公开(公告)号：US20110261019A1

公开(公告)日：2011-10-27

申请号：US13125865

申请日：2009-10-20

申请人： Naoki Makita ,  Hiroshi Nakatsuji

发明人： Naoki Makita ,  Hiroshi Nakatsuji

IPC分类号： H01L29/786 ,  G06F3/042 ,  G09G5/10 ,  H01L21/31 ,  H01L21/20

CPC分类号： H01L27/14665 ,  G06F3/042 ,  G09G5/10 ,  H01L27/12 ,  H01L27/1229 ,  H01L29/78633

摘要： A semiconductor device according to the present invention includes a thin-film transistor and a thin-film diode. The respective semiconductor layers and of the thin-film transistor and the thin-film diode are crystalline semiconductor layers that have been formed by crystallizing the same crystalline semiconductor film. Ridges have been formed on the surface of the semiconductor layer of the thin-film diode. And the semiconductor layer of the thin-film diode has a greater surface roughness than the semiconductor layer of the thin-film transistor.

摘要翻译： 根据本发明的半导体器件包括薄膜晶体管和薄膜二极管。 各半导体层以及薄膜晶体管和薄膜二极管是通过使相同的结晶半导体膜结晶而形成的结晶半导体层。 已经在薄膜二极管的半导体层的表面上形成了脊。 并且薄膜二极管的半导体层具有比薄膜晶体管的半导体层更大的表面粗糙度。

公开(公告)号：US07262469B2

公开(公告)日：2007-08-28

申请号：US10734312

申请日：2003-12-15

申请人： Naoki Makita

发明人： Naoki Makita

IPC分类号： H01L23/62

CPC分类号： H01L27/12 ,  H01L27/1285 ,  H01L29/06 ,  H01L29/42384

摘要： A semiconductor device includes a thin film transistor including a semiconductor layer that includes a channel region, a source region and a drain region, a gate insulating film provided on the semiconductor layer, and a gate electrode for controlling the conductivity of the channel region, wherein the surface of the semiconductor layer includes a minute protruding portion, and the side surface inclination angle of the gate electrode is larger than the inclination angle of the protruding portion of the semiconductor layer.

摘要翻译： 半导体器件包括薄膜晶体管，其包括包括沟道区，源极区和漏极区的半导体层，设置在半导体层上的栅极绝缘膜，以及用于控制沟道区的导电性的栅电极，其中 半导体层的表面包括微小突出部分，并且栅电极的侧表面倾斜角度大于半导体层的突出部分的倾斜角度。

公开(公告)号：US06927107B1

公开(公告)日：2005-08-09

申请号：US09667527

申请日：2000-09-22

申请人： Naoki Makita ,  Hiromi Sakamoto ,  Masao Moriguchi

发明人： Naoki Makita ,  Hiromi Sakamoto ,  Masao Moriguchi

IPC分类号： C30B29/06 ,  H01L21/00 ,  H01L21/20 ,  H01L21/268 ,  H01L21/322 ,  H01L21/336 ,  H01L21/77 ,  H01L21/84 ,  H01L27/12 ,  H01L29/786

CPC分类号： H01L21/02672 ,  H01L21/02422 ,  H01L21/02488 ,  H01L21/02532 ,  H01L21/02595 ,  H01L21/0262 ,  H01L21/02686 ,  H01L21/2022 ,  H01L21/2026 ,  H01L27/1277 ,  H01L29/66757

摘要： In a production method of a semiconductor device, a catalyst element, e.g. Ni, is added to an amorphous silicon film, formed on a substrate with an insulating surface, for promoting crystallization of the amorphous silicon film. Thereafter, the amorphous silicon film is subjected to heat treatment to cause crystal growth therein. Next, the crystal growth is stopped in a state where minute amorphous regions (uncrystallized regions) remain in the film. Next, the silicon film is irradiated with strong light (laser light) so as to be further crystallized. As a result, a crystalline silicon film that has high quality and is excellent in uniformity is obtained.

摘要翻译： 在半导体器件的制造方法中，催化剂元件例如 将Ni添加到形成在具有绝缘表面的基板上的非晶硅膜中，用于促进非晶硅膜的结晶。 然后，对非晶硅膜进行热处理，使晶体生长。 接下来，在薄膜中保留微小的非晶区域（未结晶区域）的状态下停止晶体生长。 接着，用强光（激光）照射硅膜，进一步结晶。 结果，得到质量好，均匀性优异的结晶硅膜。

公开(公告)号：US6162667A

公开(公告)日：2000-12-19

申请号：US408869

申请日：1995-03-23

申请人： Takashi Funai ,  Naoki Makita ,  Yoshitaka Yamamoto ,  Tadayoshi Miyamoto ,  Takamasa Kousai ,  Masashi Maekawa

