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220746 条记录 (耗时 0.086 秒)

    WIRING SUBSTRATE FOR ELECTRONIC CONTROL DEVICE, AND METHOD FOR MANUFACTURING SAME
    41.
    发明公开
    WIRING SUBSTRATE FOR ELECTRONIC CONTROL DEVICE, AND METHOD FOR MANUFACTURING SAME 审中-公开

    公开(公告)号：US20240357736A1

    公开(公告)日：2024-10-24

    申请号：US18684457

    申请日：2022-08-15

    申请人： HITACHI ASTEMO, LTD.

    发明人： Takanori SEKIGUCHI ,  Takayuki DEGUCHI

    IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K3/42

    CPC分类号： H05K1/0268 ,  H05K1/113 ,  H05K3/429 ,  H05K2201/09509 ,  H05K2201/09572 ,  H05K2201/09827 ,  H05K2203/045 ,  H05K2203/1121

    摘要： An electronic component is mounted on a surface layer of a multilayer substrate constituting a wiring substrate, and a signal wire of the surface layer is electrically connected to the electronic component. A conductor pad for contact with an inspection probe is composed of a via and a solder filled in an internal opening portion thereof. The via has a laser-processed taper-shaped hole with a metal-plated inner peripheral surface and connects the inter-layer connection between the signal wire of the surface layer and a signal wire of the inner layer. The solder is filled in the opening portion of the via by filling, heating and melting solder material therein. Since the peripheral edge portion is solidified first at the time of the cooling and the solidification, the middle part is recessed compared to the peripheral edge portion. This ensures a reliable contact of the inspection probe.

    Eddy Current Mitigation for On-Chip Inductors
    42.
    发明公开
    Eddy Current Mitigation for On-Chip Inductors 审中-公开

    公开(公告)号：US20240357734A1

    公开(公告)日：2024-10-24

    申请号：US18474880

    申请日：2023-09-26

    申请人： Apple Inc.

    发明人： Behzad Biglarbegian ,  Hongrui Wang ,  Abbas Komijani ,  Reetika K Agarwal

    IPC分类号： H05K1/02 ,  H01P3/08

    CPC分类号： H05K1/0243 ,  H01P3/08 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10075

    摘要： An electronic device may include a transceiver with a substrate and an inductor on the substrate. A ring of ground traces may surround the inductor. Circuit components may be patterned onto the substrate overlapping the inductor, a region of the substrate surrounded by the inductor, and/or a region of the substrate between the inductor and the ring. The components may be arranged in trees with feed lines extending radially outward from a central axis. The components in each tree may be separated from the capacitors in other trees by gaps, preventing eddy currents on the trees. The components may be used to form bypass capacitors for power supply lines, a low-dropout regulator load, part of the loop filter of a phase-locked loop, or other portions of the transceiver. The components may thereby be used to convey signals while also meeting fill factor requirements associated with fabrication of the substrate.

    FLEXIBLE PRINTED CIRCUIT BOARD (PCB)-BASED MOBILE SENSOR PLATFORM
    43.
    发明公开
    FLEXIBLE PRINTED CIRCUIT BOARD (PCB)-BASED MOBILE SENSOR PLATFORM 审中-公开

    公开(公告)号：US20240356462A1

    公开(公告)日：2024-10-24

    申请号：US18756487

    申请日：2024-06-27

    申请人： CenturyLink Intellectual Property LLC

    发明人： Patrick Giagnocavo

    IPC分类号： H02N2/04 ,  H05K1/18 ,  H10N35/00

    CPC分类号： H02N2/04 ,  H05K1/189 ,  H10N35/00 ,  H05K2201/083 ,  H05K2201/10037 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10151

    摘要： Novel tools and techniques are provided for implementing flexible printed circuit board (“PCB”)-based mobile sensor platform. In various embodiments, a flexible PCB-based mobile sensor platform includes a body portion(s) and at least one of a microcontroller, a locomotion system, sensors, a transceiver(s), and/or the like, each disposed on the body portion(s). The locomotion system includes one or more flexible PCB portions and corresponding actuators. Based on instructions from the microcontroller, at least one actuator may cause bending and unbending of a corresponding flexible PCB portion(s) that causes the flexible PCB-based mobile sensor platform to move toward a target location within a first environment. Upon arrival, the sensors may collect sensor data regarding at least one of the target location, an object located at the target location, or a portion of the object, and the microcontroller may send the collected sensor data to an external device via the transceiver.

