes a semiconductor device including a semiconductor chip having a plurality of electrodes, a plurality of leads electrically connected to the plurality of electrodes of the semiconductor chip by bonding wires, and a resin for implementing the semiconductor chip, wherein the plurality of leads are comprised of two or more kinds of leads having different rigidities.

Abstract translation: 本发明提出了一种半导体器件，包括具有多个电极的半导体芯片，通过接合线电连接到半导体芯片的多个电极的多个引线以及用于实现半导体芯片的树脂，其中多个引线 由具有不同刚性的两种或更多种引线构成。

公开(公告)号：US07737546B2

公开(公告)日：2010-06-15

申请号：US11850526

申请日：2007-09-05

Applicant: Wai Hoong Moy ,  Chu Kun Tan ,  Keh Chin Seah ,  Paul Beng Hui Oh

Inventor： Wai Hoong Moy ,  Chu Kun Tan ,  Keh Chin Seah ,  Paul Beng Hui Oh

IPC: H01L23/48 ,  H01L21/50

CPC classification number: H05K3/3426 ,  H01L23/49861 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00013 ,  H01L2924/15747 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10848 ,  H05K2201/2081 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2924/00

Abstract: A packaged circuit element such as an LED and a method for making the same are disclosed. The packaged circuit element includes a lead frame, a molded body, and a die containing the circuit element. The lead frame has first and second leads, each lead having first and second portions. The molded body surrounds the first portion of each lead, and the die is connected electrically to the first and second leads on the first portions of the first and second leads. The second portion of each of the first and second leads is substantially parallel to opposing side surfaces of the body and include a feature that inhibits molten solder from wetting a portion of the second section of each lead between the feature and the first portion of that lead while allowing the molten solder to wet the remaining surfaces of the second portions.

Abstract translation: 公开了诸如LED的封装电路元件及其制造方法。 封装电路元件包括引线框架，成型体和容纳电路元件的管芯。 引线框架具有第一和第二引线，每个引线具有第一和第二部分。 成形体围绕每个引线的第一部分，并且该裸片与第一和第二引线的第一部分上的第一引线和第二引线电连接。 第一和第二引线中的每一个的第二部分基本上平行于主体的相对的侧表面，并且包括阻止熔融焊料润湿部件与该引线的第一部分之间的每个引线的第二部分的一部分的特征 同时允许熔融焊料润湿第二部分的剩余表面。

公开(公告)号：US07578681B2

公开(公告)日：2009-08-25

申请号：US12222321

申请日：2008-08-07

Applicant: Takayoshi Honda ,  Minoru Hozuka

Inventor： Takayoshi Honda ,  Minoru Hozuka

IPC: H01R12/00 ,  H05K1/00

CPC classification number: H05K3/3447 ,  H01R12/57 ,  H01R12/58 ,  H01R12/724 ,  H01R43/0256 ,  H05K1/116 ,  H05K2201/09381 ,  H05K2201/10189 ,  H05K2201/10787 ,  H05K2201/1084 ,  H05K2201/10848 ,  H05K2201/10856 ,  H05K2201/10871 ,  H05K2203/1178

Abstract: An electronic device includes a printed circuit board and an electronic element having a terminal. The terminal has a surface section and an insertion section. The printed circuit board includes a through hole extending from a first surface to a second surface of the printed circuit board, a surface land disposed on the first surface, and an insertion land integrally disposed on a sidewall of the through hole and on a periphery around the through hole. The surface section is coupled with the surface land through a solder. The insertion section is disposed in the through hole and is coupled with the insertion land through the solder. The surface section has a recess part and a portion of recess part is disposed so as to be axially aligned with a portion of the through hole.

公开(公告)号：US20090057850A1

公开(公告)日：2009-03-05

申请号：US11850526

申请日：2007-09-05

Applicant: Wai Hoong Moy ,  Chu Kun Tan ,  Keh Chin Seah ,  Paul Beng Hui Oh

Inventor： Wai Hoong Moy ,  Chu Kun Tan ,  Keh Chin Seah ,  Paul Beng Hui Oh

IPC: H01L33/00 ,  H01L21/768 ,  H01L23/495

CPC classification number: H05K3/3426 ,  H01L23/49861 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00013 ,  H01L2924/15747 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10848 ,  H05K2201/2081 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2924/00

Abstract: A packaged circuit element such as an LED and a method for making the same are disclosed. The packaged circuit element includes a lead frame, a molded body, and a die containing the circuit element. The lead frame has first and second leads, each lead having first and second portions. The molded body surrounds the first portion of each lead, and the die is connected electrically to the first and second leads on the first portions of the first and second leads. The second portion of each of the first and second leads is substantially parallel to opposing side surfaces of the body and include a feature that inhibits molten solder from wetting a portion of the second section of each lead between the feature and the first portion of that lead while allowing the molten solder to wet the remaining surfaces of the second portions.

