公开(公告)号：US20130188859A1

公开(公告)日：2013-07-25

申请号：US13742259

申请日：2013-01-15

Applicant: KLA-Tencor Corporation

Inventor： Tao Luo ,  Yong Zhang ,  Stephanie Chen

IPC: G06T7/00

CPC classification number: G06T7/0002 ,  G06T7/0004 ,  G06T7/13 ,  G06T7/143 ,  G06T2207/20076 ,  G06T2207/30148

Abstract: Methods and systems for segmenting pixels for wafer inspection are provided. One method includes determining a statistic for individual pixels based on a characteristic of the individual pixels in an image acquired for a wafer by an inspection system. The method also includes assigning the individual pixels to first segments based on the statistic. In addition, the method includes detecting one or more edges between the first segments in an image of the first segments and generating an edge map by projecting the one or more edges across an area corresponding to the image for the wafer. The method further includes assigning the individual pixels to second segments by applying the first segments and the edge map to the image for the wafer thereby segmenting the image. Defect detection is performed based on the second segments to which the individual pixels are assigned.

Abstract translation: 提供了用于分割用于晶片检查的像素的方法和系统。 一种方法包括基于由检查系统为晶片获取的图像中的各个像素的特性来确定各个像素的统计量。 该方法还包括基于统计量将各个像素分配给第一段。 此外，该方法包括检测第一段的图像中的第一段之间的一个或多个边缘，并且通过将一个或多个边缘跨越与晶片的图像对应的区域来生成边缘图。 该方法还包括通过将第一段和边缘图应用于晶片的图像来将各个像素分配给第二段，从而分割图像。 基于分配了各个像素的第二段执行缺陷检测。

公开(公告)号：US20150178907A1

公开(公告)日：2015-06-25

申请号：US14563845

申请日：2014-12-08

Applicant: KLA-Tencor Corporation

Inventor： Yong Zhang ,  Tao Luo ,  Chaohong Wu ,  Stephanie Chen ,  Lisheng Gao

IPC: G06T7/00

CPC classification number: G06T7/001 ,  G06T7/33 ,  G06T2207/30148

Abstract: Methods and systems for detecting defects on a wafer are provided. One method includes altering one or more design clips based on how the one or more design clips will appear in output generated by a wafer inspection process for a wafer. The method also includes aligning the one or more altered design clips to the output generated for the wafer during the wafer inspection process. In addition, the method includes detecting defects on the wafer based on the output aligned to the one or more altered design clips.

Abstract translation: 提供了用于检测晶片上的缺陷的方法和系统。 一种方法包括基于如何将一个或多个设计剪辑出现在由晶片的晶片检查过程产生的输出中来改变一个或多个设计剪辑。 该方法还包括在晶片检查过程中将一个或多个改变的设计剪辑与晶片产生的输出对准。 此外，该方法包括基于与一个或多个改变的设计剪辑对准的输出来检测晶片上的缺陷。

公开(公告)号：US09715725B2

公开(公告)日：2017-07-25

申请号：US14563845

申请日：2014-12-08

Applicant: KLA-Tencor Corporation

Inventor： Yong Zhang ,  Tao Luo ,  Chaohong Wu ,  Stephanie Chen ,  Lisheng Gao

IPC: G06K9/46 ,  G06T7/00 ,  G06T7/33

CPC classification number: G06T7/001 ,  G06T7/33 ,  G06T2207/30148

Abstract: Methods and systems for detecting defects on a wafer are provided. One method includes altering one or more design clips based on how the one or more design clips will appear in output generated by a wafer inspection process for a wafer. The method also includes aligning the one or more altered design clips to the output generated for the wafer during the wafer inspection process. In addition, the method includes detecting defects on the wafer based on the output aligned to the one or more altered design clips.

公开(公告)号：US08831334B2

公开(公告)日：2014-09-09

申请号：US13742259

申请日：2013-01-15

Applicant: KLA-Tencor Corporation

Inventor： Tao Luo ,  Yong Zhang ,  Stephanie Chen

IPC: G06T7/00

CPC classification number: G06T7/0002 ,  G06T7/0004 ,  G06T7/13 ,  G06T7/143 ,  G06T2207/20076 ,  G06T2207/30148

Abstract: Methods and systems for segmenting pixels for wafer inspection are provided. One method includes determining a statistic for individual pixels based on a characteristic of the individual pixels in an image acquired for a wafer by an inspection system. The method also includes assigning the individual pixels to first segments based on the statistic. In addition, the method includes detecting one or more edges between the first segments in an image of the first segments and generating an edge map by projecting the one or more edges across an area corresponding to the image for the wafer. The method further includes assigning the individual pixels to second segments by applying the first segments and the edge map to the image for the wafer thereby segmenting the image. Defect detection is performed based on the second segments to which the individual pixels are assigned.

Abstract translation: 提供了用于分割用于晶片检查的像素的方法和系统。 一种方法包括基于由检查系统为晶片获取的图像中的各个像素的特性来确定各个像素的统计量。 该方法还包括基于统计量将各个像素分配给第一段。 此外，该方法包括检测第一段的图像中的第一段之间的一个或多个边缘，并且通过将一个或多个边缘跨越与晶片的图像对应的区域来生成边缘图。 该方法还包括通过将第一段和边缘图应用于晶片的图像来将各个像素分配给第二段，从而分割图像。 基于分配了各个像素的第二段执行缺陷检测。