公开(公告)号：US12055453B2

公开(公告)日：2024-08-06

申请号：US17930024

申请日：2022-09-06

Applicant: KABUSHIKI KAISHA TOSHIBA ,  Toshiba Energy Systems & Solutions Corporation

Inventor： Jun Mitani ,  Takero Mukai ,  Takanobu Kojima ,  Masahiko Nakazono

IPC: G01L23/08 ,  G01L1/02 ,  G01L1/10 ,  G01L1/16 ,  G01L1/25

CPC classification number: G01L23/08 ,  G01L1/02 ,  G01L1/103 ,  G01L1/106 ,  G01L1/162 ,  G01L1/165 ,  G01L1/167 ,  G01L1/255

Abstract: A stress estimation method for a machine structure according to an embodiment is provided with a calculation step of calculating a relationship between the stress generated at the evaluation target position and a physical quantity including a sound pressure or vibration generated at a detection position different from the evaluation target position during vibration of the machine structure. The stress estimation method for a machine structure is provided with a detection step of detecting the physical quantity generated at the detection position during operation of the machine structure. The stress estimation method for a machine structure is provided with an estimation step of estimating the stress generated at the evaluation target position during operation of the machine structure on the basis of the relationship calculated in the calculation step and the physical quantity detected in the detection step.

公开(公告)号：US20230146607A1

公开(公告)日：2023-05-11

申请号：US17836565

申请日：2022-06-09

Applicant: North University of China

Inventor： Qiulin TAN ,  Xiaorui LIANG ,  Juan ZHANG ,  Lei ZHANG ,  Wendong ZHANG ,  Jijun XIONG

IPC: G01K11/26 ,  G01D21/02 ,  G01L1/16 ,  G01L11/04 ,  H03H9/25 ,  H03H9/02

CPC classification number: G01K11/265 ,  G01D21/02 ,  G01L1/165 ,  G01L11/04 ,  H03H9/25 ,  H03H9/02574 ,  H03H9/02834

Abstract: Disclosed in the present disclosure are a surface-acoustic-wave temperature and pressure sensing device and a manufacturing method thereof. The surface-acoustic-wave temperature and pressure sensing device includes a first high-temperature-resistant substrate and a second high-temperature-resistant substrate bonded together, where a recess is formed in the second high-temperature-resistant substrate to form a sealed cavity between the first high-temperature-resistant substrate and the second high-temperature-resistant substrate; first surface-acoustic-wave temperature sensors and surface-acoustic-wave pressure sensors are formed on a first surface of the first high-temperature-resistant substrate located in the cavity, and second surface-acoustic-wave temperature sensors are formed on a second surface of the first high-temperature-resistant substrate opposite the first surface; and the first surface-acoustic-wave temperature sensors, the second surface-acoustic-wave temperature sensors, and the surface-acoustic-wave pressure sensors are electrically connected to one another.

公开(公告)号：US20180356368A1

公开(公告)日：2018-12-13

申请号：US15616105

申请日：2017-06-07

Applicant: General Electric Company

Inventor： Joseph Iannotti ,  Christopher James Kapusta ,  David Richard Esler

IPC: G01N29/22 ,  G01N29/24 ,  G01L1/16 ,  G01K11/26 ,  G01L3/00

CPC classification number: G01N29/223 ,  B23K1/002 ,  G01K11/265 ,  G01L1/165 ,  G01L3/00 ,  G01L19/147 ,  G01N29/2462 ,  H01L24/28

Abstract: A system includes a structure configured to have a structure bonding layer disposed on a surface of the structure. The structure bonding layer is a metallic alloy. The system includes a sensor configured to have a sensor bonding layer disposed on a surface of the sensor. The sensor bonding layer is a metallic alloy. The sensor bonding layer is configured to be coupled to the structure bonding layer via a metallic joint in order for the sensor to sense data of the structure through the metallic joint, the structure bonding layer, and the sensor bonding layer.

公开(公告)号：US20180099414A1

公开(公告)日：2018-04-12

申请号：US15288027

申请日：2016-10-07

Applicant: SOUTHERN TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLO

Inventor： CHENG HSIN CHUANG ,  JIA WUN CHEN

IPC: B25J13/08 ,  H01L41/053 ,  H01L41/113 ,  H01L41/193 ,  H01L41/25 ,  G01L1/16

CPC classification number: B25J13/084 ,  G01L1/165 ,  H01L41/053 ,  H01L41/1132 ,  H01L41/193 ,  H01L41/25

Abstract: An ultrasonic tactile sensor for detecting a clamping force includes an ultrasonic detector and a sensing layer, and the sensing layer includes a first soft layer and a second soft layer, and the first soft layer has plural spherical microstructures arranged in contact with the ultrasonic detector, so that after a pressure is applied to the sensing layer, the ultrasonic detector generates an ultrasonic wave and receives a reflected wave signal, and the signal is provided for identifying the contact area of the spherical microstructures and deriving the force exerted on the tactile sensor.