Abstract translation: 公开了诸如LED的封装电路元件及其制造方法。 封装电路元件包括引线框架，成型体和容纳电路元件的管芯。 引线框架具有第一和第二引线，每个引线具有第一和第二部分。 成形体围绕每个引线的第一部分，并且该裸片与第一和第二引线的第一部分上的第一引线和第二引线电连接。 第一和第二引线中的每一个的第二部分基本上平行于主体的相对的侧表面，并且包括阻止熔融焊料润湿部件与该引线的第一部分之间的每个引线的第二部分的一部分的特征 同时允许熔融焊料润湿第二部分的剩余表面。

公开(公告)号：US20090047805A1

公开(公告)日：2009-02-19

申请号：US12229012

申请日：2008-08-18

Applicant: Fang-Chu Liao ,  Chun-Yi Chang

Inventor： Fang-Chu Liao ,  Chun-Yi Chang

IPC: H01R12/00

CPC classification number: H01R12/707 ,  H01R12/716 ,  H05K3/3426 ,  H05K2201/10325 ,  H05K2201/10818 ,  H05K2201/10848 ,  Y02P70/613

Abstract: A socket, for electrically connecting an IC package and a printed circuit board, comprises an insulative housing and a plurality of contacts received in the insulative housing. The insulative housing has an opening in a center thereof, a solder pad is received in the opening and has a soldering board which is soldered to the printed circuit board to enhance a mechanical connection between the socket and the printed circuit board.

Abstract translation: 用于电连接IC封装和印刷电路板的插座包括绝缘壳体和容纳在绝缘壳体中的多个触点。 绝缘壳体在其中心具有开口，焊盘被容纳在开口中，并且具有焊接到印刷电路板的焊接板，以增强插座和印刷电路板之间的机械连接。

公开(公告)号：US20070210139A1

公开(公告)日：2007-09-13

申请号：US11670499

申请日：2007-02-02

Applicant: Tetsuya NAKATSUKA ,  Koji Serizawa

Inventor： Tetsuya NAKATSUKA ,  Koji Serizawa

IPC: A47J36/02

CPC classification number: H01L23/49537 ,  H01L23/3107 ,  H01L23/49579 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/19041 ,  H05K3/3426 ,  H05K2201/10689 ,  H05K2201/10848 ,  H05K2201/10909 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention proposes a semiconductor device including a semiconductor chip having a plurality of electrodes, a plurality of leads electrically connected to the plurality of electrodes of the semiconductor chip by bonding wires, and a resin for implementing the semiconductor chip, wherein the plurality of leads are comprised of two or more kinds of leads having different rigidities.

Abstract translation: 本发明提出了一种半导体器件，包括具有多个电极的半导体芯片，通过接合线电连接到半导体芯片的多个电极的多个引线以及用于实现半导体芯片的树脂，其中多个引线 由具有不同刚性的两种或更多种引线构成。

公开(公告)号：US07234352B2

公开(公告)日：2007-06-26

申请号：US11244163

申请日：2005-10-06

Applicant: Tomohiro Mitani

Inventor： Tomohiro Mitani

IPC: G01C19/00

CPC classification number: G01C19/5628 ,  H05K3/308 ,  H05K2201/10151 ,  H05K2201/10757 ,  H05K2201/10848

Abstract: An angular velocity sensor includes a tuning fork unit; a base block provided with a terminal for outputting an output signal from the tuning fork unit to the exterior; a cover for housing the tuning fork unit in a space defined by combination with the base block; a circuit board for fixing the terminal on the base block, the circuit board being provided with a processing circuit for processing the output signal from the tuning fork unit; and a casing for housing the base block, the cover, and the circuit board. The terminal on the base block is fixed to the circuit board, with a clearance being defined by the base block and the circuit board. The terminal on the base block in the clearance has a flexure portion, and the flexure portion absorbs a vibration of a high frequency applied from the exterior.

Abstract translation: 角速度传感器包括音叉单元; 基部块，设置有用于将来自音叉单元的输出信号输出到外部的端子; 用于将音叉单元容纳在与基座组合定义的空间中的盖子; 用于将所述端子固定在所述基座上的电路板，所述电路板设置有用于处理来自音叉单元的输出信号的处理电路; 以及用于容纳基座，盖和电路板的壳体。 基座上的端子固定在电路板上，间隙由基座和电路板限定。 间隙中的基座上的端子具有挠曲部分，并且挠曲部分吸收从外部施加的高频振动。

公开(公告)号：US20050057865A1

公开(公告)日：2005-03-17

申请号：US10897801

申请日：2004-07-23

Applicant: Balaguru Veloo ,  Kevin Bertness

Inventor： Balaguru Veloo ,  Kevin Bertness

IPC: B60R16/02 ,  B60R16/023 ,  G01R1/20 ,  G01R31/00 ,  H02J7/14 ,  H05K1/02 ,  H05K3/22 ,  H05K3/30 ,  H05K3/34 ,  H02H9/00

CPC classification number: H05K1/0263 ,  B60R16/023 ,  G01R1/203 ,  G01R31/006 ,  G01R31/3696 ,  H02J7/14 ,  H02M2001/0009 ,  H05K3/222 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/10022 ,  H05K2201/10272 ,  H05K2201/10848 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/53135

Abstract: A method of coupling a shunt to a printed circuit board (PCB) of an energy management system is provided. The method includes coupling flexible electrical connectors to the shunt and soldering the flexible electrical connectors to connection points on the PCB of the energy management system. An energy management system that includes a shunt coupled to a printed circuit board using the above method is also provided.

Abstract translation: 提供了一种将分流器耦合到能量管理系统的印刷电路板（PCB）的方法。 该方法包括将柔性电连接器耦合到分流器并将柔性电连接器焊接到能量管理系统的PCB上的连接点。 还提供了一种包括使用上述方法耦合到印刷电路板的分流器的能量管理系统。