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    ELECTRONIC COOLING SYSTEMS
    1.
    发明申请
    ELECTRONIC COOLING SYSTEMS 有权

    公开(公告)号：US20210360830A1

    公开(公告)日：2021-11-18

    申请号：US15930611

    申请日：2020-05-13

    Applicant: RAYTHEON COMPANY

    Inventor： Delmar L. Barker ,  Paul M. Lyons

    IPC: H05K7/20

    Abstract: Disclosed herein are cooling systems, methods of making cooling systems, and methods of cooling using cooling systems. A cooling system includes a compression container with a coolant that includes a fluid. A valve is arranged on the compression container through which the coolant is released from the compression container. The cooling system further includes a component positioned to receive droplets of the coolant. The component has a surface with a three-dimensional topography that includes a plurality of pillars and a plurality of trenches. The component is an electronic component or a photoelectronic component.

    Multifunctional aerodynamic, propulsion, and thermal control system
    2.
    发明授权
    Multifunctional aerodynamic, propulsion, and thermal control system 有权

    公开(公告)号：US10018456B2

    公开(公告)日：2018-07-10

    申请号：US14936760

    申请日：2015-11-10

    Applicant: Raytheon Company

    Inventor： Paul M. Lyons ,  Jeremy C. Danforth ,  Jeff L. Vollin ,  Matt H. Summers

    IPC: F25B19/00 ,  F42B15/34 ,  F25B9/02 ,  B64D27/00 ,  B64G1/40

    CPC classification number: F42B15/34 ,  B64D27/00 ,  B64G1/40 ,  F25B9/02 ,  F25B19/005

    Abstract: An open-loop thermal control system and method for components that generate heat includes a reservoir for containing a pressurized working fluid, a first heat exchanger in thermal communication with the working fluid, a Joule-Thomson expansion valve in fluid communication with the reservoir, and a second heat exchanger in fluid communication with the valve. The first heat exchanger is configured to transfer heat from the components to the fluid in the reservoir. The valve is configured to expand the working fluid into a two-phase fluid having a primary use of cooling. The second heat exchanger is configured to receive heat from the components and receive the two-phase fluid. The second heat exchanger provides a single-phase working fluid for at least one secondary use before the working fluid is expelled from the thermal control system.

    Electronic cooling systems
    3.
    发明授权
    Electronic cooling systems 有权

    公开(公告)号：US11533828B2

    公开(公告)日：2022-12-20

    申请号：US15930611

    申请日：2020-05-13

    Applicant: RAYTHEON COMPANY

    Inventor： Delmar L. Barker ,  Paul M. Lyons

    IPC: H05K7/20 ,  F25B9/02

    Abstract: Disclosed herein are cooling systems, methods of making cooling systems, and methods of cooling using cooling systems. A cooling system includes a compression container with a coolant that includes a fluid. A valve is arranged on the compression container through which the coolant is released from the compression container. The cooling system further includes a component positioned to receive droplets of the coolant. The component has a surface with a three-dimensional topography that includes a plurality of pillars and a plurality of trenches. The component is an electronic component or a photoelectronic component.

    MULTIFUNCTIONAL AERODYNAMIC, PROPULSION, AND THERMAL CONTROL SYSTEM
    5.
    发明申请
    MULTIFUNCTIONAL AERODYNAMIC, PROPULSION, AND THERMAL CONTROL SYSTEM 有权

    公开(公告)号：US20170131078A1

    公开(公告)日：2017-05-11

    申请号：US14936760

    申请日：2015-11-10

    Applicant: Raytheon Company

    Inventor： Paul M. Lyons ,  Jeremy C. Danforth ,  Jeff L. Vollin ,  Matt H. Summers

    IPC: F42B15/34 ,  F25B9/02

    CPC classification number: F42B15/34 ,  B64D27/00 ,  B64G1/40 ,  F25B9/02 ,  F25B19/005

    Abstract: An open-loop thermal control system and method for components that generate heat includes a reservoir for containing a pressurized working fluid, a first heat exchanger in thermal communication with the working fluid, a Joule-Thomson expansion valve in fluid communication with the reservoir, and a second heat exchanger in fluid communication with the valve. The first heat exchanger is configured to transfer heat from the components to the fluid in the reservoir. The valve is configured to expand the working fluid into a two-phase fluid having a primary use of cooling. The second heat exchanger is configured to receive heat from the components and receive the two-phase fluid. The second heat exchanger provides a single-phase working fluid for at least one secondary use before the working fluid is expelled from the thermal control system.

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