公开(公告)号：US20190277776A1

公开(公告)日：2019-09-12

申请号：US16295999

申请日：2019-03-07

Applicant: KLA-Tencor Corporation

Inventor： Dhiraj Ramesh Gawhane

IPC: G01N21/95 ,  G01R31/3185 ,  G01R31/317 ,  G01R31/302

Abstract: Systems and methods for detecting programmed defects on a water during inspection of the wafer are provided. One method includes selecting a mode of an inspection subsystem for detecting programmed defects on a wafer that generates output for the wafer having the lowest non-defect signal and at least a minimum signal for the programmed defects. The method also includes selecting a training care area that is mutually exclusive of care area(s) used for detecting the programmed defects during inspection of the wafer. The training care area generates less of the non-defect signal than the care area(s). The method further includes training a programmed defect detection method using the output generated with the selected mode in the training care area and detecting the programmed defects during the inspection of the wafer by applying the trained programmed defect detection method to the output generated in the care area(s) with the selected mode.

公开(公告)号：US10677742B2

公开(公告)日：2020-06-09

申请号：US16295999

申请日：2019-03-07

Applicant: KLA-Tencor Corporation

Inventor： Dhiraj Ramesh Gawhane

IPC: G01N21/95 ,  G01R31/3185 ,  G01R31/317 ,  G01R31/302 ,  G01N21/88

Abstract: Systems and methods for detecting programmed defects on a water during inspection of the wafer are provided. One method includes selecting a mode of an inspection subsystem for detecting programmed defects on a wafer that generates output for the wafer having the lowest non-defect signal and at least a minimum signal for the programmed defects. The method also includes selecting a training care area that is mutually exclusive of care area(s) used for detecting the programmed defects during inspection of the wafer. The training care area generates less of the non-defect signal than the care area(s). The method further includes training a programmed defect detection method using the output generated with the selected mode in the training care area and detecting the programmed defects during the inspection of the wafer by applying the trained programmed defect detection method to the output generated in the care area(s) with the selected mode.