摘要:
The present invention concerns methods for joining flexible polymer workpieces using light energy. These methods, referred to as laser welding, can be used to join thermoplastic or thermoset polymers. The laser welding method of the invention is applicable to the creation or repair of any article requiring the bonding of two flexible polymer components or a flexible polymer component and an inflexible polymer component.
摘要:
A system and a method by which workpieces are bonded to and debond from a manufacturing fixture using a radiation responsive adhesive as a bonding agent. The system includes curing the adhesive agent during loading within seconds, and structurally weakens the adhesive bond during unloading within seconds. During the workpiece loading cycle, an adhesive dispenser deposits radiation responsive adhesive on to a load bearing, light transmittive surface, known as gripper pins. The workpiece is subsequently pushed against the locators, and towards the gripper pins causing the adhesive to interpose between workpiece and gripper pins, curing radiant energy is transmitted through the gripper pins and on to the adhesive to cure adhesive and bond the workpiece to the fixture. Therefore, the bond is structurally weakened or debonded in order to remove the workpiece from the fixture after manufacturing.
摘要:
A method for adhering/bonding a frame profile (e.g., weather strip, water seal, spacer, etc.) to a substrate (e.g., glass or plastic substrate) in the context of a vehicle window unit. A frame profile is formed via extrusion so as to include both a polymer profile portion and a selectively activatable interface or adhesive portion. Following extrusion, the frame profile may be stored, cut, trimmed, cure, etc. At some point following extrusion, the interface/adhesive is in a non-activated state, or at least in a state where it is not activated to an extent sufficient to bond/adhere the frame to the substrate. To adhere/bond the frame profile to the substrate, the interface/adhesive portion of the frame profile is activated (e.g., heat activated). Following and/or during heat activation, the frame profile is pressed against the substrate, or vice versa, so that the activated adhesive bonds the polymer profile to the substrate.
摘要:
A method and apparatus for packaging articles in card and blister packages is disclosed, the card and blister package comprising a first or blister piece of clear pre-formed plastic with a shaped cavity for receiving small articles, and a flat flange portion along its perimeter. The second piece of the package is a flat rectangular chipboard card, appreciably larger than the card and blister piece and having printing on one or both sides. The flange of the card and blister piece can be bonded to the surface of a card to form a card and blister package for the enclosed articles. Apparatus for producing a plurality of packaged articles includes a plurality of package holders mounted on the surface of a conveyor belt that is porous to UV light, the holders made of a UV light transparent material and having upper surfaces with shaped recesses for removably supporting the plastic card and blister pieces with their cavities upwardly faced and for supporting the cards in position above the card and blister pieces. At the forward part of the conveyor the card and blister cavities can be filled by the pertinent articles of commerce, UV curable adhesive applied to the pertinent surfaces and then cards placed thereover. The UV curable adhesive is instantly cured as the holders are advanced through a UV reactor, and sealed packages fall free from their holders, for collection, as they are inverted during passage around the end of the conveyor.
摘要:
An apparatus emits radiation on curable adhesives to bond objects or surfaces together under a variety of ambient conditions. An insulating housing has a cylindrical section and a disc-shaped section defining an interior. A plurality of batteries and an LED array are separated in the interior by an insulating spacer to prevent shorting of the batteries. A switch relay in the interior connects power from the batteries to the LED array when a switching mechanism mounted on the outside of the housing is displaced. This displacement closes the switch relay and connects power to the LED array that emits high-intensity radiation. A cover connected to the cylindrical-shaped section seals the interior from ambient and transmits the high-intensity radiation to cure an adhesive.
摘要:
A method for producing a disk-shaped substrate 10 used for producing an optical disk includes: (a) forming a protective layer 12a that is larger in area than the disk-shaped substrate 10 on a surface of a transparent plate 11a; and (b) cutting a portion of the plate 11a with the protective layer 12a formed thereon other than an outer edge portion of the protective layer 12a to form a disk shape. According to this producing method, a thin substrate can be prevented from being damaged by forming a protective layer. Furthermore, according to this producing method, a protective layer with a uniform thickness can be formed.
摘要:
This invention relates to how to obtain an optical recording disc with a good quality, capable of achieving a beautiful outline shape of the inner peripheral part side rim part of the cured ultraviolet ray curing type resin substantially concentrically even in the case there is irregularity of the wettability of both round substrates with respect to the ultraviolet ray curing type resin, and capable of providing an even film thickness of the resin with the film thickness controlled to a predetermined value or less even in the case there are irregularity of the wettability of both round substrates, difficulty in controlling the centrifugal force applied on the resin, irregularity of the plate thickness of both round substrates, or the like. Either one of both substrates is rotated at a low speed with the other one fixed while pressuring between both substrates of an optical recording disc comprising both substrates temporarily bonded via a ring-like ultraviolet ray curing type resin disposed substantially concentrically with the substrates for forming a layer with a predetermined even thickness by the spread, the optical recording disc temporarily bonded having the layer-like resin is rotated at a high speed, and an ultraviolet ray is irradiated to the optical recording disc temporarily bonded and rotated at the high speed for curing the layer-like resin.
摘要:
A bonding method and apparatus for performing same in which a first member (e.g., a silicon chip) is bonded to a second member (e.g., a glass substrate such as a PCB) using a thermosetting resin adhesive. Near infrared rays are directed onto the second member, some of these passing through the second member to also heat the adhesive. A heater is pressed onto the first member and also heats the first member. Selective cooling is also utilized to assure an acceptable temperature gradient between both members and thereby prevent distortion of same which could harm the resulting structure.
摘要:
A method for adhering/bonding a frame profile (e.g., weather strip, water seal, spacer, etc.) to a substrate (e.g., glass or plastic substrate) in the context of a vehicle window unit. A frame profile is formed via extrusion so as to include both a polymer profile portion and a selectively activatable interface or adhesive portion. Following extrusion, the frame profile may be stored, cut, trimmed, cure, etc. At some point following extrusion, the interface/adhesive is in a non-activated state, or at least in a state where it is not activated to an extent sufficient to bond/adhere the frame to the substrate. To adhere/bond the frame profile to the substrate, the interface/adhesive portion of the frame profile is activated (e.g., heat activated). Following and/or during heat activation, the frame profile is pressed against the substrate, or vice versa, so that the activated adhesive bonds the polymer profile to the substrate.
摘要:
A disk medium and a method of manufacturing the disk medium are disclosed. The disk medium includes a first disk member having a penetrating hole, and a second disk member having a projecting portion, wherein the projecting portion is placed within the penetrating hole of the first disk member to form the optical medium. The method includes forming a first disk member having a penetrating hole, forming a second disk member having a projecting portion, and positioning the projecting portion of the second disk member within the penetrating hole of the first disk member, whereby the first and disk members are combined to form an optical medium.