发明人： Takashi Funai ,  Naoki Makita ,  Yoshitaka Yamamoto ,  Tadayoshi Miyamoto ,  Takamasa Kousai ,  Masashi Maekawa

IPC分类号： H01L21/336 ,  H01L21/77 ,  H01L21/84 ,  H01L27/12 ,  H01L21/00

CPC分类号： H01L27/12 ,  H01L27/1277 ,  H01L29/66757

摘要： In a fabrication of a semiconductor device, an amorphous semiconductor film is first formed on a substrate having an insulating surface. Then, a minute amount of catalyst elements for accelerating crystallization of the amorphous semiconductor film is supplied to at least a portion of a surface of the amorphous semiconductor film. A heat treatment is further conducted so that the supplied catalyst elements are diffused into the amorphous semiconductor film. Thus, the catalyst elements are introduced uniformly into the amorphous semiconductor film in a very minute amount or at a low concentration, resulting in polycrystallization of at least a portion of the amorphous semiconductor film. Utilizing the thus obtained crystalline semiconductor film on the substrate surface as an active region, a semiconductor device such as a TFT is fabricated. The introduction of the catalyst elements are conducted by various methods such as: a formation of a film containing a minute amount of the catalyst elements; application of a solution containing the catalyst elements in several spin coating cycles; diffusion of the catalyst elements through a buffer layer; dipping into a solution in which the catalyst elements are dissolved or dispersed; or formation of a plating layer containing the catalyst elements.

摘要翻译： 在半导体器件的制造中，首先在具有绝缘表面的衬底上形成非晶半导体膜。 然后，将少量用于加速非晶半导体膜的结晶的催化剂元素供给到非晶半导体膜的表面的至少一部分。 进一步进行热处理，使得所提供的催化剂元素扩散到非晶半导体膜中。 因此，催化剂元素以非常微量或低浓度均匀地引入到非晶半导体膜中，导致至少一部分非晶半导体膜的多晶化。 利用由此获得的晶体半导体膜作为有源区，在衬底表面上制造诸如TFT的半导体器件。 催化剂元素的引入通过各种方法进行，例如：形成含有微量催化剂元素的膜; 在几个旋涂周期中应用含有催化剂元素的溶液; 催化剂元件通过缓冲层的扩散; 浸入催化剂元素溶解或分散的溶液中; 或形成含有催化剂元素的镀层。

公开(公告)号：US5981974A

公开(公告)日：1999-11-09

申请号：US935283

申请日：1997-09-22

申请人： Naoki Makita

发明人： Naoki Makita

IPC分类号： H01L21/20 ,  H01L21/336 ,  H01L21/77 ,  H01L21/84 ,  H01L29/94

CPC分类号： H01L27/1296 ,  H01L21/2026 ,  H01L29/66757

摘要： A semiconductor device includes a plurality of thin film transistors on a substrate having an insulating surface. A channel region of the thin film transistor comprises a crystalline Si film crystallized by a successive irradiation with a pulse laser beam in a scanning pitch P. A size Xs of the channel region in the scanning direction of the pulse laser beam and the scanning pitch P of the pulse laser beam have a relationship approximately equal to Xs=nP where n is an integer of 1 or more.

摘要翻译： 半导体器件包括在具有绝缘表面的衬底上的多个薄膜晶体管。 薄膜晶体管的沟道区域包括通过以脉冲激光束以扫描间距P连续照射而结晶的晶体Si膜。脉冲激光束的扫描方向上的沟道区域的尺寸Xs和扫描间距P 脉冲激光束的关系近似等于Xs = nP，其中n是1或更大的整数。

公开(公告)号：US5814835A

公开(公告)日：1998-09-29

申请号：US558501

申请日：1995-11-16

申请人： Naoki Makita ,  Tadayoshi Miyamoto ,  Tsukasa Shibuya ,  Masashi Maekawa

发明人： Naoki Makita ,  Tadayoshi Miyamoto ,  Tsukasa Shibuya ,  Masashi Maekawa

IPC分类号： H01L27/146 ,  H01L21/02 ,  H01L21/20 ,  H01L21/336 ,  H01L21/77 ,  H01L21/84 ,  H01L27/12 ,  H01L29/786 ,  H01L29/04

CPC分类号： H01L29/78654 ,  H01L21/2022 ,  H01L27/1214 ,  H01L29/66757

摘要： The semiconductor device of invention includes: a substrate having an insulating surface; and an element region formed by crystallizing an amorphous silicon film, the element region being provided on the insulating surface of the substrate. In the semiconductor device, the element region is constituted by a laterally crystallized region formed by crystallizing the amorphous silicon film from a linearly crystallized region crystallized by a selective introduction of catalyst elements for promoting a crystallization of the amorphous silicon film to a region surrounding the linearly crystallized region by performing a heat-treatment, and a concentration of the catalyst elements in at least one of the laterally crystallized region and the linearly crystallized region is controlled by a line width of an introduction setting region having a linear planar pattern, the line width being set so as to selectively introduce the catalyst elements.