公开(公告)号：US09885622B2

公开(公告)日：2018-02-06

申请号：US14646186

申请日：2013-11-22

Applicant: Transense Technologies PLC

Inventor： Victor Alexandrovich Kalinin ,  Raymond David Lohr ,  Arthur John Leigh ,  Alexander Thomas James Stopps

IPC: G01L3/00 ,  G01L3/10 ,  G01L1/16

CPC classification number: G01L3/10 ,  G01L1/165 ,  G01L3/106 ,  Y10T29/49828

Abstract: A SAW sensor arrangement includes a transducer including a support for supporting a SAW device. The support includes a sensor location part located between two oppositely extending attachment parts. The SAW device is mountable to the sensor location part. The sensor arrangement 10 includes at least two spaced friction raisers. The sensor arrangement includes a clamp arrangement which applies a clamping force to clamp the sensor arrangement to an item. The sensor arrangement is arranged so that in use each of the friction raisers is located between a different one of the attachment parts and the item.

公开(公告)号：US20150369678A1

公开(公告)日：2015-12-24

申请号：US14760776

申请日：2014-01-14

Applicant: DENSO CORPORATION ,  NIPPON SOKEN, INC.

Inventor： Shuntaro YOSHIDA ,  Takao IWAKI ,  Inao TOYODA ,  Takuya ISHIKAWA ,  Akira OKADA ,  Kazumasa OGINO

IPC: G01L3/10 ,  B23K26/20

CPC classification number: G01L3/10 ,  B23K26/20 ,  G01L1/165 ,  G01L1/2287 ,  Y10T29/43

Abstract: A torque sensor includes: a base portion fixed to a metal shaft having a rod shape as a measurement object of strain; a strain detection element of an surface acoustic wave type which is arranged in the base portion, and detects the strain of the metal shaft (10) through the base portion; and a fixing portion that is arranged between the base portion and the strain detection element, and fixes the strain detection element to the base portion.

Abstract translation: 扭矩传感器包括：固定到具有作为应变测量对象的杆形状的金属轴的基部; 表面声波型的应变检测元件，其布置在基部中，并且通过基部检测金属轴（10）的应变; 以及设置在所述基部和所述应变检测元件之间的固定部，并且将所述应变检测元件固定到所述基部。

公开(公告)号：US09116034B2

公开(公告)日：2015-08-25

申请号：US13824005

申请日：2011-09-14

Applicant: Sang Sik Yang ,  Ik Mo Park ,  Young kil Kim ,  Kee Keun Lee ,  Ick Jin Kwon ,  Hae Kwan Oh

Inventor： Sang Sik Yang ,  Ik Mo Park ,  Young kil Kim ,  Kee Keun Lee ,  Ick Jin Kwon ,  Hae Kwan Oh

IPC: G01N29/00 ,  G01H17/00 ,  G01N29/02 ,  G01N29/24 ,  G06K19/067 ,  G06K19/07 ,  G01D21/00 ,  G01L9/00 ,  G01L1/16

CPC classification number: G01H17/00 ,  G01D21/00 ,  G01L1/165 ,  G01L9/0025 ,  G01N29/022 ,  G01N29/2481 ,  G01N2291/0256 ,  G01N2291/0423 ,  G06K19/0675 ,  G06K19/0717

Abstract: A wireless measurement device includes a sound acoustic wave (SAW)-based micro sensor converting a wirelessly received pulse signal into an SAW and generating a plurality of pulse signals by reflecting the SAW, and wirelessly transmitting the plurality of pulse signals to measure a variance of an environmental element; and a reader generating and wirelessly transmitting a pulse signal to the SAW-based micro sensor to measure variances in environmental elements.

Abstract translation: 无线测量装置包括基于声波（SAW）的微型传感器，其将无线接收的脉冲信号转换成SAW并通过反射SAW产生多个脉冲信号，并且无线发送多个脉冲信号以测量 环境因素 以及读取器，生成并将脉冲信号无线发送到基于SAW的微型传感器，以测量环境因素的变化。

公开(公告)号：US09027407B2

公开(公告)日：2015-05-12

申请号：US13825312

申请日：2011-09-19

Applicant: Luc Chommeloux ,  Philippe Menage

Inventor： Luc Chommeloux ,  Philippe Menage

IPC: G01L7/00 ,  G01L11/00 ,  G01L9/08 ,  G01L9/00 ,  G01L19/00 ,  G01K11/26 ,  G01L3/10 ,  G01L1/16

CPC classification number: G01L9/08 ,  G01K11/265 ,  G01L1/165 ,  G01L3/10 ,  G01L9/0025 ,  G01L9/008 ,  G01L19/0092 ,  Y10T29/42

