摘要:
The present invention provides a photo-mask for manufacturing structures on a semiconductor substrate, which comprises a photo-mask substrate, a first pattern, a second pattern and a forbidden pattern. A first active region, a second active region are defined on the photo-mask substrate, and a region other than the first active region and the second active region are defined as a forbidden region. The first pattern is disposed in the first active region and corresponds to a first structure on the semiconductor substrate. The second pattern is disposed in the second active region and corresponds to a second structure on the semiconductor substrate. The forbidden pattern is disposed in the forbidden region, wherein the forbidden pattern has a dimension beyond resolution capability of photolithography and is not used to form any corresponding structure on the semiconductor substrate. The present invention further provides a method of manufacturing semiconductor structures.
摘要:
A reflective mask blank, a reflective mask, and methods for manufacturing those, which suppress reflectance at a light-shielding frame. The reflective mask includes a substrate, a multilayered reflective layer formed on the substrate, an absorption layer formed on the multilayered reflective layer, and a frame-shaped light-shielding frame area at which the absorption layer has a film thickness larger than a film thickness at other areas. The multilayered reflective layer is diffused and mixed at the light-shielding frame area through melting.
摘要:
A layout pattern and a photomask including the layout pattern are provided. The layout pattern includes a plurality of main patterns and at least one auxiliary pattern. The main patterns are arranged in parallel to one another and extend in a first direction. The at least one auxiliary pattern is located between two outermost main patterns and connects the two outermost main patterns. The at least one auxiliary pattern is arranged in a second direction. The second direction is different from the first direction.
摘要:
A mask and method of fabricating same are disclosed. In an example, a mask includes a substrate, a reflective multilayer coating disposed over the substrate and a patterned absorption layer disposed over the reflective multilayer. The patterned absorption layer has a mask image region and a mask border region. The exemplary mask also includes a mask border frame disposed over the mask border region. The mask border frame has a top surface and a bottom surface. The top surface is not parallel to the bottom surface.
摘要:
The present invention discloses an exposure mask, an exposure apparatus, and a method for manufacturing a display substrate, which are used for forming a pattern with a smaller aperture, a narrower slit, or a line of smaller width on a photoresist layer. The exposure mask includes a mask body and an anti-diffraction film layer located at a light emergent side of the mask body. Wherein the mask body includes a light transmissive region and a light non-transmissive region; a region of the anti-diffraction film layer which corresponds to at least the light transmissive region of the mask body is a light transmissive region; and the anti-diffraction film layer is a film layer whose refractive index n satisfies n>1.
摘要:
A photomask includes a light transmission substrate having a transfer region and a frame region, a light-transmitting region exposing a portion of the light transmission substrate in the transfer region corresponding to a transfer pattern, and a light-blocking region disposed in the transfer region and surrounding the light-transmitting region, wherein the light-blocking region includes a first light-blocking region surrounding the light-transmitting region, and a second light-blocking region that surrounds the first light-blocking region, and wherein a first light-blocking pattern is disposed on the light transmission substrate in the first light-blocking region, and a plurality of second light-blocking patterns are disposed on the light transmission substrate in the second light-blocking region.
摘要:
A lithography process in a lithography system includes loading a mask that includes two mask states defining an integrated circuit (IC) pattern. The IC pattern includes a plurality of main polygons, wherein adjacent main polygons are assigned to different mask states; and a background includes a field in one of the mask states and a plurality of sub-resolution polygons in another of the two mask states. The lithography process further includes configuring an illuminator to generate an illuminating pattern on an illumination pupil plane of the lithography system; configuring a pupil filter on a projection pupil plane of the lithography system with a filtering pattern determined according to the illumination pattern; and performing an exposure process to a target with the illuminator, the mask, and the pupil filter. The exposure process produces diffracted light and non-diffracted light behind the mask and the pupil filter removes most of the non-diffracted light.
摘要:
A layout pattern and a photomask including the layout pattern are provided. The layout pattern includes a plurality of main patterns and at least one auxiliary pattern. The main patterns are arranged in parallel to one another and extend in a first direction. The at least one auxiliary pattern is located between two outermost main patterns and connects the two outermost main patterns. The at least one auxiliary pattern is arranged in a second direction. The second direction is different from the first direction.
摘要:
Position and curvature information of a patterning device may be determined directly from the patterning device and controlled based on the determined information. In an embodiment, a lithographic apparatus includes a position determining system operative to determine a relative position of the patterning device. The patterning device may be configured to create a patterned radiation beam from a radiation beam incident on a major surface of the patterning device. The patterning device may have a side surface having an edge in common with the major surface. The position determining system may include an interferometer operative to transmit light to the side surface and to receive the transmitted light after the transmitted light has been reflected at the side surface. The position determining system is operative to determine a quantity representative of the relative position of the patterning device from the received reflected transmitted light.
摘要:
A method for reducing pattern density effects in semiconductor fabrication includes forming a first mask that includes one or more arrays of uniformly distributed pattern. Each array of the uniformly distributed pattern includes similar pattern elements having similar dimensions, orientations, and distances. Using the first mask allows forming a layer of semiconductor devices based on the first mask with reduced pattern density effects. A second mask is formed for the layer based on the first mask. The second mask includes undesired portions, for which the pattern is not uniform. Using the second mask allows removing the undesired portions of the formed layer of the semiconductor devices to create desired structures on the formed layer without a need for using optical proximity correction (OPC).