公开(公告)号：US09715725B2

公开(公告)日：2017-07-25

申请号：US14563845

申请日：2014-12-08

Applicant: KLA-Tencor Corporation

Inventor： Yong Zhang ,  Tao Luo ,  Chaohong Wu ,  Stephanie Chen ,  Lisheng Gao

IPC: G06K9/46 ,  G06T7/00 ,  G06T7/33

CPC classification number: G06T7/001 ,  G06T7/33 ,  G06T2207/30148

Abstract: Methods and systems for detecting defects on a wafer are provided. One method includes altering one or more design clips based on how the one or more design clips will appear in output generated by a wafer inspection process for a wafer. The method also includes aligning the one or more altered design clips to the output generated for the wafer during the wafer inspection process. In addition, the method includes detecting defects on the wafer based on the output aligned to the one or more altered design clips.

公开(公告)号：US20150178907A1

公开(公告)日：2015-06-25

申请号：US14563845

申请日：2014-12-08

Applicant: KLA-Tencor Corporation

Inventor： Yong Zhang ,  Tao Luo ,  Chaohong Wu ,  Stephanie Chen ,  Lisheng Gao

IPC: G06T7/00

CPC classification number: G06T7/001 ,  G06T7/33 ,  G06T2207/30148

Abstract: Methods and systems for detecting defects on a wafer are provided. One method includes altering one or more design clips based on how the one or more design clips will appear in output generated by a wafer inspection process for a wafer. The method also includes aligning the one or more altered design clips to the output generated for the wafer during the wafer inspection process. In addition, the method includes detecting defects on the wafer based on the output aligned to the one or more altered design clips.

Abstract translation: 提供了用于检测晶片上的缺陷的方法和系统。 一种方法包括基于如何将一个或多个设计剪辑出现在由晶片的晶片检查过程产生的输出中来改变一个或多个设计剪辑。 该方法还包括在晶片检查过程中将一个或多个改变的设计剪辑与晶片产生的输出对准。 此外，该方法包括基于与一个或多个改变的设计剪辑对准的输出来检测晶片上的缺陷。