摘要翻译： 本发明的半导体器件包括：具有绝缘表面的衬底; 以及通过使非晶硅膜结晶而形成的元件区域，所述元件区域设置在所述基板的绝缘表面上。 在半导体器件中，元件区域由通过选择性引入催化剂元素结晶的线性结晶区域使非晶硅膜结晶而形成的横向结晶区域，用于促进非晶硅膜的结晶化到线性区域 通过进行热处理的结晶化区域，并且横向结晶化区域和直线结晶化区域中的至少一个中的催化剂元素的浓度由具有线性平面图案的引入设定区域的线宽度，线宽度 被设定为选择性地引入催化剂元素。

公开(公告)号：US5744824A

公开(公告)日：1998-04-28

申请号：US863272

申请日：1997-05-27

申请人： Takamasa Kousai ,  Naoki Makita ,  Toru Takayama

发明人： Takamasa Kousai ,  Naoki Makita ,  Toru Takayama

IPC分类号： G02F1/1345 ,  G02F1/136 ,  G02F1/1368 ,  G09G3/18 ,  G09G3/36 ,  H01L21/336 ,  H01L21/8232 ,  H01L27/085 ,  H01L27/12 ,  H01L29/786 ,  H01L51/50 ,  H01L29/04 ,  H01L29/12 ,  H01L31/036

CPC分类号： H01L27/12 ,  H01L29/78621

摘要： A liquid crystal display device including: a display section including a liquid crystal layer; a pair of substrates interposing the liquid crystal layer; a plurality of pixel electrodes located in a matrix on one of the pair of substrates; a plurality of first thin film transistors respectively connected to the plurality of pixel electrodes; and a peripheral driving circuit located for driving the display section, the peripheral driving circuit being located on the substrate on which the first thin film transistors are located and having a second thin film transistor. Each of the first thin film transistors includes a first channel layer formed of a first crystalline silicon layer, and the second thin film transistor includes a second channel layer formed of a second crystalline silicon layer having a higher mobility than the mobility of the first crystalline silicon layer. The second crystalline silicon layer includes a catalytic element for promoting crystallization.

摘要翻译： 一种液晶显示装置，包括：显示部，包括液晶层; 插入液晶层的一对基板; 位于所述一对基板中的一个基板上的矩阵中的多个像素电极; 分别连接到所述多个像素电极的多个第一薄膜晶体管; 以及用于驱动显示部分的外围驱动电路，外围驱动电路位于其上位于第一薄膜晶体管的基板上并具有第二薄膜晶体管。 每个第一薄膜晶体管包括由第一晶体硅层形成的第一沟道层，并且第二薄膜晶体管包括由具有比第一晶体硅的迁移率高的迁移率的第二晶体硅层形成的第二沟道层 层。 第二晶体硅层包括促进结晶的催化元素。

公开(公告)号：US5550070A

公开(公告)日：1996-08-27

申请号：US357653

申请日：1994-12-16

申请人： Takashi Funai ,  Naoki Makita ,  Yoshitaka Yamamoto ,  Tatsuo Morita

发明人： Takashi Funai ,  Naoki Makita ,  Yoshitaka Yamamoto ,  Tatsuo Morita

IPC分类号： H01L21/20 ,  H01L21/336 ,  H01L21/265

CPC分类号： H01L29/66757 ,  H01L21/2022 ,  Y10S148/016

摘要： A method for producing a semiconductor film, includes the steps of: (a) forming an amorphous semiconductor film on a substrate having a surface with an insulating property; (b) introducing a material for accelerating crystallization of the amorphous semiconductor film into at least a part of the amorphous semiconductor film; (c) crystallizing the amorphous semiconductor film by heating to obtain a crystalline semiconductor film from the amorphous semiconductor film; and (d) oxidizing a surface of the crystalline semiconductor film to form a semiconductor oxide film containing a part of the material for accelerating the crystallization on the surface of the crystalline semiconductor film.

