Electro-optical infrared window for hypersonic applications

    公开(公告)号:US11808623B2

    公开(公告)日:2023-11-07

    申请号:US17466693

    申请日:2021-09-03

    CPC classification number: G01J1/0252 F41G7/2253

    Abstract: A guidance system for a missile performs a method for guiding the missile. The guidance system includes a target detector and a window between a target and the target detector. The window including a first pane, a second pane and a channel between the first pane from the second pane. Radiation from the target passes through the window including the first pane, the second pane and the channel to be detected at the target detector. A gas is transported through the channel between the first pane and the second pane to control a temperature of the window.

    METHOD FOR MEASURING LIGHT INTENSITY DISTRIBUTION

    公开(公告)号:US20180306643A1

    公开(公告)日:2018-10-25

    申请号:US15853857

    申请日:2017-12-25

    Abstract: A system for measuring light intensity distribution is provided and set in a vacuum environment. The system for measuring light intensity distribution comprises a carbon nanotube array located on a surface of a substrate, a reflector, an imaging element and a cooling device. The substrate is cooled by the cooling device to make a contacting surface between the substrate and the carbon nanotube array maintain a constant temperature. The carbon nanotube array is irradiated by a light source to make the carbon nanotube array radiate a visible light, and the substrate is continuously cooled to make the contact surface between the substrate and the carbon nanotube array maintain the constant temperature. The visible light is reflected with the reflector. The visible light reflected by the reflector is imaged with the imaging element to obtain the light intensity distribution of the light source.

    3D IMAGING OPTOELECTRONIC MODULE
    57.
    发明申请

    公开(公告)号:US20180172504A1

    公开(公告)日:2018-06-21

    申请号:US15843883

    申请日:2017-12-15

    Applicant: 3D PLUS

    Inventor: Didier GAMBART

    Abstract: A 3D imaging optoelectronic module intended to be fixed to an image-forming device comprises: an optoelectronic sensor comprising a package with a chip electrically connected to a stack of at least one printed circuit board, the sensor and stack assembly moulded in a resin and having faces according to Z with electrical interconnection tracks of the printed circuit boards. It comprises a thermally conductive rigid cradle in the form of a frame having a reference surface according to X, Y and: on a top surface: reference points intended to centre and align the image-forming device in relation to the reference surface, fixing points to allow the fixing of the image-forming device, and an inner bearing surface having bearing points of the sensor adjusted to centre and align the chip in relation to the reference surface.

    Infrared sensing devices and methods

    公开(公告)号:US09989405B2

    公开(公告)日:2018-06-05

    申请号:US15211123

    申请日:2016-07-15

    Abstract: An infrared sensor assembly for sensing infrared radiation from an object is disclosed. The infrared sensor assembly comprises a sensor array comprising a plurality of sensing elements, provided on or embedded in a substrate extending in a substrate plane. The sensor array comprises at least two infrared sensing elements, each infrared sensing element having a radiation responsive element providing a proportionate electrical signal in response to infrared radiation incident thereto and at least two blind sensing elements, at least one blind sensing element being interspersed among the at least two sensing elements, each blind sensing element being shielded from incident infrared radiation from the object and providing a proportionate electrical signal in response to parasitic thermal fluxes. The output of the sensor array is a function of the infrared sensing elements and of the blind sensing elements such that parasitic thermal fluxes are at least partly compensated for.

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