Abstract: A pressure and temperature sensor comprising comprises at least a first resonator of the SAW type comprising a piezoelectric substrate, thinned at least locally, of the membrane type, a second resonator of the SAW type comprising a piezoelectric substrate and a third resonator of the SAW type comprising a piezoelectric substrate, characterized in that the first, the second and the third resonators are respectively on the surface of first, second and third individual piezoelectric substrates, each of the individual substrates being positioned on the surface of a common base section, locally machined away under said first resonator in such a manner as to liberate the substrate from said resonator so as to render it operational for the measurement of pressure. A method of fabrication for such a sensor is also provided.

Abstract translation: 一种压力和温度传感器，包括至少一种SAW型的第一谐振器，包括至少部分薄膜化的压电衬底，SAW型的第二谐振器，包括压电衬底和SAW型的第三谐振器 包括压电基片，其特征在于，第一，第二和第三谐振器分别位于第一，第二和第三单独的压电基片的表面上，每个单独的基板位于公共基底部分的表面上，被局部加工 在所述第一谐振器下方以从所述谐振器释放衬底的方式，以便使其可操作用于测量压力。 还提供了一种用于这种传感器的制造方法。

公开(公告)号：US20150013461A1

公开(公告)日：2015-01-15

申请号：US14330979

申请日：2014-07-14

Applicant: ENVIRONETIX TECHNOLOGIES CORP.

Inventor： THOMAS POLLARD ,  DONALD McCANN

IPC: H01L41/113 ,  G01H11/08

CPC classification number: H01L41/1132 ,  G01H11/08 ,  G01K11/265 ,  G01L1/165 ,  G01N29/2462 ,  G01N2291/0423 ,  G10K11/36 ,  H03H9/02543 ,  H03H9/0259 ,  H03H9/02598

Abstract: A SAW mode sensor for sensing parameters such as temperature, pressure, and strain. The sensor is made of a piezoelectric crystal cut at selected angles, with an attached electrode layer with a signal receiver and signal transmitter. The signal receiver initiates a wave in the substrate which propagates in the substrate and the speed of the wave and amplitude of the wave is interpreted as the parameter being sensed.

Abstract translation: 用于感测温度，压力和应变等参数的SAW模式传感器。 传感器由选定角度切割的压电晶体制成，附带的电极层带有信号接收器和信号发射器。 信号接收器在衬底中启动在衬底中传播的波，波的速度和波的幅度被解释为被感测的参数。

公开(公告)号：US20130140611A1

公开(公告)日：2013-06-06

申请号：US13686375

申请日：2012-11-27

Applicant: Jin Seok KIM ,  Jun-Kyo Francis SUH ,  Sung Chul KANG ,  Jeong Hoon LEE

Inventor： Jin Seok KIM ,  Jun-Kyo Francis SUH ,  Sung Chul KANG ,  Jeong Hoon LEE

IPC: H01L29/84 ,  H01L29/66

CPC classification number: H01L29/84 ,  A61B5/031 ,  A61B2562/0247 ,  A61B2562/046 ,  B81B3/0078 ,  B81B2201/0264 ,  B81C1/00206 ,  B82Y15/00 ,  B82Y99/00 ,  G01L1/16 ,  G01L1/165 ,  G01L7/08 ,  G01L9/0047 ,  G01L9/0098 ,  H01L29/66007 ,  Y10S977/90 ,  Y10S977/936 ,  Y10S977/956

Abstract: The present disclosure relates to a pressure sensor having a nanostructure and a method for manufacturing the same. More particularly, it relates to a pressure sensor having a nanostructure attached on the surface of the pressure sensor and thus having improved sensor response time and sensitivity and a method for manufacturing the same. The pressure sensor according to the present disclosure having a nanostructure includes: a substrate; a source electrode and a drain electrode arranged on the substrate with a predetermined spacing; a flexible sensor layer disposed on the source electrode and the drain electrode; and a nanostructure attached on the surface of the flexible sensor layer and having nanosized wrinkles.

Abstract translation: 本发明涉及具有纳米结构的压力传感器及其制造方法。 更具体地说，本发明涉及一种压力传感器，其具有附着在压力传感器表面上的纳米结构，因此具有改进的传感器响应时间和灵敏度及其制造方法。 具有纳米结构的根据本公开的压力传感器包括：基底; 以预定间隔布置在基板上的源电极和漏电极; 设置在所述源电极和所述漏电极上的柔性传感器层; 以及附着在柔性传感器层的表面上并具有纳米级皱纹的纳米结构。