摘要翻译： 一种制造半导体膜的方法，包括以下步骤：（a）在具有绝缘性的表面的基板上形成非晶半导体膜; （b）引入用于加速非晶半导体膜结晶化成非晶半导体膜的至少一部分的材料; （c）通过加热使非晶半导体膜结晶，从非晶半导体膜得到结晶半导体膜; 和（d）氧化结晶半导体膜的表面以形成含有用于在结晶半导体膜的表面上加速结晶的材料的一部分的半导体氧化膜。

公开(公告)号：US08415678B2

公开(公告)日：2013-04-09

申请号：US13321411

申请日：2010-05-20

申请人： Masaki Yamanaka ,  Hiroshi Nakatsuji ,  Naoki Makita

发明人： Masaki Yamanaka ,  Hiroshi Nakatsuji ,  Naoki Makita

IPC分类号： H01L31/0368

CPC分类号： H01L27/12 ,  G02F1/136209 ,  G02F2001/13312 ,  H01L21/268 ,  H01L27/1233 ,  H01L29/78696 ,  H01L31/105

摘要： A semiconductor device of the present invention is a semiconductor device including a thin film transistor and a thin film diode. A semiconductor layer (113) of the thin film transistor and a semiconductor layer (114) of the thin film diode are both crystalline semiconductor layers. The semiconductor layer (113) of the thin film transistor and the semiconductor layer (114) of the thin film diode respectively include portions formed by crystallizing the same amorphous semiconductor film. The thickness of the semiconductor layer (114) of the thin film diode is greater than the thickness of the semiconductor layer (113) of the thin film transistor. The difference between the thickness of the semiconductor layer (113) of the thin film transistor and the thickness of the semiconductor layer (114) of the thin film diode is greater than 25 nm. The surface roughness of the semiconductor layer (114) of the thin film diode is larger than the surface roughness of the semiconductor layer (113) of the thin film transistor. As a result, the thin film transistor and the thin film diode achieve respective required characteristics.

摘要翻译： 本发明的半导体器件是包括薄膜晶体管和薄膜二极管的半导体器件。 薄膜晶体管的半导体层（113）和薄膜二极管的半导体层（114）都是结晶半导体层。 薄膜晶体管的半导体层（113）和薄膜二极管的半导体层（114）分别包括通过使相同的非晶半导体膜结晶而形成的部分。 薄膜二极管的半导体层（114）的厚度大于薄膜晶体管的半导体层（113）的厚度。 薄膜晶体管的半导体层（113）的厚度与薄膜二极管的半导体层（114）的厚度之差大于25nm。 薄膜二极管的半导体层（114）的表面粗糙度大于薄膜晶体管的半导体层（113）的表面粗糙度。 结果，薄膜晶体管和薄膜二极管实现了各自所需的特性。

公开(公告)号：US20130063329A1

公开(公告)日：2013-03-14

申请号：US13695217

申请日：2011-02-10

申请人： Hajime Saitoh ,  Naoki Makita

发明人： Hajime Saitoh ,  Naoki Makita

IPC分类号： H01L27/12 ,  G09G3/36 ,  G09G3/30 ,  H01L21/8238 ,  G09G3/20

CPC分类号： H01L27/1222 ,  H01L27/11 ,  H01L27/1108 ,  H01L27/1214

摘要： A purpose of the present invention is to reduce the driving voltage of a semiconductor device that includes an n-type TFT and a p-type TFT. Disclosed is a semiconductor device in which an n-channel type first thin film transistor (100) and a p-channel type second thin film transistor (200) are provided on the plane of a substrate (1). A first semiconductor layer (11) of the first thin film transistor (100) has a main portion, which is sandwiched between the upper surface and the lower surface of the first semiconductor layer (11), and an slanted portion, which is sandwiched by the side face and the lower surface of the first semiconductor layer (11). A second semiconductor layer (20) has a main portion, which is sandwiched between the upper surface and the lower surface of the second semiconductor layer (20), and a slanted portion, which is sandwiched between the side face and the lower surface of the second semiconductor layer (20). The inclination angle of the side face of the second semiconductor layer (20) relative to the plane of the substrate (1) is larger than the inclination angle of the side face of the first semiconductor layer (11) relative to the plane of the substrate (1).

摘要翻译： 本发明的目的是降低包括n型TFT和p型TFT的半导体器件的驱动电压。 公开了一种在衬底（1）的平面上设置n沟道型第一薄膜晶体管（100）和p沟道型第二薄膜晶体管（200）的半导体器件。 第一薄膜晶体管（100）的第一半导体层（11）具有被夹在第一半导体层（11）的上表面和下表面之间的主要部分和被夹在第一半导体层 第一半导体层（11）的侧面和下表面。 第二半导体层（20）具有被夹在第二半导体层（20）的上表面和下表面之间的主要部分和夹在第二半导体层（20）的侧面和下表面之间的倾斜部分 第二半导体层（20）。 第二半导体层（20）的侧面相对于基板（1）的平面的倾斜角度大于第一半导体层（11）的侧面相对于基板的平面的倾斜角度 （1）。