Curable composition, transparent heat-resistant material, and use thereof
    55.
    发明授权
    Curable composition, transparent heat-resistant material, and use thereof 有权
    可固化组合物,透明耐热材料及其用途

    公开(公告)号:US09441064B2

    公开(公告)日:2016-09-13

    申请号:US14771010

    申请日:2014-02-27

    申请人: SHOWA DENKO K.K.

    摘要: The present invention provides a curable composition, which contains a crosslinking aid (B) containing three or more allyl groups in the molecule in an amount of 1 to 50 parts by mass, polyfunctional (meth)acrylic compound (C) in an amount of 5 to 50 parts by mass, and photopolymerization initiator (D1) and/or thermal polymerization initiator (D2) in an amount of 0.1 to 10 parts by mass, respectively, as a polymerization initiator (D) to 100 parts by mass of allyl group-terminated allyl ester oligomer (A); wherein the crosslinking aid (B) containing allyl group is a compound containing three or more allyl groups in a molecule; wherein the content of impurities derived from the crosslinking aid (B) in the curable composition is less than 0.1 mass %; wherein the content of the (meth)acrylic compound containing a hydroxyl group in a molecule (C1) in the curable composition is 0.5 to 30 mass %.