公开(公告)号：US20120190104A1

公开(公告)日：2012-07-26

申请号：US13374898

申请日：2012-01-23

Applicant: John S. Foster ,  Daryl W. Grummitt ,  John C. Harley ,  Jaquelin K. Spong ,  Kimberly L. Turner

Inventor： John S. Foster ,  Daryl W. Grummitt ,  John C. Harley ,  Jaquelin K. Spong ,  Kimberly L. Turner

IPC: C12M1/34 ,  B01L3/00

CPC classification number: G01N33/5005 ,  B01L3/502738 ,  B01L3/502761 ,  B01L2200/0652 ,  B01L2400/043 ,  B01L2400/0633 ,  C12M47/04

Abstract: A MEMS-based system and a method are described for separating a target particle from the remainder of a fluid stream. The system makes use of a unique, microfabricated movable structure formed on a substrate, which moves in a rotary fashion about one or more fixed points, which are all located on one side of the axis of motion. The movable structure is actuated by a separate force-generating apparatus, which is entirely separate from the movable structure formed on its substrate. This allows the movable structure to be entirely submerged in the sample fluid.

Abstract translation: 描述了基于MEMS的系统和方法，用于将目标颗粒与流体流的其余部分分离。 该系统利用形成在基板上的独特的微加工可移动结构，其以旋转方式围绕一个或多个固定点移动，所述固定点都位于运动轴的一侧。 可移动结构由独立的力产生装置致动，该装置与其基板上形成的可移动结构完全分开。 这允许可移动结构完全浸没在样品流体中。

公开(公告)号：US20110155548A1

公开(公告)日：2011-06-30

申请号：US12929259

申请日：2011-01-11

Applicant: John S. Foster ,  Alok Paranjpye ,  Paul J. Rubel

Inventor： John S. Foster ,  Alok Paranjpye ,  Paul J. Rubel

IPC: H01H59/00 ,  H01L21/50

CPC classification number: H01H59/0009 ,  B81B2201/018 ,  B81B2207/093 ,  B81B2207/095 ,  B81C1/00333 ,  B81C2203/0118 ,  B81C2203/035 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2924/16152 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Systems and methods for forming an electrostatic MEMS plate switch include forming a deformable plate on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. The deformable plate may have at least one shunt bar located at a nodal line of a vibrational mode of the deformable plate, so that the shunt bar remains relatively stationary when the plate is vibrating in that vibrational mode. A hermetic seal may be made around the device with a larger, secondary enclosure. Electrical access to the deformable plate may be accomplished by an electrical path which is independent of the seal. The electrical path may include a via through the first substrate or the second substrate, or a flash deposited on an external region of the switch.

Abstract translation: 用于形成静电MEMS板开关的系统和方法包括在第一衬底上形成可变形板，在第二衬底上形成电触点，并使用气密密封来连接两个衬底。 可变形板可以具有位于可变形板的振动模式的节点线处的至少一个分流杆，使得当板在该振动模式下振动时，分流棒保持相对静止。 可以在具有较大二次外壳的装置周围制造气密密封。 可以通过独立于密封件的电气路径来实现对可变形板的电气接入。 电路可以包括通过第一衬底或第二衬底的通孔，或者沉积在开关的外部区域上的闪光。

公开(公告)号：US07807547B2

公开(公告)日：2010-10-05

申请号：US11390085

申请日：2006-03-28

Applicant: Jeffery F. Summers

Inventor： Jeffery F. Summers

IPC: H01L21/30 ,  H01L23/12

CPC classification number: H01L23/10 ,  B81C1/00269 ,  B81C2203/0109 ,  B81C2203/019 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/00

Abstract: A material for bonding a lid wafer to a device wafer, which includes an adhesive substance with rigid particles embedded in the adhesive substance. The rigid particles may be particles or spheres of alumina, silica, or diamond, for example. The adhesive substance may be glass frit, epoxy, glue, cement or solder, for example. When the adhesive is applied and melted, and pressure is applied between the lid wafer and the device wafer, the lid wafer approaches the device wafer until a minimum separation is reached, which is defined by the rigid particles.

