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    Identifying nuisances and defects of interest in defects detected on a wafer
    41.
    发明授权
    Identifying nuisances and defects of interest in defects detected on a wafer 有权

    公开(公告)号：US10699926B2

    公开(公告)日：2020-06-30

    申请号：US16113930

    申请日：2018-08-27

    Applicant: KLA-Tencor Corporation

    Inventor： Martin Plihal ,  Brian Duffy ,  Mike VonDenHoff ,  Andrew Cross ,  Kaushik Sah ,  Antonio Mani

    IPC: H01L21/67 ,  G06T7/00 ,  G01N21/95

    Abstract: Methods and systems fir identifying nuisances and defects of interest (DOIs) in defects detected on a wafer are provided. One method includes acquiring metrology data for the wafer generated by a metrology tool that performs measurements on the wafer at an array of measurement points. In one embodiment, the measurement points are determined prior to detecting the defects on the wafer and independently of the defects detected on the wafer. The method also includes determining locations of defects detected on the wafer with respect to locations of the measurement points on the wafer and assigning metrology data to the defects as a defect attribute based on the locations of the defects determined with respect to the locations of the measurement points. In addition, the method includes determining if the defects are nuisances or DOIs based on the defect attributes assigned to the defects.

    Detecting die repeating programmed defects located in backgrounds with non-repeating features
    42.
    发明授权
    Detecting die repeating programmed defects located in backgrounds with non-repeating features 有权

    公开(公告)号：US10677742B2

    公开(公告)日：2020-06-09

    申请号：US16295999

    申请日：2019-03-07

    Applicant: KLA-Tencor Corporation

    Inventor： Dhiraj Ramesh Gawhane

    IPC: G01N21/95 ,  G01R31/3185 ,  G01R31/317 ,  G01R31/302 ,  G01N21/88

    Abstract: Systems and methods for detecting programmed defects on a water during inspection of the wafer are provided. One method includes selecting a mode of an inspection subsystem for detecting programmed defects on a wafer that generates output for the wafer having the lowest non-defect signal and at least a minimum signal for the programmed defects. The method also includes selecting a training care area that is mutually exclusive of care area(s) used for detecting the programmed defects during inspection of the wafer. The training care area generates less of the non-defect signal than the care area(s). The method further includes training a programmed defect detection method using the output generated with the selected mode in the training care area and detecting the programmed defects during the inspection of the wafer by applying the trained programmed defect detection method to the output generated in the care area(s) with the selected mode.

    Automatic recipe stability monitoring and reporting
    44.
    发明授权
    Automatic recipe stability monitoring and reporting 有权

    公开(公告)号：US10514685B2

    公开(公告)日：2019-12-24

    申请号：US14736250

    申请日：2015-06-10

    Applicant: KLA-Tencor Corporation

    Inventor： Hucheng Lee ,  Lisheng Gao ,  Govindarajan Thattaisundaram

    IPC: G05B19/418

    Abstract: Systems and methods for monitoring stability of a wafer inspection recipe over time are provided. One method includes collecting inspection results over time. The inspection results are generated by at least one wafer inspection tool while performing the wafer inspection recipe on wafers at different points in time. The method also includes identifying abnormal variation in the inspection results by comparing the inspection results generated at different times to each other. In addition, the method includes determining if the abnormal variation is attributable to the wafers, the wafer inspection recipe, or one or more of the at least one wafer inspection tool thereby determining if the wafer inspection recipe is stable over time.

    Adaptive local threshold and color filtering
    45.
    发明授权
    Adaptive local threshold and color filtering 有权

    公开(公告)号：US10395359B2

    公开(公告)日：2019-08-27

    申请号：US15624649

    申请日：2017-06-15

    Applicant: KLA-Tencor Corporation

    Inventor： Junqing Huang ,  Hucheng Lee ,  Kenong Wu ,  Lisheng Gao

    IPC: G06T7/00 ,  G06T7/90

    Abstract: Methods and systems for detecting defects on a wafer using adaptive local thresholding and color filtering are provided. One method includes determining local statistics of pixels in output for a wafer generated using an inspection system, determining which of the pixels are outliers based on the local statistics, and comparing the outliers to the pixels surrounding the outliers to identify the outliers that do not belong to a cluster of outliers as defect candidates. The method also includes determining a value for a difference in color between the pixels of the defect candidates and the pixels surrounding the defect candidates. The method further includes identifying the defect candidates that have a value for the difference in color greater than or equal to a predetermined value as nuisance defects and the defect candidates that have a value for the difference in color less than the predetermined value as real defects.