    DATA COMMUNICATIONS CASE
    46.
    发明公开
    DATA COMMUNICATIONS CASE 审中-公开

    公开(公告)号：US20240356201A1

    公开(公告)日：2024-10-24

    申请号：US18427268

    申请日：2024-01-30

    申请人： Plum Laboratories, Inc.

    发明人： Dawson Lee WILLIAMS

    IPC分类号： H01Q1/24 ,  H01Q1/12 ,  H01Q1/22 ,  H01Q21/28 ,  H04B1/38 ,  H05K5/02 ,  H05K5/03 ,  H05K7/12 ,  H05K7/18

    CPC分类号： H01Q1/243 ,  H01Q1/1207 ,  H01Q1/2291 ,  H01Q21/28 ,  H04B1/38 ,  H05K5/0221 ,  H05K5/023 ,  H05K5/0247 ,  H05K5/03 ,  H05K7/12 ,  H05K7/186

    摘要： A data communications apparatus is disclosed for providing a data communications network. The apparatus includes a portable carrying case. A power supply is securable inside the case. A router device is securable inside the case, the router device including at least one cellular gateway for wide area network communication and configured to enable at least one wireless network for local area network communication. An antenna array is in electrical communication with the router device, the antenna array including at least a first pair of cellular antennas, at least two wireless networking antennas, and a satellite antenna. The first pair of cellular antennas are configured to support multiple input multiple output applications for the at least one cellular gateway, and the at least two wireless networking antennas are configured to support multiple input multiple output applications for the at least one wireless network.

    TRANSMISSION LINE
    47.
    发明公开
    TRANSMISSION LINE 审中-公开

    公开(公告)号：US20240356190A1

    公开(公告)日：2024-10-24

    申请号：US18763068

    申请日：2024-07-03

    申请人： Murata Manufacturing Co., Ltd.

    发明人： Tomohiro NAGAI

    IPC分类号： H01P3/08 ,  H01P3/00 ,  H01P3/02 ,  H05K1/02

    CPC分类号： H01P3/08 ,  H01P3/003 ,  H01P3/026 ,  H05K1/0237

    摘要： A transmission line includes a substrate, a high-frequency signal transmission line, a differential signal transmission line, and a power supply line. The substrate is insulating, extends in a predetermined direction, and internally includes each of the high-frequency signal transmission line, the differential signal transmission line, and the power supply line. The power supply line and the high-frequency signal transmission line are in parallel or substantially in parallel to each other, and the differential signal transmission line is between the power supply line and the high-frequency signal transmission line.

    Information Handling System with Retractable Input/Output Port Component
    50.
    发明公开
    Information Handling System with Retractable Input/Output Port Component 审中-公开

    公开(公告)号：US20240353892A1

    公开(公告)日：2024-10-24

    申请号：US18138044

    申请日：2023-04-22

    申请人： Dell Products L.P.

    发明人： Owen Kidd ,  Walter R. Carver

    IPC分类号： G06F1/16 ,  H05K7/00

    CPC分类号： G06F1/16 ,  H05K7/00

    摘要： A retractable input/output port component for a server type information handling system. The retractable input/output component includes a housing, the housing having a front facet and a side facet, the housing being configured to be retracted into a volume of the server type information handling system; an ever present feature port, the ever present feature port being mounted to the front facet of the housing; and, a temporary use feature, the temporary use feature being mounted to the side facet of the housing, the temporary use feature being accessible when the housing is in an extracted configuration.