Abstract translation: 用于将盖晶片接合到器件晶片的材料，其包括具有嵌入粘合物质中的刚性粒子的粘合物质。 刚性颗粒可以是例如氧化铝，二氧化硅或金刚石的颗粒或球体。 粘合剂物质可以是例如玻璃料，环氧树脂，胶水，水泥或焊料。 当粘合剂被施加和熔化并且在盖晶片和器件晶片之间施加压力时，盖晶片接近器件晶片，直到达到由刚性粒子限定的最小间隔。

公开(公告)号：US07713786B2

公开(公告)日：2010-05-11

申请号：US11826841

申请日：2007-07-19

Applicant: John S. Foster ,  Jeffrey F. Summers

Inventor： John S. Foster ,  Jeffrey F. Summers

IPC: H01L21/00

CPC classification number: H01L21/67092 ,  B81C1/00285 ,  H01L21/67069 ,  Y10T29/53096

Abstract: A method for activating a getter at low temperature for encapsulation in a device cavity containing a microdevice comprises etching a passivation layer off the getter material while the device wafer and lid wafer are enclosed in a bonding chamber. A plasma etching process may be used, wherein by applying a large negative voltage to the lid wafer, a plasma is formed in the low pressure environment within the bonding chamber. The plasma then etches the passivation layer from the getter material, which is directly thereafter sealed within the device cavity of the microdevice, all within the etching/bonding chamber.

Abstract translation: 用于在低温下激活吸气剂以封装在包含微型装置的装置腔中的方法包括在将装置晶片和盖晶片封装在粘合室中时将钝化层从吸气剂材料上蚀刻。 可以使用等离子体蚀刻工艺，其中通过向盖晶片施加大的负电压，在接合室内的低压环境中形成等离子体。 等离子体然后从吸气剂材料中蚀刻钝化层，吸附剂材料直接在密封在微器件的器件腔内，全部在蚀刻/粘合室内。

公开(公告)号：US07687304B2

公开(公告)日：2010-03-30

申请号：US11605312

申请日：2006-11-29

Applicant: Gregory A. Carlson ,  Alok Paranjpye ,  Jeffery F. Summers ,  Douglas L. Thompson

Inventor： Gregory A. Carlson ,  Alok Paranjpye ,  Jeffery F. Summers ,  Douglas L. Thompson

IPC: H01L21/00

CPC classification number: C23C14/3414 ,  B81B7/0006 ,  C23C28/021 ,  C23C28/023 ,  C23C28/321 ,  C23C28/322 ,  C23C28/345 ,  C25D3/562 ,  C25D5/022 ,  C25D5/12 ,  C25D7/123 ,  Y10T428/12 ,  Y10T428/12361

Abstract: A material for forming a conductive structure for a micromechanical current-driven device is described, which is an alloy containing about 0.025% manganese and the remainder nickel. Data shows that the alloy possesses advantageous mechanical and electrical properties. In particular, the sheet resistance of the alloy is actually lower and more stable than the sheet resistance of the pure metal. Accordingly, when used for conductive leads in a photonic device, the leads using the NiMn alloy may provide current to heat the photonic device while generating less heat within the leads themselves, and a more stable output.

Abstract translation: 描述了用于形成用于微机电流驱动装置的导电结构的材料，其是含有约0.025％的锰和其余的镍的合金。 数据显示，该合金具有有利的机械和电学性能。 特别地，合金的薄层电阻实际上比纯金属的薄层电阻更低且更稳定。 因此，当用于光子器件中的导电引线时，使用NiMn合金的引线可以提供电流以加热光子器件，同时在引线本身内产生较少的热量，并产生更稳定的输出。

公开(公告)号：US20090201119A1

公开(公告)日：2009-08-13

申请号：US12318634

申请日：2009-01-05

Applicant: Paul J. Rubel

Inventor： Paul J. Rubel

IPC: H01H71/18 ,  H02N10/00 ,  H01H11/00

CPC classification number: F03G7/06 ,  B81B3/0059 ,  B81B2201/018 ,  B81B2201/032 ,  B81B2201/054 ,  H01H61/02 ,  H01H61/04 ,  H01H2001/0047 ,  H01H2001/0068 ,  H01H2061/006 ,  H01H2061/008 ,  H02N10/00 ,  Y10T29/49105