    Dynamic binning for diversification and defect discovery
    49.
    发明授权
    Dynamic binning for diversification and defect discovery 有权
    多元化和缺陷发现的动态合并

    公开(公告)号：US09582869B2

    公开(公告)日：2017-02-28

    申请号：US14614202

    申请日：2015-02-04

    Applicant: KLA-Tencor Corporation

    Inventor： Martin Plihal ,  Vidyasagar Anantha

    IPC: G06K9/00 ,  G06T7/00 ,  G01N21/95 ,  G01N21/956 ,  G06K9/52 ,  G01N21/88 ,  G06K9/62

    CPC classification number: G06T7/0004 ,  G01N21/8851 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/8854 ,  G06K9/00 ,  G06K9/52 ,  G06K9/6255 ,  G06T7/001 ,  G06T2207/30148

    Abstract: Methods and systems for generating a defect sample for a wafer are provided. One method includes separating defects detected on a wafer into bins having diversity in values of a first set of one or more first attributes of the defects. The method also includes selecting, independently from one or more of the bins, defects within the bins based on diversity in a second set of one or more second attributes of the defects. The selected defects are then used to create a defect sample for the wafer. In this manner, defects having diverse values of multiple attributes can be easily selected.

    Abstract translation: 提供了用于生成晶片缺陷样品的方法和系统。 一种方法包括将在晶片上检测到的缺陷分离成具有缺陷的一个或多个第一属性的第一组的值的多样性的箱。 该方法还包括基于缺陷的一个或多个第二属性的第二组中的多样性来独立于从一个或多个箱中选择箱内的缺陷。 然后使用所选择的缺陷来为晶片创建缺陷样品。 以这种方式，可以容易地选择具有多个属性的不同值的缺陷。

    Wafer defect discovery
    50.
    发明授权
    Wafer defect discovery 有权
    晶圆缺陷发现

    公开(公告)号：US09518934B2

    公开(公告)日：2016-12-13

    申请号：US14931226

    申请日：2015-11-03

    Applicant: KLA-Tencor Corporation

    Inventor： Hong Chen ,  Kenong Wu ,  Martin Plihal ,  Vidur Pandita ,  Ravikumar Sanapala ,  Vivek Bhagat ,  Rahul Lakhawat ,  Oksen Baris ,  Rajesh Ramachandran ,  Naoshin Haque

    IPC: G01N21/00 ,  G01N21/95 ,  G01N21/88 ,  G03F7/20

    CPC classification number: H01J37/28 ,  G01N21/8851 ,  G01N21/9501 ,  G01N2021/8854 ,  G01N2021/8883 ,  G03F7/70625 ,  G03F7/7065 ,  H01J2237/24592

    Abstract: Systems and methods for discovering defects on a wafer are provided. One method includes detecting defects on a wafer by applying a threshold to output generated by a detector in a first scan of the wafer and determining values for features of the detected defects. The method also includes automatically ranking the features, identifying feature cut-lines to group the defect into bins, and, for each of the bins, determining one or more parameters that if applied to the values for the features of the defects in each of the bins will result in a predetermined number of the defects in each of the bins. The method also includes applying the one or more determined parameters to the output generated by the detector in a second scan of the wafer to generate a defect population that has a predetermined defect count and is diversified in the values for the features.

    Abstract translation: 提供了发现晶片缺陷的系统和方法。 一种方法包括通过在晶片的第一次扫描中施加由检测器产生的输出的阈值来检测晶片上的缺陷，并确定检测到的缺陷的特征的值。 该方法还包括对特征进行自动排序，识别特征切割线以将缺陷分组成箱，并且对于每个箱，确定一个或多个参数，如果应用于每个中的缺陷的特征的值 箱将导致每个箱中预定数量的缺陷。 该方法还包括将一个或多个确定的参数应用于在晶片的第二次扫描中由检测器产生的输出，以产生具有预定缺陷计数并且在特征值中多样化的缺陷群体。

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