Abstract: A MEMS hysteretic thermal actuator may have a plurality of beams disposed over a heating element formed on the surface of the substrate. The plurality of beams may be coupled to a passive beam which is not disposed over the heating element. One of the plurality of beams may be formed in a first plane parallel to the substrate, whereas another of the plurality of beams may be formed in a second plane closer to the surface of the substrate. When the heating element is activated, it heats the plurality of beams such that they move the passive beam in a trajectory that is neither parallel to nor perpendicular to the surface of the substrate. When the beams are cooled, they may move in a different trajectory, approaching the substrate before moving laterally across it to their initial positions. By providing one electrical contact on the distal end of the passive beam and another stationary electrical contact on the substrate surface, the MEMS hysteretic actuator may form a reliable electrical switch that is relatively simple to manufacture and operate.

Abstract translation: MEMS迟滞热致动器可以具有设置在形成在基板的表面上的加热元件上的多个光束。 多个光束可以耦合到未设置在加热元件上方的无源光束。 多个光束中的一个可以形成在平行于衬底的第一平面中，而多个光束中的另一个可以形成在靠近衬底表面的第二平面中。 当加热元件被激活时，它加热多个光束，使得它们以不平行于或垂直于衬底表面的轨迹移动被动束。 当梁被冷却时，它们可以以不同的轨迹移动，在横向移动到其初始位置之前接近基板。 通过在被动束的远端上提供一个电接触，并在衬底表面上提供另一个固定的电触点，MEMS滞后致动器可形成可靠的电开关，其制造和操作相对简单。

公开(公告)号：US20090001537A1

公开(公告)日：2009-01-01

申请号：US11819338

申请日：2007-06-27

Applicant: Jeffery F. Summers

Inventor： Jeffery F. Summers

IPC: H01L23/26 ,  H01L21/00

CPC classification number: H01L23/26 ,  B81C1/00285 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for providing improved gettering in a vacuum encapsulated microdevice is described. The method includes designing a getter alloy to more closely approximate the coefficient of thermal expansion of a substrate upon which the getter alloy is deposited. Such a getter alloy may have a weight percentage of less than about 8% iron (Fe) and greater than about 50% zirconium, with the balance being vanadium and titanium, which may better match the coefficient of thermal expansion of a silicon substrate. In one exemplary embodiment, the improved getter alloy is deposited on a silicon substrate prepared with a plurality of indentation features, which increase the surface area of the substrate exposed to the vacuum. Such a getter alloy is less likely to delaminate from the indented surface of the substrate material during heat-activated steps, such as activating the getter material and bonding a lid wafer to the device wafer supporting the microdevice.

Abstract translation: 描述了一种在真空封装的微型装置中提供改进的吸气的方法。 该方法包括设计吸气剂合金以更接近近似沉积吸气剂合金的基底的热膨胀系数。 这种吸气合金的重量百分比可以小于约8％的铁（Fe）和大于约50％的锆，余量为钒和钛，这可以更好地匹配硅衬底的热膨胀系数。 在一个示例性实施例中，改进的吸气剂合金沉积在用多个压痕特征制备的硅衬底上，这增加了暴露于真空的衬底的表面积。 这种吸气合金在热激活步骤期间不太可能从基底材料的凹陷表面分层，例如激活吸气剂材料并将盖子晶片接合到支撑微型装置的器件晶片。

公开(公告)号：US20070295456A1

公开(公告)日：2007-12-27

申请号：US11896648

申请日：2007-09-05

Applicant: Christopher Gudeman ,  Steven Hovey ,  Ian Johnston

Inventor： Christopher Gudeman ,  Steven Hovey ,  Ian Johnston

IPC: H01L29/12 ,  B29C65/48 ,  H01B1/02

CPC classification number: H01L23/10 ,  B81C1/00269 ,  B81C2203/0109 ,  B81C2203/019 ,  H01B1/02 ,  H01B1/023 ,  H01B1/026 ,  H01L2924/0002 ,  H01L2924/01079 ,  Y10T428/12528 ,  Y10T428/24909 ,  H01L2924/00

Abstract: A material for bonding a first wafer to a second wafer, which includes an insulating adhesive with conductive particles embedded in the adhesive substance. When the adhesive is applied and melted or fused, and pressure is applied between the first wafer and the second wafer, the first wafer approaches the second wafer until a minimum separation is reached, defined by a dimension of the conductive particles. Each of the first wafer and the second wafer may have circuitry formed thereon, and the conductive particles may form a conductive path between the circuitry on one wafer and the circuitry on the other wafer. Advantageously, the high fusing temperature required by the insulating adhesive may also serve to activate a getter material, formed in the device cavity between the first wafer and the second wafer.

Abstract translation: 用于将第一晶片接合到第二晶片的材料，其包括具有嵌入粘合物质中的导电颗粒的绝缘粘合剂。 当粘合剂被施加并熔化或熔化并且在第一晶片和第二晶片之间施加压力时，第一晶片接近第二晶片，直到达到由导电颗粒尺寸限定的最小分离。 第一晶片和第二晶片中的每一个可以具有在其上形成的电路，并且导电粒子可以在一个晶片上的电路和另一个晶片上的电路之间形成导电路径。 有利地，绝缘粘合剂所需的高定影温度也可以用于激活形成在第一晶片和第二晶片之间的器件空腔中的吸气剂材料。

公开(公告)号：US20070269934A1

公开(公告)日：2007-11-22

申请号：US11434768

申请日：2006-05-17

Applicant: Douglas L. Thompson ,  Gregory A. Carlson ,  David M. Erlach

Inventor： Douglas L. Thompson ,  Gregory A. Carlson ,  David M. Erlach

IPC: H01L21/00

CPC classification number: B81C99/004

Abstract: A method for providing access to a feature on a device wafer, and located outside an encapsulation region is described. The method includes forming a cavity in the lid wafer, aligning the lid wafer with the device wafer so that the cavity is located substantially above the feature, and removing material substantially uniformly from the bottom surface of the lid wafer, until an aperture is formed at the cavity, over the feature on the device wafer. By removing material from the lid wafer in a substantially uniform manner, difficulties with the prior art procedure of saw cutting, such as alignment and debris generation, are avoided.

Abstract translation: 描述了一种用于提供对设备晶片上的特征的访问并位于封装区域外部的方法。 该方法包括在盖晶片中形成空腔，将盖晶片与器件晶片对准，使得空腔基本上位于特征上方，并且从盖晶片的底表面基本上均匀地移除材料，直到孔形成在 在器件晶圆上的特征之上。 通过以大致均匀的方式从盖晶片去除材料，避免了现有技术的锯切过程（例如对准和碎屑产生）的困难。

公开(公告)号：US20070215448A1

公开(公告)日：2007-09-20

申请号：US11378340

申请日：2006-03-20

Applicant: Alok Paranjpye ,  Jeffery Summers

Inventor： Alok Paranjpye ,  Jeffery Summers

IPC: H01H1/00 ,  H01H11/00

CPC classification number: B81B3/0024 ,  B81B2201/018 ,  B81B2201/0278 ,  H01H2037/008 ,  H01H2061/008 ,  Y10T29/49105 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/53248

Abstract: A MEMS thermal switch is disclosed which couples a hot, expanding beam to a cool flexor beam using a slideably engaged tether, and bends the cool, flexor beam by the expansion of the hot beam. A rigidly engaged tether ties the distal ends of the hot, expanding beam and the cool, flexor beam together, whereas the slideably engaged tether allows the hot, expanding beam to elongate with respect to the cool, flexor beam, without loading the slideably engaged tether with a large shear force. As a result, the material of the tether can be made stiffer, and therefore transmit the bending force of the hot, expanding beam more efficiently to the cool, flexor beam.

Abstract translation: 公开了一种MEMS热开关，其使用可滑动接合的系绳将热膨胀梁耦合到冷弯头梁，并且通过热梁的膨胀来弯曲冷弯曲梁。 刚性接合的系绳将热的，扩张的梁和冷的弯曲梁的远端连接在一起，而可滑动地接合的系绳允许热的，膨胀的梁相对于冷的屈肌梁而伸长，而不加载可滑动地接合的系绳 具有很大的剪切力。 结果，系链的材料可以变得更硬，并且因此将热膨胀梁的弯曲力更有效地传递到凉爽的弯曲梁。